MASW6020G
GaAs SPST Switch
DC - 6.0 GHz
Rev. V6
Features
Pad Layout
Low Insertion Loss, 0.6 dB @ 1.0 GHz
Fast Switching Speed, 10 ns
Ultra Low DC Power Consumption
Integral Static Protection
RoHS* Compliant
Description
The MASW6020G is a GaAs MMIC SPST switch
die. This die is ideally used where low power
consumption is required.
Typical applications include transmit / receive
switching, switch matrices and switched filter banks,
WLAN IEEE 802.11a and 802.11 b/g systems.
Other applications include cordless phones and
base stations.
Ordering Information
Die Size - Inches (mm)
0.05 x 0.03 x 0.004 (1.270 x 0.770 x 0.250)
Bond Pad Dimensions
Part Number
Package
Bond Pad
Dimensions - Inches (mm)
MASW6020G
DIE 1
RF1, RF2
0.004 x 0.008 (0.100 x 0.200)
Alt RF
0.004 x 0.005 (0.100 x 0.125)
A, B
0.004 x 0.004 (0.100 x 0.100)
GND1
0.012 x 0.007 (0.300 x 0.175)
1. Die quantity varies.
Absolute Maximum Rating 2,3
Parameter
Absolute Maximum
GND2
0.009 x 0.008 (0.225 x 0.200)
Control Value (A/B)
-8.5 VDC
Term
0.004 x 0.008 (0.100 x 0.200)
Max Input RF Power
+34 dBm
(500 MHz - 4 GHz)
Storage Temperature
-65°C to +175°C
Operating Temperature
+175°C
Schematic
B
RF1
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
3. M/A-COM Technology Solutions does not recommend
sustained operation near these survivability limits.
A
ALT RF
RF2
Q1
Q2
Q4
2K
2K
2K
GND1
1
A
B
GND2
TERM
*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW6020G
GaAs SPST Switch
DC - 6.0 GHz
Rev. V6
Electrical Specifications: 0 / -5 V
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Insertion Loss
DC - 1.0 GHz
DC - 2.0 GHz
DC - 6.0 GHz
L/T/H
L/T/H
L/T/H
dB
—
—
—
0.8 /1.0/0.9
0.9/1.1/1.0
2.5/2.7/2.5
—
—
—
Isolation
DC - 1.0 GHz
DC - 2.0 GHz
DC - 6.0 GHz
L/T/H
L/T/H
L/T/H
dB
—
—
—
30/63/64
22/46/52
11/14/19
—
—
—
VSWR
DC - 1.0 GHz
DC - 2.0 GHz
DC - 6.0 GHz
L/T/H
L/T/H
L/T/H
Ratio
—
—
—
1.1:1/1.1:1/1.1:1
1.3:1/1.2:1/1.1:1
2.0:1/2.7:1/2.0:1
—
—
—
dBm
—
—
+27 / +33
+21 / +26
—
—
dBm
—
—
+68
+62
—
—
dBm
—
—
+46
+40
—
—
Input P1dB
Above 500 MHz - 0/-5V / 0/-8V
100 MHz - 0/-5V / 0/-8V
IP2
Two Tone Input Power up to +5 dBm
Above 500 MHz
100 MHz
IP3
Two Tone Input Power up to +5 dBm
Above 500 MHz
100 MHz
Control Current
VIN Low (0 to –0.2 V)
VOUT High (-5 V @ 50 µA Typ to –8 V)
µA
—
—
—
—
20
300
T-rise, T-fall
10% to 90% RF and 90% to 10% RF
ns
—
10
—
TON, TOFF
50% control to 90% RF, and 50% control to 10% RF
ns
—
10
—
Transients
(In Band)
mV
—
10
—
Truth Table 4,5
Option
T
L
H
4.
5.
Control Voltage
Switch Condition & Bonding
A
B
RF1
RF2
1
0
on
on
G
G
0
1
off
off
G
G
1
0
on
on
G
G
0
1
off
off
G
G
1
0
on
on
G
G
0
1
off
off
G
G
ALT
Ground Bonds
GND1
GND2
Term
Differential voltage, V (state 1) -V (state 2), must be 2.5 V minimum.
0 = 0 to –0.2 V, 1 = -5 V @ 10 µA typical to -8 V.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW6020G
GaAs SPST Switch
DC - 6.0 GHz
Rev. V6
Typical Performance
Insertion Loss
VSWR
3.0
2.5
Low Loss Terminated
Low Loss Reflective
High Isolation
2.0
Low Loss Terminated
Low Loss Reflective
High Isolation
2.5
1.5
2.0
1.0
1.5
0.5
0.0
1.0
0
1
2
3
4
5
6
Frequency (GHz)
0
1
2
3
4
5
Frequency (GHz)
Isolation
90
80
Low Loss Terminated
Low Loss Reflective
High Isolation
70
60
50
40
30
20
10
0
1
2
3
4
5
6
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
6
MASW6020G
GaAs SPST Switch
DC - 6.0 GHz
Rev. V6
Handling Precautions
Mounting
Permanent damage to the MASW6020G may
occur if the following precautions are not adhered
to:
A. Cleanliness—MASW6020G should be handled
in a clean environment. DO NOT attempt to
clean unit after the MASW6020G is installed.
B. Static Sensitivity—All chip handling equipment
and personnel should be DC grounded.
C. Transient—Avoid instrument and power supply
transients while bias is applied to the
MASW6020G. Use shielded signal and bias
cables to minimize inductive pick-up.
D. Bias—Apply voltage to either of the
complementary control ports only when the
other is grounded. No port should be allowed to
―float‖.
E. General Handling—It is recommended that the
MASW6020G chip be handled along the long
side of the die with a sharp pair of bent
tweezers. DO NOT touch the surface of the
chip with fingers or tweezers.
The MASW6020G is back-metallized with Pd/Ni/Au
(100/1,000, 10,000 Å) metallization. It can be diemounted with AuSn eutectic preforms or with
thermally conductive epoxy. The package surface
should be clean and flat before attachment.
Eutectic Die Attach:
A. A 80/20 gold/tin preform is recommended with
a work surface temperature of approximately
255°C and a tool temperature of 265°C. When
not 90/10 nitrogen/hydrogen gas is applied,
tool tip temperature should be approximately
290°C.
B. DO NOT expose the MASW6020G to a
temperature greater than 320°C for more than
20 seconds. No more than 3 seconds for
scrubbing should be required for attachment.
Handling Procedures
Epoxy Die Attach:
A. Apply a minimum amount of epoxy and place
the MASW6020G into position. A thin epoxy
fillet should be visible around the perimeter of
the chip.
B. Cure epoxy per manufacturer’s recommended
schedule.
C. Electrically conductive epoxy may be used by
is not required.
Please observe the following precautions to avoid
damage:
Wire Bonding
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
A. Ball or wedge with 1.0 mil diameter pure gold
wire. Thermosonic wirebonding with a nominal
stage temperature of 150°C and a ball bonding
force of 40 to 50 grams or wedge bonding force
o1 18 to 22 grams is recommended. Ultrasonic
energy and time should be adjusted to the
minimum levels achieve reliable wirebonds.
B. Wirebonds should be started on the chip and
terminated on the package.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW6020G
GaAs SPST Switch
DC - 6.0 GHz
Rev. V6
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support