RF3183 - RFMD.com

RF3183
QUAD-BAND/GSM850/EGSM900
/DCS/PCS/POWER AMPLIFIER MODULE
Package Style: Module (5mmx5mmx1mm)
DCS RFIN 1
10 DCS RFOUT
BAND SEL 2
Features




TX EN 3
Typical GMSK Efficiency
GSM850/900 48/53%
DCS/PCS 50/53%
Integrated Power
Control
VBATT 4
Auto VBATT Tracking Circuit avoids
Switching Transients at Low
Supply Voltage
Integrated Power Flattening
Circuit Reduces Power and
Current into Mismatch
GND 5
VRAMP 6
GSM RFIN 7
Integrated VRAMP Rejection Filter
Eliminates External Components
9 GSM RFOUT
GND 8
Applications
Functional Block Diagram

Quad-Band GSM Handsets

GSM Transmitter Line-ups




Portable Battery-Powered
Equipment
GSM850/EGSM900/DCS/
PCS Products
GPRS Class 12 Compatible
Products
Mobile EDGE/GPRS Data
Products
Product Description
The RF3183 is a high power amplifier module with integrated power control. The input and output terminals are internally matched to 50. The amplifier devices are manufactured on an
advanced Gallium Arsenide Heterojunction Bipolar Transistor (GaAs HBT) process. The module
is designed to be the final amplification stage in a dual-mode GSM/EDGE mobile transmit
lineup operating in the 824MHz to 915MHz (low) and 1710MHz to 1910MHz (high) bands
(such as a cellular handset). Band selection is controlled by an input on the module which
selects either the low or high band. The device is packaged on a 5mmx5mm laminate module
with a protective plastic over-mold. The RF3183 features RFMD’s latest integrated power flattening circuit, which significantly reduces current and power variation into load mismatch. The
RF3183 provides excellent ESD protection at all the pins. The RF3183 also provides integrated
VRAMP rejection filter which improves noise performance and transient spectrum.
Ordering Information
RF3183Quad-Band/GSM850/EGSM900 /DCS/PCS/Power Amplifier Module
RF3183
RF3183PCBA-41X
GaAs HBT
GaAs MESFET
InGaP HBT
Quad-Band/GSM850/EGSM900 /DCS/PCS/Power Amplifier
Module
Power Amplifier Module, 5 Piece Sample Pack
Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
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RF3183
Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage (VBATT)
-0.5 to +6.0
V
Power Control Voltage (VRAMP)
-0.5 to +3.0
V
Band Select
3.0
V
TX Enable
3.0
V
RF - Input Power
10.0
dBm
50
%
Max Duty Cycle
Output Load VSWR
10:1
Operating Temperature
-30 to +85
°C
Storage Temperature
-55 to +150
°C
Parameter
Min.
Specification
Typ.
Max.
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Unit
Condition
Recommended Operating
Conditions
VRAMP
VRAMP Input Current
40
VRAMP =VRAMP, MAX
VRAMP =VRAMP, MIN
2.2
0.25
A
VRAMP =VRAMP,MAX
V
V
Band Select Switch
BAND_SEL “HIGH”
1.5
V
High Band (DCS1800/PCS1900)
BAND_SEL “LOW”
0
0.7
V
Low Band (GSM850/EGSM900)
BAND_SEL Input Current
1
+10
uA
TX_EN
TX_EN “HIGH”
1.5
V
PA “ON”
TX_EN “LOW”
0
0.7
V
PA “OFF”
TX_EN Input Current
1
+10
uA
Overall Power Supply
VBATT Range
3.0
3.6
Off Current
4.5
V
10
uA
TX_EN Low
RF Impedance
LB_RF IN
50

LB_RF OUT
50

HB_RF IN
50

HB_RF OUT
50

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DS100412
RF3183
Parameter
Min.
Specification
Typ.
Max.
Unit
Condition
Nominal test conditions unless otherwise
stated. Temp=25 °C, VBATT =3.6V,
Freq=824MHz to 849MHz, 25% Duty Cycle,
Pulse Width=1154s, PIN =-2dBm,
BAND_SEL=“Low”, TX_EN=“High”,
VRAMP =VRAMP,MAX
Cellular 850MHz Band
GMSK Mode
Operating Frequency Range
824
849
MHz
+4
dBm
-2
+1
Maximum Output Power 1
34.5
35.0
dBm
Temp=25 °C, VBATT =3.6V
Maximum Output Power 2
32.5
33
dBm
Temp=85 °C, VBATT =3.0V
Input Power Range, PIN
Total Efficiency (PAE)
42
Output Noise Power
48
-83
Forward Isolation 1
Forward Isolation 2
%
PIN =+1dBm
-82
dBm
869MHz to 894MHz, f0 =849MHz,
POUT <Rated POUT, RBW=100kHz
-32
dBm
TX_EN=0V, VRAMP=VRAMP,MIN,
PIN =+4dBm
-10
dBm
VRAMP =VRAMP,MIN, PIN =+4dBm
2f0 Harmonics
-15
-10
dBm
POUT <Rated POUT
3f0 Harmonics
-25
-15
dBm
POUT <Rated POUT
Fundamental Cross Band Coupling
-1
3
dBm
Measured at DCS_RFOUT pin,
POUT <Rated POUT at GSM_RFOUT pin
2f0, 3f0 Cross Band Coupling
-22
-17
dBm
Measured at DCS_RFOUT pin,
POUT <Rated POUT at GSM_RFOUT pin
-36
dBm
Over PIN range, POUT <Rated POUT
2:1
3:1
dBm
Load VSWR=5.1 All phase angles, Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to VSWR=5:1, Full PIN Range,
RBW=3MHz, no oscillations
All Other Non-harmonic Spurious
Input VSWR
Output Load VSWR Stability
Output Load VSWR Ruggedness
-36
No damage or permanent degradation to
device
Load VSWR=10:1, all phase angles. Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to VSWR=10:1
Note: VRAMP,MAX =2.2V, VRAMP,MIN =0.25V, Rated POUT =34.5dBm
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RF3183
Parameter
Min.
Specification
Typ.
Max.
Unit
Condition
Nominal test conditions unless otherwise
stated. Temp=25 °C, VBATT =3.6V,
Freq=880MHz to 915MHz, 25% Duty Cycle,
Pulse Width=1154s, PIN =-2dBm,
BAND_SEL=“Low”, TX_EN=“High”,
VRAMP =VRAMP,MAX
EGSM 900MHz Band
GMSK Mode
Operating Frequency Range
880
915
MHz
+4
dBm
-2
+1
Maximum Output Power 1
34.5
35
dBm
Temp=25°C, VBATT =3.6V
Maximum Output Power 2
32.5
33
dBm
Temp=+85°C, VBATT =3.0V
Input Power Range, PIN
Total Efficiency (PAE)
47
Output Noise Power
53
%
PIN =+1dBm
-80
-79
dBm
925MHz to 935MHz, f0 =915MHz,
POUT <Rated POUT, RBW=100kHz
-83
-82
dBm
935MHz to 960MHz, f0 =915MHz,
POUT <Rated POUT, RBW=100kHz
Forward Isolation 1
-32
dBm
TX_EN=0V, VRAMP =VRAMP,MIN,
PIN =+4dBm
Forward Isolation 2
-10
dBm
VRAMP =VRAMP,MIN, PIN =+4dBm
2f0 Harmonics
-15
-10
dBm
POUT <Rated POUT
3f0 Harmonics
-25
-15
dBm
POUT <Rated POUT
-1
3
dBm
Measured at DCS_RFOUT pin,
POUT <Rated POUT at GSM_RFOUT pin
-22
-17
dBm
Measured at DCS_RFOUT pin,
POUT <Rated POUT at GSM_RFOUT pin
-36
dBm
Over PIN range, POUT <Rated POUT
dBm
Load VSWR=5:1 All phase angles. Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to 5:1 VSWR. Full PIN Range,
RBW=3MHz, no oscillations
Fundamental Cross Band Coupling
2f0, 3f0 Cross Band Coupling
All Other Non-harmonic Spurious
Input VSWR
2:1
Output Load VSWR Stability
Output Load VSWR Ruggedness
3:1
-36
No damage or permanent degradation to
device
Load VSWR=10:1 All phase angles, Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to VSWR=10:1
Note: VRAMP,MAX =2.2V, VRAMP,MIN =0.25V, Rated POUT =34.5dBm
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DS100412
RF3183
Parameter
Min.
Specification
Typ.
Max.
Unit
Nominal test conditions unless otherwise
stated. Temp=25 °C, VBATT =3.6V,
Freq=1710MHz to 1785MHz, 25% Duty Cycle,
Pulse Width=1154s, PIN =-2dBm,
BAND_SEL=“High”, TX_EN=“High”,
VRAMP =VRAMP,MAX
DCS 1800MHz Band
GMSK Mode
Operating Frequency Range
Input Power Range, PIN
Condition
1710
-2
+1
1785
MHz
+4
dBm
Maximum Output Power 1
32.0
33
dBm
Temp=25°C, VBATT =3.6V
Maximum Output Power 2
30
31
dBm
Temp=+85oC, VBATT =3.0V
Total Efficiency (PAE)
43
50
%
Output Noise Power
-81
PIN =+1dBm
-77
dBm
1805MHz to 1880MHz, f0 =1785MHz,
POUT <Rated POUT, RBW=100KHz
Forward Isolation 1
-32
dBm
TX_EN=0V, VRAMP =VRAMP,MIN,
PIN =+4dBm
Forward Isolation 2
-10
dBm
VRAMP =VRAMP,MIN, PIN =+4dBm
2f0 Harmonics
-20
-10
dBm
POUT <Rated POUT
3f0 Harmonics
-25
-15
dBm
POUT <Rated POUT
-36
dBm
Over PIN range, POUT <Rated POUT
2:1
3:1
dBm
Load VSWR=5:1 All phase angles, Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to VSWR=5:1, Full PIN Range,
RBW=3MHz, no oscillations
All Other Non-harmonic Spurious
Input VSWR
Output Load VSWR Stability
Output Load VSWR Ruggedness
-36
No damage or permanent degradation to
device
Load VSWR=10:1 All phase angles Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to VSWR=10:1
Note: VRAMP,MAX =2.2V, VRAMP,MIN =0.25V, Rated POUT =32.0dBm
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RF3183
Parameter
Min.
Specification
Typ.
Max.
Unit
Nominal test conditions unless otherwise
stated. Temp=25 °C, VBATT =3.6V,
Freq=1850MHz to 1910MHz, 25% Duty Cycle,
Pulse Width=1154s, PIN =-2dBm,
BAND_SEL=“High”, TX_EN=“High”,
VRAMP =VRAMP,MAX
PCS 1900MHz Band
GMSK Mode
Operating Frequency Range
Input Power Range, PIN
Condition
1850
-2
+1
1910
MHz
+4
dBm
Maximum Output Power 1
32.0
33
dBm
Temp=25°C, VBATT =3.6V
Maximum Output Power 2
30
31
dBm
Temp=+85oC, VBATT =3.0V
Total Efficiency (PAE)
45
53
%
Output Noise Power
-81
PIN =+1dBm
-77
dBm
1930MHz to 1990MHz, f0 =1910MHz,
POUT <Rated POUT, RBW=100kHz
Forward Isolation 1
-32
dBm
TX_EN=0V, VRAMP =VRAMP,MIN,
PIN =+4dBm
Forward Isolation 2
-10
dBm
VRAMP =VRAMP,MIN, PIN =+4dBm
2f0 Harmonics
-20
-10
dBm
POUT <Rated POUT
3f0 Harmonics
-25
-15
dBm
POUT <Rated POUT
-36
dBm
Over PIN range, POUT <32dBm
2:1
3:1
dBm
Load VSWR=5:1 All phase angles, Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to VSWR=5:1, Full PIN Range,
RBW=3MHz, no oscillations
All Other Non-harmonic Spurious
Input VSWR
Output Load VSWR Stability
Output Load VSWR Ruggedness
-36
No damage or permanent degradation to
device
Load VSWR=10:1 All phase angles, Set VRAMP
where POUT <Rated POUT into 50 load, then
load switched to VSWR=10:1
Note: VRAMP,MAX =2.2V, VRAMP,MIN =0.25V, Rated POUT =32.0dBm
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DS100412
RF3183
Pin
1
2
Function
DCS_RFIN
BANDSEL
3
TX_EN
4
VBATT
5
6
GND
VRAMP
7
8
9
10
11
GSMIN
GND
GSMOUT
DCSOUT
GND
Description
RF input to the high-band PA. It is DC-blocked within the part.
Digital input enables either the low band or high band amplifier die within the module. A logic low selects Low
Band (GSM850/EGSM900), a logic high selects High Band (DCS1800/PCS1900). This pin is a high impedance CMOS input with no pull-up or pull-down resistors.
Digital input enables or disables the internal circuitry. When disabled, the module is in the OFF state, and
draws virtually zero current. This pin is a high impedance CMOS input with no pull-up or pull-down resistors.
Main DC power supply for all circuitry in the RF3183. Traces to this pin will have high current pulses during
operation so proper decoupling and routing should be observed.
Ground.
Analog signal used to control the output power. The signal also ramps the output power up and down. An internal 300kHz filter reduces switching ORFS resulting from transitions between DAC steps. Most systems will
have no need for external VRAMP filtering. This pin provides an impedance of approximately 60k.
RF input to the low-band PA. It is DC-blocked within the part.
Ground.
RF output from the low-band PA. It is DC-blocked within the part.
RF output from the high-band PA. It is DC-blocked within the part.
Main ground pad in center of part. This pad should be tied to the main ground plane with as little loss as possible for optimum linearity.
Pin Out
Top View
DS100412
DCS IN
1
BAND SELECT
2
TX EN
3
VBATT
4
GND
5
VRAMP
6
GSM IN
7
GND
8
10
DCS OUT
9
GSM OUT
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RF3183
Theory of Operation
VBATT
TX_EN
VRAMP
H(s)
RF IN
RF OUT
TX_EN
AGC Amplifier
Figure 1. RF3183 Power Amplifier Simplified Block Diagram of a Single Band
Overview
The RF3183 is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS handheld digital cellular equipment, and other applications operating in the 824MHz to 915MHz, and 1710MHz to 1910MHz bands. The RF3183 is a high
power, power amplifier module with PowerStar® integrated power control. The integrated power control circuitry provides reliable control of saturated power by a single analog voltage (VRAMP). This control voltage can be driven directly from a DAC output. PowerStar®’s predictable power versus VRAMP relationship allows single-point calibration in each band. Single-point
calibration enables handset manufacturers to achieve simple and efficient phone calibration in production.
The RF3183 also features an integrated saturation detection circuit, which is an industry first for standard PA module products. The saturation detection circuit automatically monitors battery voltage, and adjusts the power control loop to reduce transient spectrum degradation that would otherwise occur at low battery voltage conditions. Prior to the implementation of the
saturation detection circuit, handset designers were required to adjust the ramp voltage within the system software. RFMD’s
saturation detection circuit reduces handset design time and ensures robust performance over broad operating conditions.
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DS100412
RF3183
Power and Current Into Mismatch
Transmitters are often designed to operate only under perfect 50 loads. In the real application when a PA is subjected to
mismatch conditions, performance degrades most likely in a reduction of output power, increased harmonic levels, increased
transient spectrum, and catastrophic failures.
RF3183 has an integrated power flattening circuit that reduces the amount of current variation under load mismatch. When a
mismatch is presented to the output of the PA, its output impedance is varied and could present a load that will increase output power. As the output power increases, so does current consumption. The current consumption can become very high if not
monitored and limited. The power-flattening circuit is integrated onto the CMOS controller and requires no input from the user.
Into a mismatch, current varies as phase changes. The power-flattening circuit monitors current through an internal sense
resistor. As current changes, the loop is adjusted in order to maintain current. Under nominal conditions, this loop is not activated and is seemingly transparent. The result is flatter power and reduced current into mismatch as shown in the following figures.
Test Condition: VBATT =3.6V, RFIN =1dBm, Temperature=25°C, Tx Frequency=915MHz
35.00
2644.01
2644.02
34.50
2644.03
2644.04
34.00
2644.05
2644.06
33.50
2644.07
2644.08
Delivered Power in 33.00
dBm
2644.09
2644.10
2644.11
32.50
2644.12
2644.13
2644.14
32.00
2644.15
2644.21
31.50
2644.22
2644.23
31.00
2644.24
0
30
60
90
120
150
180
210
240
270
300
330
2644.25
Phase Angle
Figure 2. RF3183 Power Variation Under Mismatch VSWR 3:1
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RF3183
Test Condition: VBATT =3.6V, RFIN =1dBm, Temperature=25°C, Tx Frequency=915MHz
2500.00
2400.00
2644.01
2300.00
2644.02
2200.00
2644.03
2100.00
2644.04
2000.00
2644.05
1900.00
2644.06
1800.00
2644.07
2644.08
Icc in 1700.00
mA 1600.00
2644.09
2644.10
1500.00
2644.11
1400.00
2644.12
1300.00
2644.13
1200.00
2644.15
1100.00
2644.21
1000.00
2644.22
900.00
2644.23
2644.24
800.00
0
30
60
90
120
150
180
210
240
270
300
330
2644.25
Phase Angle
Figure 3. RF3183 Current Variation Under Mismatch VSWR 3:1
RF3183 operates as a traditional PowerStar® module. The incorporated control loop regulates the collector voltage of the
amplifiers while the stages are held at a constant bias. The basic circuit diagram is shown in Figure 2.
VBATT
3 dB BW
300 kHz
-
VRAMP
+
-
Saturation
Detector
+
H(s)
RF IN
VCC
RF OUT
TX ENABLE
Figure 4. RF3183 Basic Circuit
By regulating the collector voltage (VCC), the stages are held in saturation across all power levels. As VCC is decreased, output
power decreases as described by Equation 1. The equation shows that load impedance affects output power, but to a lesser
degree than VCC supply variations. Since the RF3183 regulates VCC, the dominant cause of power variation is eliminated.
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DS100412
RF3183
2
P OUT
dBm
 2  V CC – V SAT 
(Eq. 1)
= 10 log ------------------------------------------–3
8  R1  10
RF3183 power is ramped up and down through the VRAMP control voltage which in turn controls the collector voltage of the
amplifier stages. The RF signal applied at the RFIN pin must be a constant amplitude signal and should be high enough to saturate the amplifier in the GSM mode. The input power (PIN) range is indicated in the specifications. Power levels below this
range will result in reduced maximum output power and the potential for more variation of output power over extreme conditions. Higher input power is unnecessary and will require more current in the circuitry driving the power amplifier and will
increase the minimum output power of the RF3183.
The saturation detector circuit monitors the VBATT and VCC voltages and adjusts the power control loop to prevent the seriespass FET regulator from entering saturation. If the VCC regulator were to saturate, the response time would increase dramatically. This is undesirable because the VCC regulator must accurately follow the burst ramp up or ramp down applied to the
VRAMP pin, or the transient spectrum will degrade.
Power Ramping and Timing
The RF3183 should be powered on according to the Power-On Sequence provided in the datasheet. The power on sequence is
designed to prevent operation of the amplifier under conditions that could cause damage to the device or erratic operation.
In the Power-On Sequence, there are some set-up times associated with the control signals of the RF3183. The most important
of these is the settling time between TXEN going high and when VRAMP can begin to increase. This time is often referred to as
the “pedestal” and is required so that the internal power control loop and bias circuitry can settle after being turned on. The
RF3183 requires at least 1.5µs or two quarter bit times for proper settling of the power control loop..
Figure 5. ETSI Time Mask for a Single GSM Time Slot
The VRAMP waveform used with the RF3183 must be created such that the output power falls into this power versus time mask.
The ability to ramp the RF output power to meet ETSI switching transient and time mask requirements partially depends upon
the predictability of output power versus VRAMP response of the power amplifier. The PowerStar® control in the RF3183 is very
capable of meeting switching transient requirements with the proper raised cosine waveform applied to the VRAMP input. The
ramping waveform on VRAMP must not start until after TX_EN is asserted. A ramp of about 12us is required to control switching
transients at high power levels.
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RF3183
The VRAMP voltage range should be limited to min and max values in the specifications to avoid damage or undesirable operation. At some voltage below 0.3V, the CMOS controller switches off and turns off the PA. The effect of this is a discontinuity in
the response curve. In order to guarantee minimum switching transients, it is recommended that the minimum ramp voltage
be set slightly above the voltage where this discontinuity occurs (See Figure 3). The VRAMP voltage at which the discontinuity
occurs is unique to the design of the part and does not shift significantly across process. Figure 7 shows the power versus
VRAMP response curve for five parts which represent typical process variation of the discontinuity
Test Condition: 824MHz, 3.6VBATT, 1dBm RFIN, 25°C Temp.
40.00
30.00
2644.01
2644.04
20.00
2644.06
2644.07
2644.08
10.00
2644.09
2644.10
0.00
2644.11
2644.12
‐10.00
2644.13
2644.14
‐20.00
2644.15
2644.21
2644.22
‐30.00
2644.23
2644.24
‐40.00
2644.25
‐50.00
Figure 6. RF3183 LB POUT versus VRAMP
As the VRAMP voltage approaches its maximum, the linear regulator in the CMOS saturates, the output power reaches its maximum level, and the VRAMP versus Output Power curve levels out. The saturation point of the linear regulator is directly proportional to the VBATT supply voltage applied. The VRAMP voltage can be increased above the saturation level, but the PA will not
produce any higher output power. It is not recommended to apply a VRAMP voltage above the absolute maximum specification,
as the part could be damaged.
When the FET pass-device in the linear regulator saturates, the response time of the regulated voltage slows significantly. If the
control voltage changes (as in ramp-down) the saturated linear regulator does not react fast enough to follow the ramp-down
curve. The result is a discontinuity in the output power ramp and degraded switching transients. This usually occurs at low
VBATT levels where the regulated VCC voltage is very near the supply voltage. The RF3183 incorporates a saturation detection
circuit which senses if the FET pass-device is entering saturation and reduces VCC to prevent it. This relieves the requirement of
the transceiver controller to adjust the maximum VRAMP when the battery voltage is low.
Design Considerations
There are several key factors to consider in the implementation of a mobile phone transmitter solution using the RF3183:
• System efficiency:
The RF output match can be designed to improve system efficiency by presenting a non 50 load. Output matching circuits for
the RF3183 should be a compromise between system efficiency and power.
• Power variation due to supply voltage:
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RF3183
Output power does not vary due to supply voltage under normal operating conditions. By regulating the collector voltage to the
PA the voltage sensitivity is essentially eliminated. This covers most cases where the PA will be operated. However, as the battery discharges and VBATT approaches its lower operating limit, the output power from the PA will start to drop. This cannot be
avoided as a certain supply voltage is required to produce full output power. System specifications must allow for this power
decrease.
Switching Transients due to low battery conditions are reduced by the saturation detection circuit in RF3183. The saturation
detection circuit consists of a feedback loop which detects FET saturation. As the FET approaches saturation, the circuit
adjusts the VCC voltage in order to ensure minimum switching transients. The saturation detection circuit is integrated into the
CMOS controller and requires no additional input from the user.
• Power variation due to temperature
RF3183 output power variation due to temperature is largest at low power levels and decreases at the upper power levels. This
follows the ETSI specification limits which allow a larger tolerance over extreme conditions at low power levels. Since output
power is controlled by an analog input, factors other than the power amplifier will have an effect on total system power variation. The entire system containing the RF3183 should be tested to determine whether compensation is necessary. At high temperatures and low battery voltages, the PA cannot support as high of an output power. In this condition, increasing VRAMP will
not provide more output power, so compensation may not provide the intended result.
• Noise Power
The bias point of the RF3183 is kept constant and the gain in the first stage is always high. This has the effect of maintaining a
consistent noise power which does not increase at reduced output power levels. For that reason, noise power is at its highest
when VRAMP is at its maximum. The RF3183 does not create enough noise in the receive band to cause system receive band
noise power failures, but it may amplify noise from other sources. Care must be taken to prevent noise from entering the power
amplifier.
• Loop Stability and Loop Bandwidth variation across power levels
The design of a proper power control loop involves trade-offs affecting stability, transient spectrum and burst timing. In nonPowerStar® architectures, backing off power causes gain variation which can affect loop bandwidth. In RF3183 the loop bandwidth is determined by VCC regulator bandwidth and does not change over output power. Loop stability is maintained since
amplifier bias voltage is constant.
• Transient Spectrum
Switching transients occur when the up and down power ramps are not smooth enough, or suddenly change shape. If the control slope of a PA has an inflection point within the output power control range, or if the slope is too steep, switching transients
will result. In RF3183 all stages are kept constantly biased and the output power is controlled by changing the collector voltage
according to Equation 1. Inflection points are eliminated by this design. In addition, the steepness of the power control slope is
reduced because VRAMP actively controls output power over a larger voltage range than many other power amplifiers.
• Harmonics
Harmonics are natural products of high efficiency, saturated power amplifiers. An ideal, class 'E', saturated power amplifier will
produce a perfect square wave. Looking at the Fourier transform of a square wave reveals high harmonic content. Although
this is common to all saturated power amplifiers, there are other factors that contribute to harmonic content as well. With
many power control methods, a peak power detector is used to rectify and sense forward power. Through the rectification process, there is additional squaring of the waveform resulting in higher harmonics. The RF3183 has no need for the detector
diode; therefore, the harmonics coming out of the PA should represent maximum power of the harmonics throughout the transmit chain. This is based on proper harmonic termination of the transmit port. The receive port termination on antenna switch
as well as the harmonic impedance from the switch itself will have an impact on harmonics. These terminations should be
adjusted to correct problems with harmonics.
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RF3183
GMSK Power On/Off Sequence
Power On Sequence:
3.2 Vto 4.5 V
VBATT
>1.5 VHigh Band
BAND_SEL
<0.7 V LowBand
>1.5 V PA ON
1. Apply VBATT
2. Apply BAND_SEL
3. Apply RFIN
4. Apply minimumVRAMP/VBIAS
(~0.25V)
5. Apply TX_EN
6. Ramp VRAMPfor desired output power
The Power Down Sequence is the reverse
order of the Power On Sequence.
TX_EN
2.2V for max POUT
VRAMP/VBIAS
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~0.25 Vfor min POUT
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RF3183
Application Schematic
DCS RFIN
1
10
DCS RFOUT
BAND SEL
2
TX EN
3
VBATT
Supply Bypass
Capacitor
DS100412
4
GND
5
VRAMP
6
GSM RFIN
7
GND
8
Integrated Power
Control
GSM RFOUT
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RF3183
Evaluation Board Schematic
50  strip
50  strip
DCS RFIN
1
BAND SEL
2
10
DCS OUT
TX EN
3
VBATT+
Integrated Power
Control
4
+
C1
68 F
11
GND
5
GND
R4
0
6
50  strip
0402
VRAMP
7
R5
DNI
0402
GSM RFIN
50  strip
9
GSM OUT
8
J2
Red Banana
Receptacle
J3
Black Banana
Receptacle
VBATT+
4 3 2 1
J1
4-pin Board-Edge
Header Block
BAND SEL
R1
100 k
0402
VMODE
R2
100 k
0402
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RF3183
Evaluation Board Layout
Board Size 2.0” x 2.0”
Board Thickness 0.046”, Board Material Rogers RO4003, Multi-Layer
RF3183410(1)
Package Drawing
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RF3183
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land and Solder Mask Pattern
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RF3183
PCB Stencil
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RF3183
Tape and Reel
Carrier tape basic dimensions are based on EIA 481. The pocket is designed to hold the part for shipping and loading onto SMT
manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. The individual pocket
design can vary from vendor to vendor, but width and pitch will be consistent.
Carrier tape is wound or placed onto a shipping reel either 330mm (13 inches) in diameter or 178mm (7 inches) in diameter.
The center hub design is large enough to ensure the radius formed by the carrier tape around it does not put unnecessary
stress on the parts.
Prior to shipping, moisture sensitive parts (MSL level 2a-5a) are baked and placed into the pockets of the carrier tape. A cover
tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier ESD bag with the
appropriate units of desiccant and a humidity indicator card, which is placed in a cardboard shipping box. It is important to
note that unused moisture sensitive parts need to be resealed in the moisture barrier bag. If the reels exceed the exposure
limit and need to be rebaked, most carrier tape and shipping reels are not rated as bakeable at 125°C. If baking is required,
devices may be baked according to section 4, table 4-1, of Joint Industry Standard IPC/JEDEC J-STD-033.
The table below provides information for carrier tape and reels used for shipping the devices described in this document.
Tape and Reel
RFMD Part Number
RF3183TR13
Reel
Diameter
Inch (mm)
13 (330)
Hub
Diameter
Inch (mm)
Width
(mm)
4 (102)
12
Pocket Pitch
(mm)
8
Feed
Single
Units per
Reel
2500
Unless otherwise specified, all dimension tolerances per EIA-481.
Top View
Pin 1
Location
Sprocket holes toward
rear of reel
Part Number
YYWW
Trace Code
Part Number
YYWW
Trace Code
Part Number
YYWW
Trace Code
Part Number
YYWW
Trace Code
Direction of Feed
Figure 1. 5mmx5mm (Carrier Tape Drawing with Part Orientation)
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