Reliability Qualification Report SGL-0622Z - Matte Sn, RoHS Compliant The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Data subject to change. 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105266 Rev.A 1 SGL-0622Z Reliability Qualification Report I. Qualification Overview The SGL-0622Z product has been qualified by similarity to a qualification vehicle that passed all qualification testing in our product qualification test plan. Stresses such as operating life, humidity (autoclave), extreme hot and cold environments (temperature cycling), and moisture sensitivity (MSL-1 and solder reflow testing) were performed with satisfactory results. II. Introduction The SGL-0622Z is a low power, high gain, fully matched LNA designed for 0.1 – 4GHz operation. This LNA is designed for low power, 2.7 to 3.6V battery operation. This amplifier is fully matched and requires only 4-5 external components to achieve 28.5 dB gain at 1.575GHz and a noise figure of 1.45dB. III. Fabrication Technology These amplifiers are manufactured using a Silicon Germanium Heterojunction Bipolar Transistor (HBT) technology. This patented self-aligned emitter, double poly HBT process has been in production by our foundry since 1998. The process has been successfully used for a wide range of RFIC products including GSM PAs, DECT front end transceivers, LNAs & VCOs. This process offers comparable performance to GaAs HBTs with the added advantages of mature and high producible Silicon wafer processing. IV. Package Type The SGL-0622Z is packaged in a plastic encapsulated 2mm X 2mm Quad Flat Pack NoLead (QFN) package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. Figure 1: 2mm X 2mm QFN Encapsulated Plastic Package 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105266 Rev.A SGL-0622Z Reliability Qualification Report V. Qualification Methodology The Sirenza Microdevices qualification process consists of a series of tests designed to stress various potential failure mechanisms. This testing is performed to ensure that Sirenza Microdevices products are robust against potential failure modes that could arise from the various die and package failure mechanisms stressed. The qualification testing is based on JEDEC test methods common to the semiconductor industry. A FMEA approach is used to determine the test methods to be included in the qualification plan. VI. Qualification By Similarity A product can be qualified by similarity using a qualification vehicle provided that no new potential failure modes/mechanisms are possible in the product. The SGL-0622Z is qualified using a qualification vehicle that is manufactured with the same technology and assembly processes. VII. Operational Life Testing Sirenza Microdevices defines operational life testing as a DC biased elevated temperature test performed at the maximum junction temperature limit. For the qualification vehicle and the SGL-0622Z, the maximum operational junction temperature limit is 150oC. The purpose of the operational life test is to statistically show that the product operated at its maximum operational ratings will be reliable by operating devices up of 1000 hours. The results for this test are expressed in device hours that are calculated by multiplying the total number of devices passing the test by the number of hours tested. VIII. Moisture Sensitivity Level - MSL Level 1 Device The qualification vehicle successfully completed 168 hours of moisture soak (85oC/85%RH), followed by three passes through a convection reflow oven at 270oC. The successful completion of this test classifies the SGL-0622Z as JESD 22-A113B Moisture Sensitivity Level 1 (MSL-1). MSL-1 indicates that no special dry pack requirements or time limits from opening of static bag to reflow exist for the SGL-0622Z. MSL-1 is highest level of moisture resistance that a device can be classified according to the above mentioned standard. 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105266 Rev.A SGL-0622Z Reliability Qualification Report IX. Electrostatic Discharge Classification Sirenza Microdevices classifies Human Body Model (HBM) electrostatic discharge (ESD) according to the JESD22-A114 convention. All pin pair combinations were tested on the SGL-0622Z. Each pin pair is stressed at one static voltage level using 1 positive and 1 negative pulse polarity to determine the weakest pin pair combination. The weakest pin pair is tested with 3 devices below and above the failure voltage to classify the part. The Pass/Fail status of a part is determined by the manufacturing test specification. The ESD class quoted indicates that the device passed exposure to a certain voltage, but does not pass the next higher level. The following table indicates the JESD ESD sensitivity classification levels. Class Passes Fails 0 1A 1B 1C 2 0V 250 V 500 V 1000 V 2000 V <250 V 500 V 1000 V 2000 V 4000 V Part SGL-0622Z Class 1C X. Operational Life Testing (Qualification vehicle) Test Duration Junction Temperature Quantity Device Hours 1000 hours 150°C 160 160,000 Summary of High Temperature Operational Life Test Cumulative Device Hours 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105266 Rev.A SGL-0622Z Reliability Qualification Report XI. Qualification Vehicle Test Results Group Test Name Test Condition/ Standard Sample Size Results 340 Pass Preconditioning MSL1 Reflow @ 270oC Peak JESD22-A113C 32 Pass Temperature Cycling Air to Air, Soldered on PCB -65oC to 150oC 10 min dwell, 1 min transition 1000 cycles JESD22-A104B 38 Pass A1 Temperature Cycle -65°C to +150°C 10 min dwell, 1 min transition 1000 cycles JESD22-A104B High Temperature Operating Life Tj = 150°C 1000 hours JESD22-A108B 160 Pass A2 Pass HAST Tamb=110°C, 85%RH Biased, 264 hours JESD22-A110B 15 B Pass Autoclave Tamb=121°C, 100%RH Un-Biased, 96 hours JESD22-A102C 40 C A0 A1a 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105266 Rev.A SGL-0622Z Reliability Qualification Report XII. Qualification Vehicle Test Results (cont) Test Name Test Condition/ Standard D Sample Size Results 20 Pass Power Temperature Cycle -40°C to +85°C Cycled bias (5’ on/5’off) 1000 cycles JESD22-A109A High Temperature Storage Tamb=150°C 1000 hours JESD22-A103B 20 Pass E E2 Low Temperature Storage Tamb=-40°C 1000 hours 20 Pass 10 Pass Tin Whisker Tamb=60°C, 90%RH 2000 hours NEMI Dip & Look Sn63/Pb37 solder Steam Age Condition C Dip Condition A, 215°C JESD22-B102C 15 Pass Dip & Look Sn/Ag/Cu solder Steam Age Condition C Dip Condition B, 245°C JESD22-B102C 45 Pass Group F G Solderability 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105266 Rev.A XIII. Junction Temperature Determination One key issue in performing qualification testing is to accurately determine the junction temperature of the device. Sirenza Microdevices uses a 3um spot size emissivity corrected infrared camera measurement to resolve the surface temperature of the device at the maximum operational power dissipation. The results are displayed below for the SGL-0622Z device running at operational current of Id=12mA, a device voltage of 3.3V, lead temperature of 85°C. Tj=90.7°C Figure 2: Infrared Thermal Image of SGL-0622Z, Vbias= 3.3V, Id = 12mA, Tlead = 85°C 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105266 Rev.A