PCN REPORT PART NUMBER, VSWA2-63DR+: AN-80-010 Due to obsolescence of the Dice used in Current part (Current Fab), a new set of dice in a nearly identical package (Future Fab) has been qualified. Performance of Part with Replacement Die set has been judged by Mini-Circuits Engineering as a suitable one with Current Die seta MECHANICAL DIMENSIONS & PCB LAND PATTERN CURRENT FAB: FUTURE FAB: Case Style: DG1235 Case Style: DG1235-1 (minor dimensional changes as below) MECHANICAL DRAWING & PCB LAND PATTERN Inches (mm) E & F 0.085 (2.16) Inches (mm) J 0.022 (0.56) Q 0.035 (0.89) E & F J Q 0.106 0.016 0.031 (2.70) (0.40) (0.79 Note: 1) Dimensions not shown are the same as in DG1235 2) Mini-Circuits experiment shows part can fit into existing PCB Land pattern Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 1 of 9 PCN REPORT CONCLUSION: 1) FORM-FIT-FUNCTIONAL COMPATIBLE a: Part using Current Fab Die is Form, Fit, Function compatible with that using Die from Future Fab, except for the following: Parameter CURRENT FAB REPLACEMENT PART Control Voltage: High VDD= + 4 to +5V 2.7V min & VDD max 3.5V min to VDD max Supply Current 12µA Typ. 50uA Typ. Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 2 of 9 PCN REPORT 2) PERFORMANCE COMPARISON, TYPICAL AT VDD=+5V at 25°Ca Parameter Insertion Loss RF-COM to RF1 Insertion Loss RF-COM to RF2 Isolation RF-COM to RF1 Isolation RF-COM to RF2 Isolation RF1 ro RF2 (RF1 ON) Isolation RF1 ro RF2 (RF2 ON) Return Loss RF COM (RF1 ON) Return Loss RF COM (RF2 ON) Return Loss RF1 ON Return Loss RF2 ON Return Loss RF1 OFF Return Loss RF2 OFF Future Fab MHz From To Average 0.3 500 0.74 500 2000 0.77 2000 3000 0.83 3000 4000 0.90 4000 6000 1.04 0.3 500 0.70 500 2000 0.72 2000 3000 0.77 3000 4000 0.83 4000 6000 1.01 0.3 500 76.9 500 2000 70.4 2000 3000 66.7 3000 4000 58.6 4000 6000 55.6 0.3 500 69.7 500 2000 62.9 2000 3000 61.9 3000 4000 57.6 4000 6000 52.6 0.3 500 70.9 500 1000 59.6 1000 2000 56.0 2000 3000 52.2 3000 4000 49.8 4000 6000 46.4 0.3 500 78.1 500 1000 61.2 1000 2000 56.8 2000 3000 52.3 3000 4000 49.6 4000 6000 45.9 0.3 500 23.6 500 2000 23.7 2000 3000 22.4 3000 4000 18.7 4000 6000 19.0 0.3 500 23.4 500 2000 23.3 2000 3000 23.0 3000 4000 18.9 4000 6000 20.2 0.3 500 23.6 500 2000 22.6 2000 3000 21.2 3000 4000 22.8 4000 6000 20.3 0.3 500 23.3 500 2000 22.5 2000 3000 22.2 3000 4000 26.3 4000 6000 21.2 500 2000 23.8 2000 3000 33.1 3000 4000 22.4 4000 6000 23.0 500 2000 23.0 2000 3000 34.4 3000 4000 24.8 4000 6000 26.5 Current Fab Average 0.83 0.87 0.89 0.97 1.10 0.75 0.78 0.80 0.89 1.03 70.5 69.5 75.1 67.3 65.8 82.3 68.2 60.4 56.7 55.8 71.1 58.3 52.6 48.3 45.8 44.0 80.6 59.1 53.4 48.8 45.6 42.5 23.5 24.1 25.4 17.3 18.6 23.2 24.1 22.0 15.7 17.8 23.6 25.1 24.1 25.7 25.0 23.1 22.3 22.1 22.5 22.8 15.7 16.4 20.3 21.2 15.1 16.4 20.8 27.4 Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 3 of 9 PCN REPORT 3) PERFORMANCE COMPARISON, TYPICAL AT VDD=+3V at 25°Ca Parameter Insertion Loss RF-COM to RF1 Insertion Loss RF-COM to RF2 Isolation RF-COM to RF1 Isolation RF-COM to RF2 Isolation RF1 ro RF2 (RF1 ON) Isolation RF1 ro RF2 (RF2 ON) Return Loss RF COM (RF1 ON) Return Loss RF COM (RF2 ON) Return Loss RF1 ON Return Loss RF2 ON Return Loss RF1 OFF Return Loss RF2 OFF Future Fab MHz From To Average 0.3 500 0.73 500 2000 0.76 2000 3000 0.82 3000 4000 0.89 4000 6000 1.05 0.3 500 0.67 500 2000 0.70 2000 3000 0.75 3000 4000 0.81 4000 6000 1.01 0.3 500 76.6 500 2000 69.6 2000 3000 67.1 3000 4000 59.1 4000 6000 54.7 0.3 500 69.4 500 2000 62.7 2000 3000 62.1 3000 4000 57.7 4000 6000 52.9 0.3 500 70.3 500 1000 59.5 1000 2000 56.0 2000 3000 52.3 3000 4000 49.9 4000 6000 46.3 0.3 500 76.9 500 1000 61.0 1000 2000 56.7 2000 3000 52.5 3000 4000 49.9 4000 6000 46.0 0.3 500 23.7 500 2000 24.1 2000 3000 23.0 3000 4000 18.8 4000 6000 19.2 0.3 500 23.8 500 2000 23.8 2000 3000 23.4 3000 4000 18.9 4000 6000 20.3 0.3 500 23.6 500 2000 23.2 2000 3000 22.2 3000 4000 23.8 4000 6000 21.2 0.3 500 23.7 500 2000 23.1 2000 3000 23.2 3000 4000 28.0 4000 6000 22.4 500 2000 23.7 2000 3000 32.0 3000 4000 22.0 4000 6000 22.5 500 2000 22.7 2000 3000 33.4 3000 4000 24.5 4000 6000 26.0 Current Fab Average 0.82 0.86 0.88 0.99 1.14 0.74 0.77 0.79 0.91 1.07 80.2 67.8 60.6 57.0 55.8 69.4 69.3 77.0 68.2 65.2 71.1 58.3 52.6 48.3 45.9 44.3 79.2 59.1 53.3 48.8 45.7 42.8 23.7 24.4 25.7 16.4 17.5 23.4 24.5 22.5 15.1 16.2 23.8 26.0 26.3 25.7 25.9 23.3 22.9 24.1 22.4 21.2 16.0 16.9 21.8 22.8 15.4 17.0 22.2 27.4 Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 4 of 9 PCN REPORT 4) PERFORMANCE COMPARISON CURVES a, CURRENT FAB vs. FUTURE FAB: VDD=+5V Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 5 of 9 PCN REPORT Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 6 of 9 PCN REPORT 5) PERFORMANCE COMPARISON CURVES a, CURRENT FAB vs. FUTURE FAB: VDD=+3V Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 7 of 9 PCN REPORT Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 8 of 9 PCN REPORT Notes: a. Suitability for model with new die must be determined by and is solely the responsibility of the customer based on, among other things, electrical performance criteria, stimulus conditions, application, compatibility with other components and environmental conditions and stresses. AN‐80‐010 Rev: OR (03/27/15) M150546 File: AN80010.doc This document and its contents are the property of Mini‐Circuits. Page 9 of 9