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Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips
QSE Series – Socket, Vertical Orientation
QTE Series – Terminal, Vertical Orientation
Other configurations available for:
Co-planar and perpendicular board-to-board applications
Rugged features / end options
Packaging options
See www.samtec.com for more information.
Revision: B
Date: March 17, 2015
Page 1
© Samtec, Inc.
Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec QSE/QTE Series 0,80 mm
®
(.0315”) Q Strip High Speed Socket/Terminal Strip connector system. These socket and terminal strips are
available in Vertical and Edge Mount configurations for parallel, perpendicular and co-planar board-to-board
applications. All information contained in this specification is for a 5 mm mated height vertical configuration unless
otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
www.samtec.com?QSE and www.samtec.com?QTE.
3.0 TESTING
3.1
3.2
3.3
3.4
3.5
Current Rating: Signal: 2A (One Pin Powered Per Row); Ground: 11.6A (One Pin Powered Per Row)
Voltage Rating: 225 VAC
Operating Temperature Range: -55°C to +125°C
Operating Humidity Range: 90% to 95% (Per EIA-364-31)
Electrical:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Withstanding Voltage
EIA-364-20 (No Flashover,
Sparkover, or Breakdown)
675 VAC
Pass
Insulation Resistance
EIA-364-21 (1000 MΩ
minimum)
5,000 MΩ
Pass
Contact Resistance
(LLCR)
EIA-364-23
Δ 15 mΩ maximum
(Samtec defined)/ No damage
Pass
REQUIREMENT
STATUS
3.6 Mechanical:
ITEM
TEST CONDITION
Durability
EIA-364-09C
500 cycles (10µ" Au)
Pass
Random Vibration
EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD
0.04
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 Nanoseconds
Pass
Mechanical Shock
EIA-364-27 100 G, 6
milliseconds, sawtooth wave,
11.3 fps, 3 shocks/direction, 3
axis (18 total shocks)
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 Nanoseconds
Pass
Normal Force
EIA-364-04
30 grams minimum for gold
interface
Pass
Revision: B
Date: March 17, 2015
Page 2
© Samtec, Inc.
Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips
3.7 Environmental:
ITEM
REQUIREMENT
STATUS
Thermal Shock
EIA-364-32
Thermal Cycles: 100 (30 minute dwell)
Hot Temp: +85°C
Cold Temp: -55°C
Hot/Cold Transition: Immediate
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 675 VAC
IR: >50,000 MΩ
Pass
Thermal Aging
(Temp Life)
EIA-364-17
Test Condition 4 @ 105°C Condition B
for 250 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 675 VAC
IR: >50,000 MΩ
Pass
Cyclic Humidity
EIA-364-31
Test Temp: +25°C to +65°C
Relative Humidity: 90 to 95%
Test Duration: 240 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 675 VAC
IR: >50,000 MΩ
Pass
Gas Tight
EIA-364-36
Gas Exposure: Nitric Acid Vapor
Duration: 60 min.
Drying Temp.: 50°C +/- 3°C
Measurements: Within 1 hour of
Exposure
LLCR: Δ 15 mΩ
Pass
Revision: B
TEST CONDITION
Date: March 17, 2015
Page 3
© Samtec, Inc.
Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips
4.0 MATED SYSTEM
4.1 Mated Views
Mated view information can be found at link below:
http://cloud.samtec.com/Prints/QXE%20Mated%20Document.pdf
5.0 POLARIZING FEATURES
6.0 HIGH SPEED PERFORMANCE
6.1 Based on a 3 dB insertion loss
Stack Height
5mm
Single-Ended Signaling
9.0 GHz / 18.0 Gbps
Differential Pair Signaling
14.0 GHz / 28.0 Gbps
6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair
Revision: B
Date: March 17, 2015
Page 4
© Samtec, Inc.
Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips
7.0 PROCESSING RECOMMENDATIONS
7.1 Mating Alignment Requirements:
7.1.1
The parts can be rigidly misaligned by no more than .004” (0,10 mm) in the X- and .004” (0,10 mm)
in the Y-direction to ensure a good mate.
7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction only.
7.2.1
7.2.2
Revision: B
Date: March 17, 2015
Page 5
© Samtec, Inc.
Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips
7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec
does not specify a recommended reflow profile for our connectors. The processing parameters provided by the
solder paste manufacturer should be employed and can usually be found on their website.
All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile
parameters detailed in IPC/JEDEC J-STD-020D which requires that components be capable of withstanding a peak
temperature of 260°C as well as 30 seconds above 255°C.
Due to their weight and/or offset center of gravity, right angle (-RA) components cannot be run through the reflow
oven while inverted.
Samtec Recommended Temperature Profile Ranges (SMT)
Sn-Pb Eutectic Assembly
Preheat/Soak
(100°C-150°C)
Max Ramp Up
Rate
Reflow Time
(above 183°C)
Peak
Temp
Time within 5°C
of 235°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
235°C
20 sec. max.
6°C/s max.
6 min. max.
Preheat/Soak
(150°C-200°C)
Max Ramp Up
Rate
Reflow Time
(above 217°C)
Peak
Temp
Time within 5°C
of 260°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
260°C
30 sec. max.
6°C/s max.
8 min. max.
Pb-Free Assembly
7.3.1
These guidelines should not be considered design requirements for all applications.
Samtec recommends testing interconnects on your boards in your process to guarantee optimum results.
Revision: B
Date: March 17, 2015
Page 6
© Samtec, Inc.
Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips
7.4 Maximum Reflow Passes: Parts can withstand three reflow passes at a peak component temperature of 260°C.
7.5 Stencil Thickness: The recommended stencil thickness is .006” (0,15 mm).
7.6 Placement: Machine placement of the parts is recommended.
7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through
Nitrogen gas infusion) in the reflow process to improve solderability.
7.8 Rework Guidelines: Samtec recommends following these rework guidelines as needed: QXX/BXX Connector
Rework Methods
7.9 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers
two different types:
7.9.1
Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See
options here: SO - Board Stacking Standoff
7.9.2
Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested
construction facilitates the mating and unmating process. This is especially helpful for multiple
connector applications where the mating and unmating forces increase with the number of
connectors used. See options here: JSO - Jack Screw Standoffs
8.0 DIRECTION OF BOARD TRAVEL THROUGH REFLOW OVEN
8.1 To minimize the potential for connector warpage, Samtec recommends the layout configuration shown below left.
This allows the connectors to heat more evenly.
9.0 ADDITIONAL RESOURCES
9.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at
[email protected]
9.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
[email protected]
9.3 For additional processing information, contact our Interconnect Processing Group at [email protected]
9.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at [email protected]
Revision: B
Date: March 17, 2015
Page 7
© Samtec, Inc.