Product Specification Series: MCX 50Ω Mini MCX Jack / Plug MCX – Jack, Straight Orientation, Through-hole MCX – Plug, Straight Orientation, Through-hole Other configurations available for: Vertical and right angle cable-to-board applications Through-hole, surface mount, edge mount, panel mount and mixed technology Termination to various cable types See www.samtec.com for more information. Revision: A Date: May 12, 2014 Page 1 © Samtec, Inc. Product Specification Series: MCX 50Ω Mini MCX Jack / Plug 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec MCX Series. These connectors are available in vertical, edge mount and right angle. All information contained in this specification is for a straight jack board connector to a straight plug cable assembly unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at http://www.samtec.com/rf/50-ohm/mcx.aspx. 3.0 TESTING 3.1 ITEM RF174 RF316 RF178 Terminal Orientation ST RA ST RA ST RA Withstanding Voltage 630 DCV 1000 DCV 630 DCV 1000 DCV 630 DCV 1000 DCV 3.2 Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) See Section 3.1 Pass Insulation Resistance EIA-364-21 (5000 MΩ minimum) 15,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass 3.3 Mechanical: ITEM TEST CONDITION REQUIREMENT 100 cycles (w/Env.) 1000 cycles (w/o Env) STATUS Durability EIA-364-09C Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, half sine, 12.3 ft/s, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass EIA-364-13 Mating force: 14.2 lbs (63 N) maximum Unmating force: 1.8 lbs (8 N) ~ 4.5 lbs (20 N) Pass Mating / Unmating Force Revision: A Date: May 12, 2014 Page 2 Pass © Samtec, Inc. Product Specification Series: MCX 50Ω Mini MCX Jack / Plug 3.4 Environmental: ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass 4.0 MATED SYSTEM 4.1 Orientations Revision: A Date: May 12, 2014 Page 3 © Samtec, Inc. Product Specification Series: MCX 50Ω Mini MCX Jack / Plug 5.0 HIGH SPEED PERFORMANCE 5.1 Frequency Range: Cable type RF174 RF316 RF178 MCX Orientation RA ST RA ST RA ST Frequency Range DC-6 GHz DC-6 GHz DC-6 GHz DC-6 GHz DC-6 GHz DC-6 GHz 5.2 Impedance: 50 ohm 5.3 Rating: Performance up to 6 GHz 6.0 PROCESSING RECOMMENDATIONS 6.1 Maximum Reflow Passes: Versions of these connectors with surface mount features can withstand three reflow passes at a maximum oven temperature of 260°C. 6.2 Stencil Thickness: The recommended stencil thickness is .006” (0.15 mm). 6.3 Placement: Manual placement of the parts is recommended. 6.4 Thermal Profile: Due to the large number of processing variables (printed wiring board design, reflow oven type, component quantity, solder paste type, etc.), Samtec does not provide specific reflow profiles for any connector. We recommend that the solder paste manufacturer’s guidelines be followed for optimum soldering results. 6.5 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 6.6 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 7.0 APPLICATION INFORMATION 7.1 Minimum Cable Bend Radius: RF174 = 1.00 in [ 25.4] RF316 = .50 in [12.7] RF178 = .40 in [10.2] 7.2 Contact Captivation: Axial force 2.25 lbs (10 N) Revision: A Date: May 12, 2014 Page 4 © Samtec, Inc. Product Specification Series: MCX 50Ω Mini MCX Jack / Plug 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected] 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: A Date: May 12, 2014 Page 5 © Samtec, Inc.