产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF915C1 SMD-6
MARKING 印 字:
HDF6943
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2010-6-1
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
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Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
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HDF915C1
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1. Package Dimension
2. Marking:HDF6943
HD: Brand
F : Filter
6:SMD-6
943 : No.
3.Performance
3.1Application
Low-loss RF filter for remote control receivers
Center Frequency:915 MHz
3.2Maximum Rating
Operation Temperature Range
-40℃ to +85℃
Storage Temperature Range
-40℃to +85℃
DC. Permissive Voltage
5V DC. max.
Maximum Input Power
15dBm
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3.3Electronic Characteristics
Temperature range for specification: T = –40 °C to +85 °C
Terminating source impedance: ZS = 50 W
Terminating load impedance: ZL = 50W
Center Frequency
Insertion Loss (902~928MHz)
Amplitude Ripple (902~928MHz)
Relative Attenuation
10.0 ~ 800.0 MHz
800.0~845.0MHz
845.0 MHz ~ 880.0 MHz
947.0 MHz ~ 992.0 MHz
992.0 MHz ~ 1020.0 MHz
1020.0 MHz ~ 1200.0 MHz
Input/Output Impedance
Unit
Minimum
Typical
Maximum
MHz
dB
dB
-
915
-
2.4
0.9
3.5
1.8
dB
50
45
33
25
35
45
Ohms
55
50
43
35
45
50
50
-
3.4 Frequency Characteristics
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3.5 Test Circuit
4. ENVIRONMENTAL CHARACTERISTICS
4-1 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a
high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30
Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the
measurement. It shall meet the specifications in 3.3.
4-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
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in 3.3.
4-3 Solderability
Submerge the device terminals into the solder bath at 245℃±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in 3.3.
4-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in 3.3.
4-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the
amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in 3.3.
5. REMARK
5.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
5.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
5.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
6. Packing
6.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
6.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
6.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
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(2) Label
Device Name
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
7. TAPE SPECIFICATIONS
7.1 Tensile Strength of Carrier Tape: 4.4N/mm width
7.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
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[Figure 1] Carrier Tape Dimensions
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.0
±
0.3
5.5
±
0.05
1.75
±
0.1
4.0
±
0.1
4.0
±
0.1
2.0
±0.05
Ø1.5
±0.1
Ø1.0
±
0.25
0.3
±
0.05
1.25
±
0.1
3.3±
0.1
3.3
±
0.1
[Figure 2]
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HDF915C1
E-mail:[email protected]
S6
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