Project Number: Design Qualification Test Report Tracking Code: 505421_Report_Rev_1 Requested by: Joe Smallwood Date: 5/12/2015 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB Tech: Tony Wagoner Test Start: 2/25/2015 Test Completed: 4/13/2015 (Actual part not depicted) DESIGN QUALIFICATION TEST REPORT ZA8/PCB ZA8-30-2-1.00-Z-10/MATING PCB Page 1 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB REVISION HISTORY DATE REV.NUM. 5/12/2015 1 DESCRIPTION Initial Issue Page 2 of 34 ENG KH Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB CERTIFICATION All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable. All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec. SCOPE To perform the following tests: Design Qualification test. Please see test plan. APPLICABLE DOCUMENTS Standards: EIA Publication 364 TEST SAMPLES AND PREPARATION 1) 2) 3) 4) All materials were manufactured in accordance with the applicable product specification. All test samples were identified and encoded to maintain traceability throughout the test sequences. Any additional preparation will be noted in the individual test sequences. Samtec Test PCBs used: PCB-106308-TST/PCB-106309-TST Page 3 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB FLOWCHARTS Page 4 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB FLOWCHARTS Continued Page 5 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB FLOWCHARTS Continued Page 6 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB FLOWCHARTS Continued Page 7 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB FLOWCHARTS Continued Page 8 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB FLOWCHARTS Continued Page 9 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB ATTRIBUTE DEFINITIONS The following is a brief, simplified description of attributes. THERMAL SHOCK: 1) 2) 3) 4) 5) 6) EIA-364-32, Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors. Test Condition 1: -55°C to +85°C Test Time: ½ hour dwell at each temperature extreme Number of Cycles: 100 All test samples are pre-conditioned at ambient. All test samples are exposed to environmental stressing in the mated condition. THERMAL: 1) 2) 3) 4) 5) EIA-364-17, Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors. Test Condition 4 at 105° C. Test Time Condition B for 250 hours. All test samples are pre-conditioned at ambient. All test samples are exposed to environmental stressing in the mated condition. HUMIDITY: 1) 2) 3) 4) 5) Reference document: EIA-364-31, Humidity Test Procedure for Electrical Connectors. Test Condition B, 240 Hours. Method III, +25° C to + 65° C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b. All samples are pre-conditioned at ambient. All test samples are exposed to environmental stressing in the mated condition. MECHANICAL SHOCK (Specified Pulse): 1) 2) 3) 4) 5) 6) 7) Reference document: EIA-364-27, Mechanical Shock Test Procedure for Electrical Connectors Test Condition C Peak Value: 100 G Duration: 6 Milliseconds Wave Form: Half Sine Velocity: 12.3 ft/s Number of Shocks: 3 Shocks / Direction, 3 Axis (18 Total) VIBRATION: 1) 2) 3) 4) 5) 6) Reference document: EIA-364-28, Vibration Test Procedure for Electrical Connectors Test Condition V, Letter B Power Spectral Density: 0.04 G² / Hz G ‘RMS’: 7.56 Frequency: 50 to 2000 Hz Duration: 2.0 Hours per axis (3 axis total) NANOSECOND-EVENT DETECTION: 1) Reference document: EIA-364-87, Nanosecond-Event Detection for Electrical Connectors 2) Prior to test, the samples were characterized to assure the low nanosecond event being monitored will trigger the detector. 3) After characterization it was determined the test samples could be monitored for 50 nanosecond events MATING/UNMATING: 1) Reference document: EIA-364-13, Mating and Unmating Forces Test Procedure for Electrical Connectors. 2) The full insertion position was to within 0.003” to 0.004” of the plug bottoming out in the receptacle to prevent damage to the system under test. 3) One of the mating parts is secured to a floating X-Y table to prevent damage during cycling. Page 10 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB ATTRIBUTE DEFINITIONS Continued The following is a brief, simplified description of attributes NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING): 1) Reference document: EIA-364-04, Normal Force Test Procedure for Electrical Connectors. 2) The contacts shall be tested in the connector housing. 3) If necessary, a “window” shall be made in the connector body to allow a probe to engage and deflect the contact at the same attitude and distance (plus 0.05 mm [0.002”]) as would occur in actual use. 4) The connector housing shall be placed in a holding fixture that does not interfere with or otherwise influence the contact force or deflection. 5) Said holding fixture shall be mounted on a floating, adjustable, X-Y table on the base of the Dillon TC2, computer controlled test stand with a deflection measurement system accuracy of 5.0 µm (0.0002”). 6) The nominal deflection rate shall be 5 mm (0.2”)/minute. 7) Unless otherwise noted a minimum of five contacts shall be tested. 8) The force/deflection characteristic to load and unload each contact shall be repeated five times. 9) The system shall utilize the TC2 software in order to acquire and record the test data. 10) The permanent set of each contact shall be measured within the TC2 software. 11) The acquired data shall be graphed with the deflection data on the X-axis and the force data on the Y-axis and a print out will be stored with the Tracking Code paperwork. TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) EIA-364-70, Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets. 2 2) When current passes through a contact, the temperature of the contact increases as a result of I R (resistive) heating. 3) The number of contacts being investigated plays a significant part in power dissipation and therefore temperature rise. 4) The size of the temperature probe can affect the measured temperature. 5) Copper traces on PC boards will contribute to temperature rise: a. Self heating (resistive) b. Reduction in heat sink capacity affecting the heated contacts 6) A de-rating curve, usually 20%, is calculated. 7) Calculated de-rated currents at four temperature points are reported: a. Ambient о b. 65 C о c. 75 C о d. 95 C 8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized. 9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximum temperature in the vicinity of the heat generation area. 10) A computer program, TR 803.exe, ensures accurate stability for data acquisition. 11) Hook-up wire cross section is larger than the cross section of any connector leads/PC board traces, jumpers, etc. 12) Hook-up wire length is longer than the minimum specified in the referencing standard. Page 11 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB ATTRIBUTE DEFINITIONS Continued The following is a brief, simplified description of attributes LLCR: 1) EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 2) A computer program, LLCR 221.exe, ensures repeatability for data acquisition. 3) The following guidelines are used to categorize the changes in LLCR as a result from stressing a. <= +5.0 mOhms: --------------------------- Stable b. +5.1 to +10.0 mOhms: --------------------- Minor c. +10.1 to +30.0 mOhms: ------------------- Acceptable d. +30.1 to +50.0 mOhms: ------------------- Marginal e. +50.1 to +2000 mOhms: ------------------ Unstable f. >+2000 mOhms:---------------------------- Open Failure GAS TIGHT: 1) 2) 3) 4) To provide method for evaluating the ability of the contacting surfaces in preventing penetration of harsh vapors which might lead to oxide formation that may degrade the electrical performance of the contact system. EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. A computer program, LLCR 221.exe, ensures repeatability for data acquisition. The following guidelines are used to categorize the changes in LLCR as a result from stressing a. <= +5.0 mOhms: --------------------------- Stable b. +5.1 to +10.0 mOhms: -------------------- Minor c. +10.1 to +30.0 mOhms: ------------------ Acceptable d. +30.1 to +50.0 mOhms: ------------------ Marginal e. +50.1 to +2000 mOhms: ------------------ Unstable f. >+2000 mOhms: --------------------------- Open Failure Procedure: a. Reference document: EIA-364-36, Test Procedure for Determination of Gas-Tight Characteristics for Electrical Connectors, Sockets and/or Contact Systems. b. Test Conditions: i. Class II--- Mated pairs of contacts assembled to their plastic housings. ii. Reagent grade Nitric Acid shall be used of sufficient volume to saturate the test chamber iii. The ratio of the volume of the test chamber to the surface area of the acid shall be 10:1. iv. The chamber shall be saturated with the vapor for at least 15 minutes before samples are added. v. Exposure time, 55 to 65 minutes. vi. The samples shall be no closer to the chamber walls than 1 inches and no closer to the surface of the acid than 3 inches. vii. The samples shall be dried after exposure for a minimum of 1 hour. о viii. Drying temperature 50 C ix. The final LLCR shall be conducted within 1 hour after drying. Page 12 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB ATTRIBUTE DEFINITIONS Continued The following is a brief, simplified description of attributes INSULATION RESISTANCE (IR): To determine the resistance of insulation materials to leakage of current through or on the surface of these materials when a DC potential is applied. 1) PROCEDURE: a. Reference document: EIA-364-21, Insulation Resistance Test Procedure for Electrical Connectors. b. Test Conditions: i. Between Adjacent Contacts or Signal-to-Ground ii. Electrification Time 2.0 minutes iii. Test Voltage (500 VDC) corresponds to calibration settings for measuring resistances. 2) MEASUREMENTS: 3) When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 5000 megohms. DIELECTRIC WITHSTANDING VOLTAGE (DWV): To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect of environmental stresses so not to influence the readings from arcing that occurs during the measurement process. 1) PROCEDURE: a. Reference document: EIA-364-20, Withstanding Voltage Test Procedure for Electrical Connectors. b. Test Conditions: i. Between Adjacent Contacts or Signal-to-Ground ii. Barometric Test Condition 1 iii. Rate of Application 500 V/Sec iv. Test Voltage (VAC) until breakdown occurs 2) MEASUREMENTS/CALCULATIONS a. The breakdown voltage shall be measured and recorded. b. The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage. c. The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (onefourth of the breakdown voltage). Page 13 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB RESULTS Temperature Rise, CCC at a 20% de-rating CCC for a CCC for a CCC for a CCC for a CCC for a 30°C Temperature Rise---------------0.93 A per contact 30°C Temperature Rise---------------0.75 A per contact 30°C Temperature Rise---------------0.54 A per contact 30°C Temperature Rise---------------0.48 A per contact 30°C Temperature Rise---------------0.23 A per contact Mating/Unmating Forces: Thermal Aging Group Initial o Mating After Thermal o Mating Min --------------------------------------24.81 Lbs Max--------------------------------------26.85 Lbs Min --------------------------------------10.01 Lbs Max--------------------------------------15.68 Lbs Mating/Unmating Durability Group ZA8-30-2-1.00-Z-10/Mating PCB Initial o Mating Min --------------------------------------25.18 Lbs Max--------------------------------------26.44 Lbs After 25 Cycles o Mating Min --------------------------------------22.50 Lbs Max--------------------------------------23.70 Lbs After Humidity o Mating Min --------------------------------------- 4.12 Lbs Max--------------------------------------- 5.97 Lbs Mating/Unmating Basic Group ZA8-10-2-1.00-Z-10/Mating PCB Initial o Mating Min --------------------------------------- 8.40 Lbs Max--------------------------------------- 9.05 Lbs After 25 Cycles o Mating Min --------------------------------------- 7.27 Lbs Max--------------------------------------- 7.66 Lbs Mating/Unmating Durability Group ZA8-40-2-1.00-Z-10/Mating PCB Initial o Mating Min --------------------------------------27.41 Lbs Max--------------------------------------31.13 Lbs After 25 Cycles o Mating Min --------------------------------------23.79 Lbs Max--------------------------------------26.54 Lbs Page 14 of 34 with 10 contacts (1x10) powered with 20 contacts (2x10) powered with 30 contacts (3x10) powered with 40 contacts (4x10) powered with 400 contacts (40x10) powered Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB RESULTS Continued Normal Force at 0.0070 inch deflection Initial o Min -------------------------------------------------32.90 gf o Max ------------------------------------------------36.90 gf Set ----- 0.0020 in Set ----- 0.0028 in Insulation Resistance minimums, IR Pin to Pin Initial o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed Thermal o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed Humidity o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed Row to Row Initial o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed Thermal o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed Humidity o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed Dielectric Withstanding Voltage minimums, DWV Minimums o Breakdown Voltage ---------------------------------- 446 VAC o Test Voltage ------------------------------------------- 335 VAC o Working Voltage ------------------------------------- 110 VAC Pin to Pin Initial DWV -------------------------------------------------- Passed Thermal DWV ----------------------------------------------- Passed Humidity DWV---------------------------------------------- Passed Row to Row Initial DWV -------------------------------------------------- Passed Thermal DWV ----------------------------------------------- Passed Humidity DWV---------------------------------------------- Passed Page 15 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB RESULTS Continued LLCR Gas Tight (192 LLCR test points) Initial --------------------------------------------------------------- 28.70 mOhms Max Gas-Tight o <= +5.0 mOhms ----------------------------------- 189 Points ------------------------- Stable o +5.1 to +10.0 mOhms ----------------------------------- 2 Points ------------------------- Minor o +10.1 to +30.0 mOhms --------------------------------- 1 Points ------------------------- Acceptable o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure LLCR Thermal Aging (192 LLCR test points) Initial --------------------------------------------------------------- 20.09 mOhms Max Thermal Aging o <= +5.0 mOhms ----------------------------------- 163 Points ------------------------- Stable o +5.1 to +10.0 mOhms --------------------------------- 21 Points ------------------------- Minor o +10.1 to +30.0 mOhms --------------------------------- 8 Points ------------------------- Acceptable o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure LLCR Durability (192 LLCR test points) Initial --------------------------------------------------------------- 16.40 mOhms Max Durability, 25 Cycles o <= +5.0 mOhms ----------------------------------- 192 Points ------------------------- Stable o +5.1 to +10.0 mOhms ----------------------------------- 0 Points ------------------------- Minor o +10.1 to +30.0 mOhms --------------------------------- 0 Points ------------------------- Acceptable o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure Thermal o <= +5.0 mOhms ----------------------------------- 191 Points ------------------------- Stable o +5.1 to +10.0 mOhms ----------------------------------- 1 Points ------------------------- Minor o +10.1 to +30.0 mOhms --------------------------------- 0 Points ------------------------- Acceptable o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure Humidity o <= +5.0 mOhms ----------------------------------- 188 Points ------------------------- Stable o +5.1 to +10.0 mOhms ----------------------------------- 4 Points ------------------------- Minor o +10.1 to +30.0 mOhms --------------------------------- 0 Points ------------------------- Acceptable o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure Page 16 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB RESULTS Continued LLCR Shock & Vibration (192 LLCR test points) Initial --------------------------------------------------------------- 23.96 mOhms Max Shock &Vibration o <= +5.0 mOhms ----------------------------------- 190 Points ------------------------- Stable o +5.1 to +10.0 mOhms ----------------------------------- 1 Points ------------------------- Minor o +10.1 to +30.0 mOhms --------------------------------- 1 Points ------------------------- Acceptable o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure Mechanical Shock & Random Vibration: o o Shock No Damage ----------------------------------- ---------------------------------- Pass 50 Nanoseconds ------------------------------ ---------------------------------- Pass Vibration No Damage ----------------------------------- ---------------------------------- Pass 50 Nanoseconds ------------------------------ ---------------------------------- Pass Page 17 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) High quality thermocouples whose temperature slopes track one another were used for temperature monitoring. 2) The thermocouples were placed at a location to sense the maximum temperature generated during testing. 3) Temperature readings recorded are those for which three successive readings, 15 minutes apart, differ less than 1° C (computer controlled data acquisition). 4) Adjacent contacts were powered: a. Linear configuration with 10 adjacent conductors/contacts powered 505421 10 (1x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.93 Amps 2.4 Room Temp= 21.9°C Maximum Current, Amps per Contact 2.0 1.95 1.6 1.56 105°C Limit 1.35 1.17 1.2 1.08 0.93 0.8 0.67 0.54 0.4 0.0 20 30 40 50 60 70 80 90 100 110 Ambient Temperature (°C) Base Curve Derated 20 % Measured Current RT Peak Amp RT Derated Amp 65°C Peak Amp 65°C Derated Amp 75°C Peak Amp 75°C Derated Amp 95°C Peak Amp 95°C Derated Amp Limit Page 18 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB 505421 10 (1x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards 50 45 Temperature Rise (°C above ambient) 40 35 30 25 20 15 10 5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Current (Amps) Actual 20% Derated Page 19 of 34 1 1.1 1.2 1.3 1.4 1.5 1.6 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued b. Linear configuration with 20 adjacent conductors/contacts powered 505421 20 (2x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.75 Amps 1.8 Room Temp= 21.9°C 1.58 Maximum Current, Amps per Contact 1.5 1.2 1.26 105°C Limit 1.09 0.94 0.9 0.87 0.75 0.53 0.6 0.43 0.3 0.0 20 30 40 50 60 70 80 90 100 110 Ambient Temperature (°C) Base Curve Derated 20 % Measured Current RT Peak Amp RT Derated Amp 65°C Peak Amp 65°C Derated Amp 75°C Peak Amp 75°C Derated Amp 95°C Peak Amp 95°C Derated Amp Limit 505421 20 (2x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards 40 Temperature Rise (°C above ambient) 35 30 25 20 15 10 5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 Current (Amps) Actual 20% Derated Page 20 of 34 0.7 0.8 0.9 1 1.1 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued c. Linear configuration with 30 adjacent conductors/contacts powered 505421 30 (3x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.54 Amps 1.4 Room Temp= 21.7°C Maximum Current, Amps per Contact 1.2 1.13 1.0 0.8 105°C Limit 0.78 0.90 0.67 0.6 0.62 0.54 0.38 0.4 0.30 0.2 0.0 20 30 40 50 60 70 80 90 100 110 Ambient Temperature (°C) Base Curve Derated 20 % Measured Current RT Peak Amp RT Derated Amp 65°C Peak Amp 65°C Derated Amp 75°C Peak Amp 75°C Derated Amp 95°C Peak Amp 95°C Derated Amp Limit 0.8 0.9 505421 30 (3x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards 50 45 Temperature Rise (°C above ambient) 40 35 30 25 20 15 10 5 0 0 0.1 0.2 0.3 0.4 0.5 Current (Amps) Actual 20% Derated Page 21 of 34 0.6 0.7 1 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued d. Linear configuration with 40 adjacent conductors/contacts powered 505421 40 (4x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.48 Amps 1.2 Room Temp= 20.5°C 1.00 Maximum Current, Amps per Contact 1.0 0.8 0.80 105°C Limit 0.69 0.60 0.6 0.55 0.48 0.4 0.35 0.28 0.2 0.0 20 30 40 50 60 70 80 90 100 110 Ambient Temperature (°C) Base Curve Derated 20 % Measured Current RT Peak Amp RT Derated Amp 65°C Peak Amp 65°C Derated Amp 75°C Peak Amp 75°C Derated Amp 95°C Peak Amp 95°C Derated Amp Limit 505421 40 (4x10) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards 60 Temperature Rise (°C above ambient) 50 40 30 20 10 0 0 0.1 0.2 0.3 0.4 Current (Amps) Actual 20% Derated Page 22 of 34 0.5 0.6 0.7 0.8 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued e. Linear configuration with all adjacent conductors/contacts powered 505421 400 (40x10)(All Power) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.23 Amps 0.6 Room Temp= 21.8°C Maximum Current, Amps per Contact 0.5 0.48 0.4 0.39 105°C Limit 0.33 0.29 0.3 0.26 0.23 0.2 0.16 0.13 0.1 0.0 20 30 40 50 60 70 80 90 100 110 Ambient Temperature (°C) Base Curve Derated 20 % Measured Current RT Peak Amp RT Derated Amp 65°C Peak Amp 65°C Derated Amp 75°C Peak Amp 75°C Derated Amp 95°C Peak Amp 95°C Derated Amp Limit 505421 400 (40x10)(All Power) Contacts in Series Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards 60 Temperature Rise (°C above ambient) 50 40 30 20 10 0 0 0.1 0.2 0.3 Current (Amps) Actual 20% Derated Page 23 of 34 0.4 0.5 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued Mating\Unmating Force: Thermal Aging Group Initial Mating Minimum Maximum Average St Dev Count Unmating Mating After Thermals Unmating Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) 110.34 119.42 114.45 2.73 8 24.81 26.85 25.73 0.61 8 0.00 0.00 0.00 0.00 8 0.00 0.00 0.00 0.00 8 44.51 69.74 57.99 9.53 8 10.01 15.68 13.04 2.14 8 0.00 0.00 0.00 0.00 8 0.00 0.00 0.00 0.00 8 Mating\Unmating Durability Group ZA8-30-2-1.00-Z-10/Mating PCB Initial After 25 Cycles Mating Unmating Mating Unmating Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Minimum 112.01 25.18 0.00 0.00 100.06 22.50 0.00 0.00 Maximum 117.60 26.44 0.00 0.00 105.40 23.70 0.00 0.00 Average 114.28 25.69 0.00 0.00 102.93 23.14 0.00 0.00 St Dev 1.79 0.40 0.00 0.00 2.19 0.49 0.00 0.00 Count 8 8 8 8 8 8 8 8 After Humidity Mating Unmating Newtons Force (Lbs) Newtons Force (Lbs) Minimum 18.33 4.12 0.00 0.00 Maximum 26.57 5.97 0.00 0.00 Average 22.47 5.05 0.00 0.00 St Dev 2.32 0.52 0.00 0.00 Count 8 8 8 8 Page 24 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued Mating\Unmating Force: Mating\Unmating Basic Group ZA8-10-2-1.00-Z-10/Mating PCB Initial Mating 25 Cycles Unmating Mating Unmating Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Minimum 37.36 8.40 0.00 0.00 32.34 7.27 0.00 0.00 Maximum 40.23 9.05 0.00 0.00 34.07 7.66 0.00 0.00 Average 38.42 8.64 0.00 0.00 33.40 7.51 0.00 0.00 St Dev 1.02 0.23 0.00 0.00 0.59 0.13 0.00 0.00 Count 8 8 8 8 8 8 8 8 Mating\Unmating Basic Group ZA8-40-2-1.00-Z-10/Mating PCB Initial Mating 25 Cycles Unmating Mating Unmating Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Minimum 121.92 27.41 0.00 0.00 105.82 23.79 0.00 0.00 Maximum 138.47 31.13 0.00 0.00 118.05 26.54 0.00 0.00 Average 129.55 29.13 0.00 0.00 112.94 25.39 0.00 0.00 St Dev 6.12 1.38 0.00 0.00 3.97 0.89 0.00 0.00 Count 8 8 8 8 8 8 8 8 Page 25 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued Mating\Unmating Force Comparison Mating Data for 10, 30 and 40 Position ZA8/Mating PCB Mating (Initial) Mating (25 Cycles) 35.00 30.00 Force (lbs) 25.00 20.00 15.00 10.00 5.00 0.00 10 Pos. 30 Pos. Number of Terminals per Row Page 26 of 34 40 Pos. Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING): 1) Calibrated force gauges are used along with computer controlled positioning equipment. 2) For Normal force 8-10 measurements are taken and the averages reported. Row 1 Initial Averages Min Max St. Dev Count 0.0007 5.96 4.60 8.30 1.156 12 0.0014 12.12 10.60 15.00 1.426 12 0.0021 17.55 15.80 20.90 1.725 12 Deflections in inches Forces in Grams 0.0028 0.0035 0.0042 0.0049 0.0056 22.60 27.20 30.89 32.93 33.71 20.50 24.90 28.50 31.40 32.20 27.10 31.80 34.60 35.70 36.50 2.161 2.244 1.965 1.334 1.240 12 12 12 12 12 0.0063 34.08 32.60 36.80 1.197 12 0.0070 34.38 32.90 36.90 1.118 12 SET 0.0024 0.0020 0.0028 0.0002 12 Normal Force Initial - Average 40 35 32.9 34.1 33.7 34.4 30.9 30 27.2 25 Force-Grams 22.6 20 17.6 15 12.1 10 6.0 5 0.0 0 0 0.001 0.002 0.003 0.004 Deflection-Inches Page 27 of 34 0.005 0.006 0.007 Average Initial Normal Force 0.008 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued INSULATION RESISTANCE (IR): Minimum Initial Thermal Humidity Minimum Initial Thermal Humidity Mated ZA8/PCB 45000 45000 45000 Pin to Pin Unmated ZA8 Not Tested Not Tested Not Tested Unmated PCB Not Tested Not Tested Not Tested Mated ZA8/PCB 45000 45000 45000 Row to Row Unmated ZA8 Not Tested Not Tested Not Tested Unmated PCB Not Tested Not Tested Not Tested DIELECTRIC WITHSTANDING VOLTAGE (DWV): Voltage Rating Summary SEAF8-RA/SEAM8-GP Break Down Voltage 446 335 Test Voltage 110 Working Voltage Minimum Pin to Pin Initial Test Voltage After Thermal Test Voltage After Humidity Test Voltage Passed Passed Passed Row to Row Initial Test Voltage After Thermal Test Voltage After Humidity Test Voltage Page 28 of 34 Passed Passed Passed Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued LLCR Durability: 1) 2) 3) 4) A total of 192 points were measured. EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. A computer program, LLCR 221.exe, ensures repeatability for data acquisition. The following guidelines are used to categorize the changes in LLCR as a result from stressing. a. <= +5.0 mOhms: --------------------------- Stable b. +5.1 to +10.0 mOhms: -------------------- Minor c. +10.1 to +15.0 mOhms: ------------------ Acceptable d. +15.1 to +50.0 mOhms: ------------------ Marginal e. +50.1 to +2000 mOhms------------------- Unstable f. >+2000 mOhms: --------------------------- Open Failure LLCR Measurement Summaries by Pin Type Date Room Temp (Deg C) Rel Humidity (%) Technician mOhm values 3/13/2015 22 34 Aaron McKim Actual Initial Average St. Dev. Min Max Summary Count Total Count 3/24/2015 4/1/2015 22 22 36 35 Tony Tony Wagoner Wagoner Delta Delta 25 Cycles Therm Shck Pin Type 1: Signal 11.89 1.31 8.19 16.40 192 192 0.50 0.55 0.00 3.04 192 192 0.87 0.85 0.01 6.16 192 192 4/13/2015 22 36 Tony Wagoner Delta Humidity 1.32 1.32 0.00 7.32 192 192 LLCR Delta Count by Category mOhms 25 Cycles Therm Shck Humidity Stable <=5 192 191 188 Minor >5 & <=10 0 1 4 Acceptable >10 & <=30 0 0 0 Page 29 of 34 Marginal >30 & <=50 0 0 0 Unstable >50 & <=1000 0 0 0 Open >1000 0 0 0 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued LLCR Thermal Aging: 1) 2) 3) 4) A total of 192 points were measured. EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. A computer program, LLCR 221.exe, ensures repeatability for data acquisition. The following guidelines are used to categorize the changes in LLCR as a result from stressing. a. <= +5.0 mOhms: --------------------------- Stable b. +5.1 to +10.0 mOhms: --------------------- Minor c. +10.1 to +15.0 mOhms: ------------------- Acceptable d. +15.1 to +50.0 mOhms: ------------------- Marginal e. +50.1 to +2000 mOhms: ------------------ Unstable f. >+2000 mOhms:---------------------------- Open Failure LLCR Measurement Summaries by Pin Type Date Room Temp (Deg C) Rel Humidity (%) Technician mOhm values Average St. Dev. Min Max Summary Count Total Count 3/12/2015 22 37 Aaron McKim Actual Initial 13.04 2.02 7.55 20.09 192 192 3/30/2015 22 35 Tony Wagoner Delta Thermal Pin Type 1: Signal Delta Delta 2.86 3.55 0.00 29.96 192 192 LLCR Delta Count by Category mOhms Thermal Stable <=5 163 Minor >5 & <=10 21 Acceptable >10 & <=30 8 Page 30 of 34 Marginal >30 & <=50 0 Unstable >50 & <=1000 0 Open >1000 0 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued LLCR Gas Tight: 1) 2) 3) 4) A total of 192 points were measured. EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. A computer program, LLCR 221.exe, ensures repeatability for data acquisition. The following guidelines are used to categorize the changes in LLCR as a result from stressing. a. <= +5.0 mOhms: ---------------------------- Stable b. +5.1 to +10.0 mOhms: --------------------- Minor c. +10.1 to +15.0 mOhms: -------------------- Acceptable d. +15.1 to +50.0 mOhms: -------------------- Marginal e. +50.1 to +2000 mOhms: ------------------- Unstable f. >+2000 mOhms: ---------------------------- Open Failure LLCR Measurement Summaries by Pin Type Date Room Temp (Deg C) Rel Humidity (%) Technician mOhm values Average St. Dev. Min Max Summary Count Total Count 2/25/2015 22 36 Tony Wagoner Actual Initial 14.70 3.44 5.27 28.70 192 192 3/4/2015 22 34 Aaron McKim Delta Acid Vapor Pin Type 1: Signal Delta Delta 1.06 1.25 0.00 11.01 192 192 LLCR Delta Count by Category mOhms Acid Vapor Stable <=5 189 Minor >5 & <=10 2 Acceptable >10 & <=30 1 Marginal >30 & <=50 0 Page 31 of 34 Unstable >50 & <=1000 0 Open >1000 0 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB DATA SUMMARIES Continued LLCR Shock &Vibration: 1). A total of 192 points were measured. 2). EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 3). The following guidelines are used to categorize the changes in LLCR as a result from stressing. a. <= +5.0 mOhms: --------------------------- Stable b. +5.1 to +10.0 mOhms: -------------------- Minor c. +10.1 to +15.0 mOhms: ------------------- Acceptable d. +15.1 to +50.0 mOhms: ------------------- Marginal e. +50.1 to +2000 mOhms ------------------- Unstable f. >+2000 mOhms: ---------------------------- Open Failure LLCR Measurement Summaries by Pin Type Date Room Temp (Deg C) Rel Humidity (%) Technician mOhm values Average St. Dev. Min Max Summary Count Total Count 2/25/2015 22 36 Tony Wagoner Actual Initial 13.82 2.36 8.37 23.96 192 192 2/27/2015 22 36 Tony Wagoner Delta Shock-Vib Pin Type 1: Signal Delta Delta 1.73 1.20 0.05 10.02 192 192 LLCR Delta Count by Category mOhms Shock-Vib Stable <=5 190 Minor >5 & <=10 1 Acceptable >10 & <=30 1 Marginal >30 & <=50 0 Unstable >50 & <=1000 0 Nanosecond Event Detection: Shock and Vibration Event Detection Summary Contacts tested Test Condition Shock Events Test Condition Vibration Events Total Events 60 C, 100g's, 6ms, Half-Sine 0 V-B, 7.56 rms g 0 0 Page 32 of 34 Open >1000 0 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB EQUIPMENT AND CALIBRATION SCHEDULES Equipment #: TCT-07 Description: Automated Test Stand Manufacturer: Chatillon/Lloyd Model: LF Plus Serial #: LF1310 Accuracy: See Manual … Last Cal: 11/14/2014, Next Cal: 11/14/2015 Equipment #: HPT-01 Description: Hipot Safety Tester Manufacturer: Vitrek Model: V73 Serial #: 019808 Accuracy: … Last Cal: 05/15/2014, Next Cal: 05/15/2015 Equipment #: MO-04 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: 0798688 Accuracy: See Manual … Last Cal: 09/11/2014, Next Cal: 09/11/2015 Equipment #: PS-02 Description: Power Supply Manufacturer: Hewlett-Packer Model: 6033A Serial #: N/A Accuracy: See Manual … Last Cal: NOT CALIBRATED Equipment #: MO-10 Description: Model 2750 Multimeter/Switch System (Integra Series) Manufacturer: Keithley Model: 2750 Serial #: 1215161 Accuracy: See Manual … Last Cal: 09/11/2014, Next Cal: 09/11/2015 Equipment #: THC-05 Description: Temperature/Humidity Chamber (Chamber Room) Manufacturer: Thermotron Model: SM-8-3800 Serial #: 05 23 00 02 Accuracy: See Manual … Last Cal: 11/14/2014, Next Cal: 05/31/2015 Page 33 of 34 Tracking Code: 505421_Report_Rev_1 Part #: ZA8-30-2-1.00-Z-10/MATING PCB Part description: ZA8/PCB EQUIPMENT AND CALIBRATION SCHEDULES Equipment #: TSC-01 Description: Vertical Thermal Shock Chamber Manufacturer: Cincinnati Sub Zero Model: VTS-3-6-6-SC/AC Serial #: 10-VT14993 Accuracy: See Manual … Last Cal: 06/30/2014, Next Cal: 06/30/2015 Equipment #: OV-05 Description: Forced Air Oven, 5 Cu. Ft., 120 V (Chamber Room) Manufacturer: Sheldon Mfg. Model: CE5F Serial #: 02008008 Accuracy: +/- 5 deg. C … Last Cal: 02/18/2015, Next Cal: 02/18/2016 Equipment #: SVC-01 Description: Shock & Vibration Table Manufacturer: Data Physics Model: LE-DSA-10-20K Serial #: 10037 Accuracy: See Manual … Last Cal: 04/22/2014, Next Cal: 04/22/2015 Equipment #: ACLM-01 Description: Accelerometer Manufacturer: PCB Piezotronics Model: 352C03 Serial #: 115819 Accuracy: See Manual … Last Cal: 07/18/2014, Next Cal: 07/18/2015 Equipment #: ED-03 Description: Event Detector Manufacturer: Analysis Tech Model: 32EHD Serial #: 1100604 Accuracy: See Manual … Last Cal: 10/31/2014, Next Cal: 10/31/2015 Page 34 of 34