Semelab Limited High Reliability and Screening Options DOC 2624 ISS 8 Contents 1. Introduction................................................................................................ 1 2. Quality Approvals ...................................................................................... 2 3. Material Qualification ................................................................................ 3 3.1 Header/Cap/Wire Approval Procedures...................................................................... 3 3.2 Die Approval Procedure............................................................................................... 4 4. CECC (Discrete Products)......................................................................... 5 4.1 Inspection Levels for CECC Fully Assessed Devices............................................... 5 4.2 CECC Screening Options ............................................................................................ 7 4.3 CECC processed devices (QR208, QR209) ................................................................ 8 5. BS (Linear Products) ................................................................................. 9 5.1 Inspection Levels for BS Fully Assessed Devices.................................................... 9 5.2 BS Screening Options (Linear IC’s).......................................................................... 11 6. BS & CV (Discrete Products) ...................................................................12 6.1 BS and CV processed devices (Bipolar) .................................................................. 12 7. DSCC / 883B (Linear Products) ...............................................................13 7.1 Inspection Levels for DSCC SMD listed Devices .................................................... 13 7.2 Screening Sequence for DSCC SMD listed devices ............................................... 15 7.3 MIL-883B Processed Integrated Circuits (QR214, QR215) ..................................... 16 8. MIL-PRF-19500 - QR205, QR204 (Aerospace)........................................ 17 8.1 QR205 - Inspection levels: ‘Mil Processed’ Quality Conformance ........................ 18 8.2 QR204 - Screening Sequences ‘Mil Processed’ Components ............................... 20 9. MIL-PRF-19500 - QR216, QR217 (Space) .............................................. 21 9.1 Space Level Processed Discrete Semiconductors (QR216, QR217) ..................... 21 9.2 QR217 - Inspection levels: ‘Space Level Processed’ Conformance ..................... 22 9.3 QR216 - Screening: Space Level Processed’ Components ................................... 24 10. ESA - ESCC (Space) ................................................................................ 25 10.1 Chart F2 - Production Control ................................................................................ 26 10.2 Chart F3 - Screening Tests ..................................................................................... 27 10.3 Chart F4 - Qualification and Periodic Tests.......................................................... 28 11. Screening & Approval Comparison Tables ........................................... 29 11.1 Comparison of Space Level Screening Options ................................................... 29 11.2 Comparison of Space Level Die Lot Approval....................................................... 30 11.3 Comparison of Hi-Rel Screening options .............................................................. 31 DOC 2624 iss 8a (DMD) 01/09 DOC 2624 ISS 8 1. Introduction Experience and Innovation In Semiconductor Technology At SEMELAB, we research, design, manufacture and distribute an innovative range of semiconductor products throughout the world. Our R&D teams have an excellent track record for developing imaginative electronic solutions. Our design engineers have created a wealth of high performance products. Our manufacturing divisions have ensured supreme quality and reliability. And our sales teams and distribution partners have opened international markets to some of the best electronics solutions available. We hold the necessary Qualification Approvals needed to serve the Military and Hi-Rel Industries now including QML Approval for a series of Linear Integrated Circuits and QML Approval for our laboratory test house capabilities. The test facilities are available to qualify and screen third party products, including Hybrid products not made by the Group. We have the ability and considerable experience of most test methods currently demanded. We specialise in the fabrication of very high quality products especially intended for use in high reliability applications. We have supplied many millions of discrete and linear integrated circuits into all forms of high reliability equipment such as: • Space • Aircraft • Communications • Defence • Transportation • Harsh Environment Satellite Vehicles Launchers Support & defence Military Civil Air Traffic Control Secure Communication Links Military links Naval Links Broadcast Transmitters Underwater Repeaters Guided weapons Electronic Counter Measures Command & Control Radar Railway Signalling Systems Traction Systems Automatic Signalling Systems Oil Rig Installations Drill Head Sensors Atomic Event Detectors --- everywhere, when there is a need for cost effective ultra reliable products. This is SEMELAB: design innovation, backed by numerous approvals and manufacturing strength and led by a total commitment to quality. 1 DOC 2624 ISS 8 2. Quality Approvals Description SML Facilities Approval (Y/N) SEMELAB Approval Number SML Devices Types Approved Remarks BS9000 British Standards for Linear ICs and Discrete Semiconductors Y detailed approval for many products 1360/M Linear ICs and Discrete Semiconductors Replaced in many areas by CECC or DSCC. Approved suppliers and products listed in PD9002 BS EN ISO 9001:2000 International Standard for Quality Assurance management of all phases in the provision of goods and services. Replaces most old "national" systems. Y FM36235 refers to all product types The whole Semelab facility and all Products conform to these norms. CECC 50000 European Military Quality Approval system for Discrete Semiconductors Y detailed approval for many products M1040 IECQ iss2 Small signal discretes, Power discretes European QPL. Generally in decline CECC 90000 European Military Quality Approval system for ICs. Y detailed approval for many products M1040 IECQ iss2 Linear ICs. European QPL. Generally in decline DSCC QPL approval US Manufacturing approval accepted everywhere Y detailed approval for large range of linear ICs. Cage NO. U3158 Linear ICs Detailed product approval by DSCC (commonly called MIL/883B for linear ICs) DSCC QML approval US Manufacturing approval accepted everywhere Y DSCC -VQ03-003050 & DSCC-VQ03-003049 Linear ICs (lvl Q certification) Laboratory Suitability Will generally replace many of the older approval systems on International Military Systems. ESCC 5000, ESCC 9000 European Space Components Coordination Y QPL No 253 2N2880 - more to follow Product built & supplied in accordance with generic ESCC specifications General reciprocal listing arrangement Y All product types Reciprocal QPL listing between Europe and North America SCHEME Current Schemes STANAG 4093 Schemes being phased out AQAP-1 Applies in UK and related areas. Replaced Defence Standard 05/21 Y GAMT1 French Military approved products list Y detailed approval for many products MUAHAG European - Military users and Harmonisation Advisory Group Y detailed approval for many products NATO NATO system – applies to NATO systems MOD Registration No.2M8S02 Being superseded by BS/EN/ISO 9001 A large number Discretes (vol 7) Linears (vol 9) French Market - should be replaced by BS/EN/ISO9001 Components generally for European Military equipment makers - should be replaced by BS/EN/ISO9001 Y listed for many products Manufacturer Code 3158 Several hundred discrete products Tending towards being a legacy system now Legacy Schemes CV Very early UK approvals system for Military and GPO types some parts replaced by BS types, CECC or CVxxxx-0 parts Legacy system – generally replaced by BS or CECC types DEF Specs Precursor of Defence Standard Specifications Many types all built to order. Replaced by Defence Standard Specifications. Generally already phased out. Defence Standards (many) Relate to materials, components and processes for UK Military use Y for many products but under ISO9001:2000 RRE, RSRE & SRDE Specifications Specifications drawn up in support of MOD projects Y Discrete products Legacy system little used now. The most common DEF Stan relating to Semiconductors is DEF STAN 05/21 - replaced by ISO 9001:2000 Discrete products Legacy system little used now. for many types 2 DOC 2624 ISS 8 3. Material Qualification Piece Part – Qualification and pre-assembly approval process flow. Before contemplating the assembly of any qualified semiconductor product, it is essential that all the materials used in the construction of the parts be obtained from fully qualified and trustworthy suppliers - those with a long continuous and successful supply history. Little used or untried or suspect materials are thoroughly checked and qualified as being suitable for their intended application before use. In this case, mechanical piece parts are subject to an exhaustive series of tests culminating in sample assemblies being built to establish lack of flaws and lack of unwanted difficulties during assembly. 3.1 Header / Cap / Wire Approval Procedures Incoming Mechanical Piece Parts Visual inspection Dimensional Check Corrosion Resistance Mechanical Strength Visual Die Sort (before sample assembly) Sample piece parts submitted to Assembly Vibration test Temperature Cycling Acceleration Sealing (Leak) Tests QA Inspection Tests Solderability Tests Operation Electrical Tests Qualified (Approved) Mechanical Piece Parts Available for Assembly of Hi-Rel Products. Notes: Approval procedures are performed on samples to approve each single lot of material. Each batch of assembled piece parts carries its own unique “date” code. Traceability to each incoming batch of materials (all mechanical batches and die lots) is guaranteed from this unique number. 3 DOC 2624 ISS 8 3.2 Die Approval Procedure Incoming Wafer Wafer Saw Wash & Dry Headers* (qualified) Break into individual die Clean Visual Die sort and Tray Die Acceptance Die Attach Die Attach Inspection Aluminium Wire Bond Bond Inspection Caps* (Qualified) 100% Optical Inspection Clean Final Pre-Cap Inspection Vacuum Bake Final Seal QA Inspection Tests Seal Inspection Operation Final Acceptance Electrical Yield Forecasting QA Acceptance Tests 168 Hour Life Test Final QA Acceptance of the Die Lot. APPROVED DIE (available for production) All assembled batches carry full traceability back to all incoming materials used via a unique Lot ID assigned at the beginning of the manufacturing stage Qualification can include an additional 1000 hour or 2000 hour electrical endurance test if required. One of the major objectives is to ensure that the die lot’s performance stabilises rapidly during the initial portion of this period and then remain unchanged throughout the remainder of the test (and life). All die lots assigned for space use have 2000 hours electrical endurance as standard Die and mechanical piece parts intended for use in Ultra-Reliable applications e.g. Space Vehicles are subject to more rigorous evaluation. 4 DOC 2624 ISS 8 4. CECC (Discrete Products) Registration: M1040 IECQ iss2 SEMELAB offers one of the largest ranges of CECC approved products in Europe, including small signal and power devices. These devices have undergone approval for use in new applications as well as providing continuing support for existing applications. All piece parts used in the manufacture of CECC released products undergo stringent qualification procedures before they can be used. For further details contact our Quality Manager ([email protected]). Full forward and backward traceability is maintained on all CECC released devices All CECC fully assessed devices are subject to groups A, B and C inspection carried out in the Quality Assurance Department in Lutterworth. Assessment is available to levels E, F & L. Ordering Information (example):BDS18CECC BDS18CECC-B full assessment level (without additional screening) CECC full assessment level + sequence B screen 4.1 Inspection Levels for CECC Fully Assessed Devices Group A - Lot by lot inspection IL = inspection levels AQL = Acceptable Quality Level (%) Levels of Quality Assessment Level E Examination or test IL AQL Observations Level F & Level L IL AQL Notes SUB-GROUP A1 Visual Inspection I 0.65 I 0.65 SUB-GROUP A2a Non operatives II 0.15 II 0.15 SUB-GROUP A2b Electrical Measurements II 0.40 primary dc characteristics II 0.65 1.0 if < 4 tests if ≥ 4 tests SUB-GROUP A3 Electrical Measurements II 0.65 other dc characteristics I I 2.5 4 if < 4 tests if ≥ 4 tests 1 ac characteristics S4 S4 4 6.5 if < 4 tests if ≥ 4 tests SUB-GROUP A4 Electrical Measurements S4 5 DOC 2624 ISS 8 CECC (Discrete Products) Group B - Lot by lot inspection (continued) IL = inspection level amb = ambient rated case = case rated AQL in % c = acceptance criterion n = sample size Levels of Quality Assessment Level E Examination or test Level F Level L n/c IL AQL IL AQL SUB-GROUP B1 Dimensions 15/0 or 25/1 S2 2.5 S2 2.5 SUB-GROUP B2c Verification of ratings 15/0 or 25/1 S4 4 NA NA SUB-GROUP B3 Lead bending if applicable 15/0 or 25/1 S3 2.5 S2 4 SUB-GROUP B4 Solderability 22/0 or 38/1 S4 2.5 S4 2.5 15/0 or 25/1 S4 2.5 NA NA see C5 see (1) below 38/1 or 52/2 S4 1.5 NA NA see C8 SUB-GROUP B5 Temperature Cycle. Acceleration. Seal test or Damp Heat test SUB-GROUP B8 Electrical endurance Notes see C2c Unless otherwise stated in detail specification: attributes information for B3, B4, B5, B8 in CECC specifications SUB-GROUP CTR Group C - Periodic Inspection P = periodicity (months) na= not applied Levels of Quality Assessment E (p = 3 months) Examination or test n/c notes F (p = 3 months) n/c notes L P n/c SUB-GROUP C1 Dimensions 8/0 or 13/1 8/1 3 8/1 SUB-GROUP C2a Electrical Measurements 15/0 or 25/1 13/1 3 13/1 SUB-GROUP C2b Complementary characteristics 32/0 or 55/1 15/0 or 25/1 18/1 3 18/1 SUB-GROUP C2c Verification of ratings 15/0 or 25/1 13/1 3 8/1 SUB-GROUP C3 Tensile / Torque (if applicable) 15/0 or 25/1 8/1 6 8/1 SUB-GROUP C4 Soldering heat 22/0 or 38/1 18/1 NA NA 3 13/1 SUB-GROUP C5 Temperature Cycle. Acceleration. Seal test or Damp Heat test NA versus T versus I,V see B5 in CECC NA when not in B2c see B5 in CECC SUB-GROUP C6 Shock acceleration vibration 15/0 or 25/1 8/1 6 8/1 SUB-GROUP C7 Damp heat (if applicable) 15/0 or 25/1 18/1 NA NA SUB-GROUP C8 Electrical endurance 38/1 or 52/1 43/3 34/2 amb case 3 3 32/3 25/2 SUB-GROUP C9 Storage at high temp 38/1 or 52/2 43/3 34/2 amb case NA NA SUB-GROUP CTR Notes See (1) below amb case Unless otherwise stated in detail specification: attributes information for C3, C5, C6, C9. Measurement information before and after C8 (1) 2 chamber method. T=30 mins, 5 cycles. At maximum and minimum rated storage temperatures 6 DOC 2624 ISS 8 CECC (Discrete Products) (continued) 4.2 CECC Screening Options All CECC approved devices can be supplied as a standard full assessment level part or with additional 100% screening to any of the four levels (A, B, C, D) in accordance to CECC 50000 Appendix VI In addition, SEMELAB can supply screening on products where the full device approval does not exist or is not held. Screening is again carried out in accordance with any of the four levels within CECC 50000 Appendix VI and is carried out at our factory in Lutterworth. Screening sequences are as laid out below:- SEQUENCE A SEQUENCE B SEQUENCE C SEQUENCE D 24 Hour High Temperature Storage 24 Hour High Temperature Storage 24 Hour High Temperature Storage Rapid change of Temperature Rapid change of Temperature Rapid change of Temperature Acceleration Test Acceleration Test Acceleration Test Fine & Gross Leak Test Fine & Gross Leak Test Fine & Gross Leak Test Test & record Electrical Characteristics Test Electrical Characteristics Test Electrical Characteristics 168 Hour Burn-In Electrical Operation (ambient rated) or High Temperature Reverse Bias (case rated) 72 Hour Burn-In Electrical Operation (ambient rated) or High Temperature Reverse Bias (case rated) 48 Hour Burn-In Electrical Operation (ambient rated) or High Temperature Reverse Bias (case rated) Test & record Electrical Characteristics Test Electrical Characteristics 100% Internal Visual Inspection Test Electrical Characteristics 7 Test Electrical Characteristics DOC 2624 ISS 8 CECC (Discrete Products) (continued) 4.3 CECC Processed Devices QR208: Conformance to the requirements of CECC 50000 QR209: Screening to the requirements of CECC 50000 App VI QR208 and QR209 are based entirely on CECC 50000 quality conformance inspection requirements and screening options. By working to these specifications SEMELAB are able to supply full CECC “look alike” products, where no CECC specification exists, released under the company’s ISO9001:2000 approval. Standard processing is done in accordance with Group A (electrical) and Group B (environmental) tests to full assessment level F. Group C tests and level E assessment levels are optional and are available on customer request. Part numbers for products processed to QR208 and QR209 have -QR added (and a letter corresponding to the screening level if required). The marking for the device has the suffix ‘O’ added (and a letter corresponding to the screening level if screened). Semelab are also able to process devices to existing CECC specifications where we have not undergone an approval exercise. This is particularly useful when Semelab want to supply products in a smaller volume that does not justify the cost of the full approval exercise. Part numbers for parts processed to detailed specifications will have the suffix ‘-O’ added to the original part number (and a letter corresponding to the screening level if required). The marking for the device has the suffix ‘-O’ added (and a letter corresponding to the screening level if screened). Ordering Information (when no CECC specification exists):Part Number Description Marking (*) 2N5153-QR QR208 gps A, B level F 2N5153-O 2N5153-QR-B QR208 gps A, B level F + QR209 sequence B Processed to CECC full assessment level F, Groups A, B 2N5153-O/B Processed to CECC full assessment level F, Groups A, B with screening in accordance with CECC 50000 App VI seq B 2N5153-QR-EB QR208 gps A, B level E + QR209 sequence B 2N5153-O/B Processed to CECC full assessment level E, Groups A, B with screening in accordance with CECC 50000 App VI seq B 2N5153-QR-EBC QR208 gps A, B, C level E + QR209 sequence B 2N5153-O/B Processed to CECC full assessment level E, Groups A, B, C with screening in accordance with CECC 50000 App VI seq B * Where space permits 8 DOC 2624 ISS 8 5. BS (Linear Products) Registration 1360/M. SEMELAB offers a range of BS approved Linear IC’s including Voltage regulators, PWM’s and Control IC’s. These families of devices have undergone approval for use in new applications in addition to providing continuing support for existing applications. Full forward and backward traceability is maintained on all BS released devices All BS fully assessed devices are subject to groups A,B,C and D inspection carried out in the Quality Assurance Department in Lutterworth. Screening is available to any of the four levels defined in BS9400 (S1, S2, S3, S4) The generic specifications for these devices are as follows: BS9400 BS9430 BS9493 IC’s - Generic Data & Methods of Test Linear Voltage Regulators PWM and Control IC’s Ordering Information (example):IP117K-BSS2 BS full assessment level + category S2 screening 5.1 Inspection Levels for BS Fully Assessed Devices Group A - Lot by lot inspection IL = inspection levels AQL = Acceptable Quality Level (%) Levels of Quality Assessment Examination or test IL AQL BS9400 SUB-GROUP A1 Visual Inspection I 1.5 1.2.2 SUB-GROUP A2 Non operatives II 0.15 SUB-GROUP A3a Electrical Measurements II 1.5 Static Characteristics Tamb=25°C SUB-GROUP A3b Electrical Measurements II 1.5 Static Characteristics Tamb = Tmax SUB-GROUP A3c Electrical Measurements II 1.5 Static Characteristics Tamb = Tmin SUB-GROUP A4a Electrical Measurements S4 4% Dynamic Characteristics Tamb = 25°C 9 Observations DOC 2624 ISS 8 BS (Linear Products) (continued) Group B - Lot by lot inspection IL = inspection levels AQL = Acceptable Quality Level (%) Levels of Quality Assessment Examination or test IL AQL BS 9400 SUB-GROUP B1 Dimensions S2 6.5 1.2.3 SUB-GROUP B2a Solderbility S4 4.0 1.2.6.15.1 S4 4.0 1.2.6.13 1.2.6.14.1/2 SUB-GROUP B3 Lead bending S3 6.5 1.2.6.16.2 SUB-GROUP B6 Acceleration steady state S4 4.0 1.2.6.9 SUB-GROUP B7 Electrical Endurance S4 1.5 1.2.7.2.2 SUB-GROUP B2b Change of temp followed by sealing Observations Unless otherwise stated in detail specification: attributes information for B2a, B2b, B6, B7 SUB-GROUP B8 CTR Information Group C - Periodic inspection IL = inspection levels AQL = Acceptable Quality Level (%) Levels of Quality Assessment Examination or test IL AQL BS 9400 SUB-GROUP C1 Dimensions S2 6.5 1.2.3 S2 6.5 1.2.6.8.1 1.2.6.6 1.2.6.5 SUB-GROUP C5 Electrical Endurance S3 4.0 1.2.7.2.2 Duration = 2000 hrs SUB-GROUP C6 CTR Information S3 6.5 1.1.11 Unless otherwise stated in detail spec: attributes information for C3 & C5 SUB-GROUP C3 Vibration followed by Shock followed by Damp Heat Cycle 10 Observations DOC 2624 ISS 8 BS (Linear Products) (continued) 5.2 BS Screening Options (Linear IC’s) CATEGORY S1 CATEGORY S2 CATEGORY S3 CATEGORY S4 100% Internal Visual Inspection Level A 100% Internal Visual Inspection Level B 100% Internal Visual Inspection Level B 24 Hour High Temperature Storage 24 Hour High Temperature Storage 24 Hour High Temperature Storage Rapid change of Temperature Rapid change of Temperature Rapid change of Temperature Acceleration Test (Direction Y1, Y2) Acceleration Test (Direction Y1) Acceleration Test (Direction Y1) Fine & Gross Leak Test Fine & Gross Leak Test Fine & Gross Leak Test Test Electrical Characteristics Test Electrical Characteristics Test Electrical Characteristics 240 Hour Duration High Temperature Burn-In 160 Hour Duration High Temperature Burn-In 160 Hour Duration High Temperature Burn-In Shock Test Electrical Characteristics 72 Hour Duration High Temperature Reverse Bias Test Electrical Characteristics Test Electrical Characteristics Test Electrical Characteristics Test Electrical Characteristics Radiographic Tests (Accept / reject criteria at every stage strictly as defined by the BS Specifications). 11 DOC 2624 ISS 8 6. BS and CV (Discrete Products) 6.1 BS and CV processed devices (Bipolar) Semelab is committed to the ongoing supply of a wide range of product types. This includes many products where the original manufacturer has ceased production, which is the case on many discrete products originally supplied against BS specifications. Semelab can provide ‘look-alike’ devices against most BS specifications, processing devices as shown below. Semelab can also supply many of the old type CV devices which have been converted into the BS system. Product is processed to the requirements of Group A (electrical) and Group B (mechanical and environmental) tests of BS detail device specifications. Parts processed in accordance with these specifications are marked with the suffix ‘-O’ added to the original part number. Screening can also be carried out against the BS sequences A,B,C,D if required Ordering Information (example): Part Number Description Marking (*) BFT69-O Requirements of BS9365-F005 Groups A & B BFT69-O BFT69-O-B Requirements of BS9365-F005 Groups A & B BFT69-0/B With screening in accordance with BS sequence B CV7xxx-0 Requirements of BS 9300 Cxxx Groups A,B CVxxx-O * Where space permits 12 DOC 2624 ISS 8 7. DSCC / 883B (Linear Products) Built on Semelab’s QML Qualified Production Lines Cage Number U3158 SEMELAB offers a range of DSCC SMD listed and 883B processed voltage regulators, PWM’s and Control IC’s. All manufacturing is carried out on our QML qualified lines in our Lutterworth factory to the appropriate MIL-STD-883 specifications (5005 - Processing and 5004 - Screening). 7.1 Inspection Levels for DSCC SMD Listed Devices Method 5005: Table I Group A electrical tests for class level B Examination or test Quality/accept Observations SUB-GROUP 1 Static Tests 116/0 Tamb = 25°C SUB-GROUP 2 Static Tests 116/0 Tamb = Tmax SUB-GROUP 3 Static Tests 116/0 Tamb = Tmin SUB-GROUP 4 Dynamic Tests 116/0 Tamb = 25°C SUB-GROUP 5 Dynamic Tests 116/0 Tamb = Tmax SUB-GROUP 6 Dynamic Tests 116/0 Tamb = Tmin SUB-GROUP 7 Functional Tests 116/0 Tamb = 25°C SUB-GROUP 8a Functional Tests 116/0 Tamb = Tmax SUB-GROUP 8b Functional Tests 116/0 Tamb = Tmin SUB-GROUP9 Switching tests 116/0 Tamb = 25°C SUB-GROUP10 Switching tests 116/0 Tamb = Tmax SUB-GROUP11 Switching tests 116/0 Tamb = Tmin 1) The specific parameters to be included for tests in each subgroup shall be as specified in the applicable acquisition document. Where no parameters have been identified in a particular subgroup or tests within a subgroup, no group A testing is required for that subgroup or test to satisfy group A requirements. 2) When the (sub)lot size is less than the required sample size, each and every device in the (sub)lot shall be inspected and all failed devices removed from the (sub)lot for final acceptance of that test, subgroup, or set of tests/subgroups. Method 5005: Table IIb Group B tests for class level B Test note MIL-STD-883 method (3) 2015 Condition Quantity/accept or sample size/accept Subgroup 2 Resistant to solvents 3/0 Subgroup 3 Solderability (4) 2003 (5) 2011 temp 245°C ± 5°C soldering sample size number = 22, c = 0 Subgroup 3 Bond strength 1) Thermo-compression 2) Ultrasonic / Wedge 3) Flip-chip 4) Beam lead 1) Test Condition C or D 2) Test Condition C or D 3) Test Condition F 4) Test Condition H sample size number = 15, c = 0 3) Resistance to solvents testing required only on devices using inks or paints as the marking or contrast. 4) Devices submitted for solderability shall be in the same lead finish as shipped product and must have been through the temp/time exposure of burn in except for devices which have been hot solder dipped or have lead-tin fusing after burn-in. 5) Unless otherwise specified the sample size number for condition C or D is the number of bond pulls selected from a minimum number of 4 devices and for condition F or H is the number of dice (not bonds). 13 DOC 2624 ISS 8 DSCC / 883B (Linear Products) (continued) Method 5005: Table III Group C (Die related tests) for class level B Test MIL-STD-883 method Condition Quantity/accept or sample size/accept Subgroup 1 a) Steady-state life test 1005 b) End-point electrical parameters Test condition to be specified (1000 hours at 125°C or equivalent in accordance with table 1) sample size number = 45, c = 0 As specified in the applicable device specification Method 5005: Table IV Group D (package related tests) for class level B Test (1) Subgroup 1 (2) Physical Dimensions Subgroup 2 a) Lead Integrity (3) b) Seal - Fine & Gross leak (5) Subgroup 3 (4) a) Thermal Shock b) Temp Cycle c) Moisture resistance d) Visual Examination e) Seal - Fine & Gross leak f) End Point Electricals Subgroup 4 (4) a) Mechanical Shock b) Vibration, variable frequency c) Constant Acceleration d) Seal - Fine & Gross leak e) Visual examination f) End point Electricals (6) Subgroup 5 (2) a) Salt Atmosphere b) Visual Examination c) Seal - Fine & Gross leak Subgroup 6 (2) a) Internal water-vapour content Subgroup 7 (2) a) Adhesion of Lead finish (12) Subgroup 8 (2) a) Lid Torque MIL-STD883 method Condition Quantity/accept or sample size/accept sample size number = 15, c = 0 2016 2004 1014 Test Condition B (lead fatigue) As applicable sample size number = 45, c = 0 1011 1010 1004 Test condition B - 15 cycles min Test Condition C. 100 cycles min sample size number = 15, c = 0 1014 2002 2007 2001 1014 In accordance with visual criteria method 1004 and 1010 As applicable As specified in the applicable device specification Test condition B minimum Test condition A minimum Test condition E minimum (Y1 only) sample size number = 15, c = 0 In accordance with meth 1010 or 1101 As specified in applicable device specification 1009 1014 Test condition A minimum In accordance with method 1009 sample size number = 15, c = 0 1018 5000ppm max water content at 100°C 2025 3/0 or 5/1 sample size number = 15, c = 0 2024 5/0 1) In line monitor data may be substituted for subgroups D1,D2,D6,D7 and D8 upon approval by the qualifying activity. The monitors shall be performed by package type and to the specified subgroup test method. 2) Electrical reject devices from the same inspection lot may be used for samples. 3) The sample size number of 45, C=0 for lead integrity shall be based on the number of leads or terminals tested and shall be taken from a minimum of 3 devices. 4) Seal tests need only be performed on packages having leads exiting through a glass seal. 5) Devices used in subgroup 3 can be used in subgroup 4. 6) End point electrical parameters may be performed after moisture resistance and prior to seal test. 7) Sample size based on number of leads. 14 DOC 2624 ISS 8 DSCC / 883B (Linear Products) (continued) 7.2 Screening Sequences for DSCC SMD Listed Devices Method 5004: Table 1 Class level B screening Screen MIL-STD-883 method Condition Requirement Internal Visual (1) 2010 Test Condition B 100% Stabilisation Bake 1008 24hrs @ condition C minimum 100% 100% Temperature Cycling (2) 1010 Test Condition C Constant Acceleration 2001 Test condition E minimum Y1 orientation only Visual Inspection Initial (pre-burn-in) (3) In accordance with applicable electrical Parameters Burn-In Test 100% 100% 100% device specification 1015 160 hours at 125°C minimum 100% Interim (Post Burn-In) In accordance with applicable 100% Electrical Parameters device specification Percentage Defect Allowable 5% all lots Final Electrical Test a) Static tests 1) 25°C subgroup 1 table 1 5005 2) Maximum and Minimum rated operating temperature subgroup 2,3 table 1 5005 In accordance with applicable device specification 100% 100% b) Dynamic or functional tests 1) 25°C subgroup 4,7 table 1 5005 2) Minimum and Maximum rated operating temperature subgroup 5,6,8 table 1 5005 100% 100% 100% c) Switching tests at 25°C subgroup 9 table 1 5005 Seal (4) 1014 100% a) Fine b) Gross Qualification or quality (5) conformance inspection test sample selection 5005 External Visual 2009 In accordance with applicable device specification sample 100% 1) Test samples for group B, bond strength may be selected prior to or following internal visual, prior to sealing provided all other specification requirements are satisfied. Test method 2010 applies in full except when method 5004, alt 1 or 2 is in effect. 2) This may be replaced with thermal shock method 1111, test condition A, minimum. 3) When specified in the applicable device specification, 100% of devices shall be tested for parameters requiring deltas. 4) Fine & Gross leak tests shall be performed separately or together between constant acceleration and external visual. All device lots having any physical processing steps performed following seal shall be retested for hermeticity and visual defects. 5) Samples shall be selected for testing in accordance with the specific device class and lot requirement of method 5005. 15 DOC 2624 ISS 8 DSCC / 883B (Linear Products) (continued) 7.3 MIL883B Processed Integrated Services (QR214, QR215) QR215: ‘MIL Processed /883B’ Full Quality Conformance Inspection for Linear Integrated Circuits A and B, C and D optional) QR214: ‘MIL Processed /883B’ Linear Integrated Circuit Component Screening Semelab are able to supply additional non SMD listed linear products fully processed in accordance with the MIL-STD-883B specification flow and methods. Semelab’s QR214 and QR215 are based on MIL-STD-883E, METHOD 5005 quality conformance, inspection requirements and METHOD 5004 screening methods. Semelab QR215 (quality conformance) covers the control procedures for group A (electrical), group B (environmental), group C (die related) and group D (package related) tests. It is based on METHOD 5005 conformance procedures and MIL-STD-883E test methods Semelab QR214 (screening) is based on METHOD 5004 screening procedures and MIL-STD-883E test methods. Ordering Information: Devices screened in accordance with Semelab QR214 and QR215 are identified using the standard product part number with the addition of the suffix “–8QRB”. Example: LM117H built and screened to the MIL883B flows Method 5005 and Method 5004 in accordance with QR214 and QR215 is: LM117H-8QRB Device Marking:xxx-8QRB for products equivalent to MIL883B parts - e.g. LM117H-8QRB + SML + DC 16 DOC 2624 ISS 8 8. MIL-PRF-19500 – QR205, QR204 (Aerospace) QR205: ‘Mil Processed’ Full Quality Conformance Inspection (MIL-PRF-19500) QR204: ‘Mil Processed’ Discrete Component Screening (MIL-PRF-19500) SEMELAB’s QR205 and QR204 processing specifications, in conjunction with the company’s ISO 9001:2000 approval present a viable alternative to the American MIL approved parts from a European manufacturer. Semelab QR205 (quality conformance) is based on the quality conformance inspection requirements of MIL-PRF-19500 groups A (table V), B (table VIb), C (table VII). Semelab QR204 (screening options) is based on the screening options and requirements of MIL-PRF-19500 (table IV). Full details of Semelab QR205 and QR204 are included in the following pages, showing sample sizes and test methods used. All manufacture and processing is carried out on our approved High-Rel assembly line in our Lutterworth factory and product is released under the company’s ISO 9001:2000 defence standard approval. The table below shows part number examples and corresponding processing options and marking. The device marking will also contain the SEMELAB identifier (SML) plus the date code where space permits. Ordering Information: (examples) Part Number Description Marking (*) 2N2369-JQR QR205 groups A,B 2N2369-JQR 2N2369-JQRB QR205 groups A,B 2N2369-JQRB Screening to QR204 level B 2N2369-JQRA QR205 groups A,B 2N2369-JQRA Screening to QR204 level A * Where space permits Additional options: Group C charge Group C destructive electrical samples Group C destructive mechanical samples -GRPC -GCDE -GCDM (12 pieces) (6 pieces) Notes: 1) All ‘Additional Options’ are chargeable and must be specified at order stage. 2) When Group C is required, additional electrical and mechanical destructive samples must be ordered. 3) All destructive samples are marked the same as other production parts unless otherwise requested. 17 DOC 2624 ISS 8 MIL-PRF-19500 – QR205, QR204 (Aerospace) (continued) 8.1 Inspection Levels: ‘Mil Processed’ Quality Conformance (ref: MIL-PRF-19500) QR205: Group A - Electrical Tests Subgroup Description 1 Visual + mechanical Inspection 2 3 * small lot conformance LTPD Sample* Reject 5 45 0 DC electrical tests at 25°C 5 116 0 DC electrical tests. Hot & Cold temps as per device datasheet 30 45 0 4 AC electrical tests at 25°C 30 45 0 5 Safe Operating Area (Power Transistors) a) DC b) Clamped Inductive c) Unclamped Inductive Endpoint electrical measurements 30 45 0 The specified parameters to be included in each subgroup shall be as per the detail specification. Where no parameters are specified in a particular subgroup or test within a subgroup, no Group A testing is required for that subgroup or test to satisfy Group A requirements. A single sample may be used for all subgroup testing. These tests are considered non-destructive. QR205: Group B - Short term Environmental & Endurance Tests * small lot conformance Test Subgroup 1 Solderability Note MIL-STD-750 method Condition Sample* Reject d=destructive (1) (3) Resistant to solvents 1 d 2026 (minimum 3 devices) 1022 (separate samples can be used) 3 devices 4 leads 1051 No dwell required at 25°C. Test condition C1 (45 cycles including screening), temp extreme, ≥10m 6 0 12 0 d Subgroup 2 Temperature Cycling (air to air) hermetic seal (a) Fine Leak Test condition H. 1071 -9 <0.01cc. max = 5 x 10 atm cc/s, -8 (b) Gross leak >0.01cc. max = 1 x 10 atm cc/s Electrical Measurements Subgroup 3 & 4 Steady-state operation life or Intermittent operation life or Blocking life Electrical Measurements (4) Bond Strength (6) Internal visual design verification Subgroup 5 Thermal Resistance 1027 340hrs at specified bias conditions 1037 - (5,6) 2037 As specified (3 devices minimum) 11 wires d 0 d 2075 Visual criteria in accordance with qualified design. 3 3131 6 0 3101 For Transistors For Diodes 1032 340hrs high temperature storage 12 0 Subgroup 6 High temperature life (non operating) Electrical Measurements As specified (Minimum qty of destructive samples required is 6. (Full notes for numbered references are at the end of group C table) 18 DOC 2624 ISS 8 MIL-PRF-19500 – QR205, QR204 (Aerospace) (continued) QR205: Group C - Periodic Inspection (chargeable option on request) * small lot conformance Test Note MIL-STD-750 method Condition Sample * Reject d=destructive Subgroup 1 2066 Dimensions per case outline specified 6 0 Thermal shock (glass strain) 1056 Test condition A, except for devices > 10W at T=25 which is condition B 6 d 0 Temperature Cycling (air to air) 1051 Test condition C or max stg temp, whichever is less (25 cycles) Shock 2016 Non-operating, 1500G, 0.5ms, 5 blows in each orientation, X1, Y1, Z1 Vibration (variable frequency) 2056 Constant acceleration 2006 6 0 Physical dimensions Subgroup 2 & 3 Hermetic Seal 1 minute min. in X1,Y1,Z1 orientation Y1 at 20000G min except at 10000G min if device ≥15W at TC=25°C Test condition H. (a) Fine Leak 1071 -9 <0.01cc. max = 5 x 10 atm cc/s, -8 >0.01cc. max = 1 x 10 atm cc/s (b) Gross leak b) Test condition C Moisture resistance 1021 Omit initial conditioning Terminal strength 2036 As specified Electrical Measurements Subgroup 4 As specified (2) 1041 Salt atmosphere (corrosion) Covered by MIL883 ongoing group D programme Subgroup 5 Thermal Resistance Subgroup 6 Steady-state op life or Intermittent operation life or Blocking life 3131 For Transistors 3101 For Diodes 1026 1000hrs at max operating junction temp 1036 As specified (4) d 12 0 Electrical Measurements Subgroup 7 Internal Gas Analysis (2) Covered by MIL883B ongoing Group D programme (Quantity of Destructive samples that must be ordered is 18 devices) 1) Electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point measurements are not required. 2) Group C subgroup 4 and 7 are covered by MIL883B ongoing group D programme. These are not available on specific batches under QR205. If required, see QR217 3) The LTPD for solderability test applies to the number of leads inspected except in no case shall less than three devices be used to provide the number of leads required. 4) If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life test may be continued to 1000 hours in order to satisfy the Group C life test requirements. In such cases, either the 340 hour end point measurements must be made as a basis for Group B lot acceptance or the 1000 hour end point measurement shall be used as the basis for both Group B and Group C acceptance. 5) Internal Design Verification may be omitted if the devices have been manufactured by Semelab as sample pre-cap visual inspection will have been performed. 6) Samples from Subgroup 1 can be used. 19 DOC 2624 ISS 8 MIL-PRF-19500 – QR205, QR204 (Aerospace) (continued) 8.2 Screening Sequences: ‘Mil Processed’ Products (MIL-PRF-19500) QR204: Discrete Component Screening (with reference to MIL-STD-750) Description MIL-STD-750 method 1 Internal Visual (Precap) Inspection 2069 2070 2072 2 High temperature stabilisation bake 1032 3 Temperature Cycling 4 Constant acceleration 8 Device Serialisation 9 Interim electrical 10 11 Conditions JQR-A JQR-B 100% N/A 24 hrs min at rated maximum storage temperature 100% 100% 1051 20 cycles at -55°C to +175°C or max storage temp (whichever is lower) with a minimum cycle time of 16 minutes 100% 100% 2006 20,000G force in Y1axis for 1 min duration (see note 2) 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% (for drift calculations only) High temperature reverse bias a) Bipolar 1039 Test Condition A b) Power MOSFET 1042 Test Condition B c) Diodes 1038 Test Condition A Interim electrical Group A (read & record) Power burn-in a) Bipolar 1039 Test Condition B - 160 hrs min b) Power MOSFET 1042 Test Condition A - 160 hrs min c) Diodes 1038 Test Condition B - 96 hrs min d) Case mounted 1038 Test Condition A – 48 hrs min 12 Rectifiers 13 Final electrical Group A Read & Record +Drift check (1) Hermeticity 1071 Test condition H. -9 a) Fine <0.01cc. max = 5 x 10 atm cc/s, 14 -8 >0.01cc. max = 1 x 10 atm cc/s b) Gross 1071 Condition C Notes: 1) Group A end point tests are DC functional / parametric at 25°C (subgroup 2) of QR205. 2) 10000G force for devices with power rating >10 watts at Tc=25°C. 3) PDA (percentage defects allowable) is 10% between steps 9 & 11 and 11 & 13. 20 DOC 2624 ISS 8 9. MIL-PRF-19500 – QR216, QR217 (Space) 9.1 Space Level Processed Discrete Semiconductors (MIL-PRF-19500) QR217: ‘Space Level’ Full Quality Conformance Inspection. QR216: ‘Space Level’ Discrete Component Screening SEMELAB’s QR217 and QR216 processing specifications, in conjunction with the company’s ISO 9001:2000 approval present a viable alternative to American MIL-PRF-19500 space level parts supplied from a European manufacturer. QR217 (quality conformance) is based on the quality conformance inspection requirements of MIL-PRF-19500 groups A (table V), B (table VIa), C (table VII) and also ESA / ESCC 5000 (chart F4) lot validation tests. QR216 (screening) is based on the screening requirements of MIL-PRF-19500 (table IV) and also ESA /ESCC 5000 (chart F3). Details of QR217 and QR216 are included in the following pages. All manufacture and processing is carried out on our approved High-Rel assembly line in Lutterworth and product is released under our ISO 9001:2000 defence standard approval. The ‘standard’ JQRS part is processed to the Semelab data sheet, screened to QR216 and has conformance testing to Q217 groups A and B. Available options and the associated part number extensions are shown below. These are chargeable and must be specified at order stage. The extensions on the Semelab part numbers used reflect these additional items. Ordering Information: (example) Part Number Description 2N2369-JQRS QR217 groups A,B Marking (*) Screening to QR216 2N2369-JQRS * Where space permits Additional options: Customer Pre-Cap Visual Inspection Customer Buy-Off visit Data Pack -CVP -CVB -DA Group B charge Group B destructive mechanical samples -GRPB -GBDM (12 pieces) Group C charge Group C destructive electrical samples Group C destructive mechanical samples -GRPC -GCDE -GCDM (12 pieces) (6 pieces) Solderability Samples Scanning Electron Microscopy Radiography (X-ray) Total Dose Radiation Test -SS -SEM -XRAY -RAD Notes: 1) All ‘Additional Options’ are chargeable and must be specified at order stage. 2) When Group B or C is required, additional electrical and mechanical destructive samples must be ordered 3) All destructive samples are marked the same as other production parts unless otherwise requested. 21 DOC 2624 ISS 8 MIL-PRF-19500 – QR216, QR217 (Space) (continued) 9.2 QR217 Inspection Levels for ‘Space Level Processed’ Products QR217: Group A - Electrical Tests Subgroup Description 1 2 * small lot conformance Sample* Reject Visual + mechanical Inspection 20 0 DC electrical tests at 25°C 20 0 3 DC electrical tests. Hot & Cold temps as per device datasheet 45 0 4 AC electrical tests at 25°C 45 0 5 Safe Operating Area (Power Transistors) 8 0 Endpoint electrical measurements The specified parameters to be included in each subgroup shall be as per Semelab Data Sheet. Where no parameters are specified in a particular subgroup or test within a subgroup, no Group A testing is required for that subgroup or test to satisfy Group A requirements. A single sample may be used for all subgroup testing. These tests are considered non-destructive. QR217: Group B - Short term Environmental & Endurance Tests * small lot conformance Test note MIL-STD-750 method Condition Sample* Reject d=destructive Subgroup 1 Physical Dimensions 2066 As per specification 8 0 2026 (minimum 3 devices) 6 leads 0 1022 (Separate samples can be used) d 1056 Test condition B (25 cycles), (glass diodes only) 1051 Test condition C or max stg temp, whichever is less. 100 cycles. Subgroup 2 Solderability Resistant to solvents (3) (3) d 6 devices Subgroup 3 Thermal shock (liquid to liquid) Temperature Cycling (air to air) Hermetic seal (a) Fine Leak d 0 d 0 6 Test condition H. 1071 -9 <0.01cc. max = 5 x 10 atm cc/s, -8 (b) Gross leak >0.01cc. max = 1 x 10 atm cc/s Electrical Measurements Internal visual design verification (4) bond strength Die Shear Subgroup 4 / 5 Steady-state operation life or Intermittent operation life or Blocking life Electrical Measurements Subgroup 6 Thermal resistance 2075 Visual criteria in accordance with qualified design. 2037 (minimum 6 devices) 6 12 wires d d 0 2017 Parts from bond strength (min=6) 6 0 1027 340hrs at specified bias conditions 12 0 For Transistors For Diodes 6 0 340hrs high temperature storage As specified 12 0 (5) 1037 As specified 3131 3101 Subgroup 7 High temperature life (non operating) 1032 Electrical Measurements (Minimum quantity of destructive samples required is 12 pieces) (Full notes for numbered references are at the end of group C table) 22 DOC 2624 ISS 8 MIL-PRF-19500 – QR216, QR217 (Space) (continued) QR217: Group C - Periodic Inspection (chargeable option on request ) * small lot conformance Test note MIL-STD-750 method Condition Sample * Reject d=destructive Subgroup 1 2066 Dimensions per case outline specified 6 0 Thermal shock (glass strain) 1056 Test condition B (25 cycles), 6 d 0 Temperature Cycling (air to air) 1051 Test condition C or max storage temperature, whichever is less (45 cycles including screening) Shock 2016 Non-operating, 1500G, 0.5ms, 5 blows in each orientation, X1, Y1, Z1 (Y1 only for axial glass diodes) Vibration (variable frequency) 2056 Constant acceleration 2006 Physical dimensions Subgroup 2 & 3 Hermetic Seal 1 minute min. in X1,Y1,Z1 at 20000G min except at 10000G min if device ≥10W at TC=25°C Test condition H. (a) Fine Leak 1071 -9 <0.01cc. max = 5 x 10 atm cc/s, -8 >0.01cc. max = 1 x 10 atm cc/s (b) Gross leak b) Test condition C Moisture resistance 1021 Omit initial conditioning Terminal strength 2036 As specified Electrical Measurements Subgroup 4 As specified (2) see (2) 1041 Salt atmosphere (corrosion) Covered by MIL883 ongoing 6 d 0 6 0 group D programme Subgroup 5 Thermal Resistance Subgroup 6 Steady-state op life or Intermittent operation life or Blocking life 3131 For Transistors 3101 For Diodes 1026 1000hrs at max operating junction temp 1036 As specified (5) d 12 0 Electrical Measurements Subgroup 7 Internal Gas Analysis (2) see (2) Covered by MIL883B ongoing Group D programme d 0 d 1 3 5 (Minimum quantity of destructive samples required is 18 pieces) 1) 2) 3) 4) 5) 6) Individual subgroups may be performed on representative parts from the same package family. Group C subgroup 4 and 7 are covered by MIL883B ongoing group D programme. If customers require these subgroups to be done on the specific batch being covered, an additional ‘Grp C extra’ charge applies and an additional 11 destructive samples must be ordered. This must be specified at order stage. Electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point measurements are not required. Post burn-in electrical rejects may be used. If a given inspection lot undergoing Group B inspection has been selected to satisfy Grp C inspection requirements, the 340 hour life test may be continued to 1000 hrs to satisfy the Group C life test requirements. In such cases, either the 340 hour end point measurements must be made as a basis for Group B lot acceptance or the 1000 hour end point measurement shall be used as the basis for both Group B and Group C acceptance. Internal Visual Design Verification may be omitted if the devices have been manufactured by Semelab as sample pre-cap visual inspection will have been performed. 23 DOC 2624 ISS 8 MIL-PRF-19500 – QR216, QR217 (Space) (continued) 9.3 QR216: ‘Space Level’ Discrete Component Screening QR216: Discrete Component Screening (with reference to MIL-STD-750) MIL-STD750 method Description JQR-S 2069, 2070 2072 1 Internal Visual Inspection 2 Customer Pre Cap Visual Inspection 2069, 2070 2072 Customer specified option (chargeable) 100% 3 High temperature stabilisation bake 1032 24 hrs min at rated maximum storage temperature 100% 4 Temperature Cycling 1051 20 cycles at -55°C to +175°C or max storage temp (whichever is lower) with minimum 10 minutes dwell time 100% 5 Constant acceleration 2006 20,000G force in Y1axis for 1 min duration (see note 2) 100% 6 Particle Impact Noise Detection (PIND) 2052 (full yielded quantity) 100% 7 Device Serialisation Device serialisation is carried through to shipping. 8 Interim electrical Read & Record 9 10 (Pre-cap) Conditions 100% High temperature reverse bias a) Bipolar 1039 Test Condition A b) Power MOSFET 1042 Test Condition B c) Diodes 1038 Test Condition A Interim electrical (note 3) 100% 100% Read & Record, Drift Check 100% Power burn-in a) Bipolar 1039 Test Condition B - 240 hrs min b) Power MOSFET 1042 Test Condition A - 240 hrs min c) Diodes 1038 Test Condition B - 240 hrs min (4) 11 12 Final electricals (note 3) 13 a) Hermeticity – Fine b) Hermeticity - Gross 100% Read & Record, Drift check (1) 100% 1071 Test condition H. 100% 1071 <0.01cc. max = 5 x 10 atm cc/s, -9 100% -8 >0.01cc. max = 1 x 10 atm cc/s Condition C 14 Radiographic tests (X-Ray) 2076 15 External Visual Inspection 2071 Notes: 1) 2) 3) 4) (May be performed at any time after serialization) 100% QR217 Group A subgroups 2 and 3 end point tests as per device detail spec. 10000G force for devices with power rating >10 watts at Tc=25°C. PDA (percentage defects allowable) is 5% between steps 8 & 10 and 10 & 12. Zener diodes shall be subjected to high temperature reverse bias at 80 - 85 percent of nominal VZ for VZ > 10 V. Omit test for devices with VZ ≤ 10 V. For JQRS case mounted rectifiers condition A is required. 24 DOC 2624 ISS 8 10. ESA/ESCC - Space Level Product Semelab’s Space Quality Level Products are based on the testing procedures specified in the generic ESCC 5000 issue 3 and in the corresponding Detail Specifications. All manufacture and processing is carried out on our approved High-Rel assembly line in our Lutterworth factory and product is released under our ISO 9001:2000 defence standard approval. The table below shows the additional options which may be required by the customer. All items must be agreed and specified at order stage. The following pages show the generic chart F2 (component lot manufacturing), chart F3 (screening) and chart F4 (Validation) requirements. Additional options: Customer Pre-Cap Visual Inspection Customer Buy-Off visit Data Pack -CVP -CVB -DA Lot Validation Testing (subgroup 1) charge LVT1 destructive samples (electrical) LVT1 destructive samples (mechanical) -LVT1 -L1DE -L1DM (normally 15 pieces) (normally 15 pieces) Lot Validation Testing (subgroup 2) charge LVT2 destructive samples (electrical) -LVT2 -L2D (normally 15 pieces) Lot Validation Testing (subgroup 3) charge LVT3 destructive samples (mechanical) -LVT3 (normally 5 pieces) Scanning Electron Microscopy (SEM) Radiography (X-ray) Total Dose Radiation tests -SEM -XRAY -RAD Notes: 1) All ‘Additional Options’ must be specified at order stage 2) All ‘Additional Options’ are chargeable 3) All destructive samples are marked the same as other production parts unless otherwise requested. 25 DOC 2624 ISS 8 ESA/ESCC (Space Level Flow) (continued) 10.1 Chart F2 - Production Control (ESCC 5000 issue 3) Component Lot manufacturing Wafer lot Acceptance para 5.3.1 Process monitoring Review para 5.3.2 SEM Inspection (1,3) para 5.3.3 Total Dose Rad Testing (1,4) Special In - Process controls Para 5.2.1 Internal Visual inspection (Pre-cap Inspection) Para 5.2.1 Bond Strength(Pre-cap Inspection) (1) Para 5.2.1 Die Shear(Pre-cap Inspection) (1) Para 5.2.1 Encapsulation (Pre-cap Inspection) (1) Para 5.2.1 Dimension check (1) Para 5.2.3 Weight (2) To Chart F3 (Screening) Notes: 1) 2) 3) 4) Performed on a sample basis. Guaranteed but not tested. If specified in the detail specification. If specified in the detail specification and required in the Purchase Order. 26 DOC 2624 ISS 8 10.2 ESA/ESCC - Chart F3 Screening (ESCC 5000 issue 3) Components from Production Control para 8.5 High Temperature Stabilisation Bake Electrical Test para 8.6.1 (11) Temperature Cycling Acceleration (10) para 8.7 Particle Impact Noise Detection (PIND) para 8.22 Verification of Safe Operating Area para 8.9.1 Electrical Measurements, Serialisation and Parameter Drift Values (Initial Measurements) (1) para 8.20 High Temperature Reverse Bias Burn-In (2) para 8.9.1 Parameter Drift Values HTRB Final and Power Burn-In Initial Measurements (4) para 8.21 Power Burn-In (2) para 8.9.1 Parameter Drift Values (Final Measurements) (4) para 8.9.2 High and Low Temperature Electrical Measurements (2,3) (4,5) Hot Solder Dip (if applicable) (6) para 8.3 Radiographic Inspection (9) para 8.8.1&2 Seal (Fine & Gross Leak) para 8.9.3 Room Temp Electrical Measurements (including AC) para 6.4.1 Check for Lot Failure para 8.10 External Visual Inspection para 8.16 Solderability (4,7) (8) (4,5) To Chart F4 (Validation Testing) Notes: 1) 2) 3) 4) 5) 6) 7) 8) All components shall be serialised prior to Initial Electrical Measurement. If specified in detail spec. Can be performed at any time prior to initial measurements of Parametric Drift values. The Lot Failure criteria of paragraph 6.4 applies to this test. Performed on a sample basis. Can be performed at any time prior to Room Temp Electrical Measurements during screening (prior to Seal test). Measurements of parametric Drift Values need not be repeated in Room Temperature Electrical measurements. Check for Lot Failure shall take into account all electrical parameter failures that may occur during screening. tests in accordance with paragraph 8.9.1, 8.9.2, 8.9.3 subsequent to HTRB Burn-In. 9) Radiographic Inspection may be performed at any point during Screening Tests. 10) Not specified in ESCC 5000 iss 3, but performed by Semelab to MIL-STD-750 method 2006. 11) Not specified in ESCC 5000 iss 3, but performed by Semelab as a process monitor. 27 DOC 2624 ISS 8 ESA/ESCC (Space Level Flow) (continued) 10.3 Chart F4 - Validation Testing (ESCC Generic Specification 5000 issue 3) Components for Validation LVT 1 (Subgroup 1) LVT 2 (Subgroup 2) LVT 3 (Subgroup 3) Mechanical & Environmental Endurance Assembly Capability 5 Components 15 Components 15 Components 15 Components Mechanical Shock para 8.11 Thermal Shock (2) para 8.14 Vibration para 8.12 Temp Cycling (3) para 8.6.2 Operating Life (4) 2000 hours data points: 0,1000, 2000 hrs para 8.19 Constant Acceleration para 8.13 Moisture Resistance para 8.15 Immediate & End Point electrical Measurements para 8.9.4 Internal Visual Inspection para 8.1 Seal para 8.8.1 & 8.8.2 Seal para 8.8.1 & 8.8.2 Seal para 8.8.1 & 8.8.2 Bond Strength para 8.2.1 Immediate & End Point electrical Measurements para 8.9.4 Immediate & End Point electrical Measurements para 8.9.4 External Visual Inspection para 8.10 Die Shear para 8.2.2 External Visual Inspection para 8.10 External Visual Inspection para 8.10 Permanence of Marking para 8.17 LVT 1 (Subgroup 1) Lot Validation LVT 2 (Subgroup 2) Lot Validation Terminal Strength para 8.18 LVT 3 (Subgroup 3) Lot Validation Notes: 1) 2) 3) 4) ESCC 5000 iss 3 table F4 - Qualification & Periodic Testing becomes ‘Validation Testing’ for non qualified parts. Only applicable to axial diodes. Not applicable to axial lead glass diodes. Variance in Test method based on product type. Ordering Information: 1) 2) 3) 4) Order for Subgroup 1 (includes subgroups 2 & 3) requires order for 50 (30+15+5) destructive samples. Order for Subgroup 2 (includes subgroup 3) requires order for 20 (15+5) destructive samples. Order for Subgroup 3 requires order for 5 destructive samples. Other Ordering Options are available - please contact Semelab Sales. 28 DOC 2624 ISS 8 11. Screening & Approval Comparison Tables 11.1 Comparison of Space Level Screening Options Space Level Flow Comparison Table GENERIC Screening Stage: QR216 ESCC JANS* JQRS • • • OPT OPT OPT 24 hrs 24 hrs 24hrs Temperature cycling 20 cycles 20 cycles 20 cycles Thermal impedance OPT - Serialization • • • • • • • • • • • Interim Electrical Measurements - - - HTRB • • • • • • Electrical Measurements - - - Parametric Drift measurements (Read and Record / Drift) • • • min 168 hrs max 264 hrs 240 hrs 240hrs - - - • • • • • • • • • • • • • • • • • • • • • Pre-cap Visual Customer pre-cap Visual High Temp Storage (Stabilization Bake) ■ Constant Acceleration PIND Fine/Gross Leak Interim Electrical Measurements (Read and Record / Drift) Burn-In Electrical Measurements Parameter Drift Measurements (Read and Record) PDA Calculations Read and Record Test Data Other Electrical Parameters (Temp, Dynamic) Fine/Gross Leak Radiography External Visual Inspection *JANS part not available from Semelab. Notes: if specified in detail specification. ■ not specified in ESCC 5000 iss 3, but performed by Semelab. 29 DOC 2624 ISS 8 Screening & Approval Comparison Tables 11.2 Comparison of Space Level die lot approval procedures. The table below shows a comparison of operations carried out for die approval within the generic approval systems (MIL-PRF-19500 space level and ESA / ESCC 5000. It must be noted that SEM and RHA total dose evaluation are options which must be specified if required carry an additional charge Space Level/ Die Lot Acceptance Table GENERIC Die Lot Acceptance SML ESCC JANS JQR-S Selected Wafer • • • Probe Test (100%) • • • Glassivation / Metalisation Inspection • • • Visual Inspection (100%) • • • Sample Assembly (10 pcs) • • • Stabilization • • • Temperature Cycling • • • Electrical Test (read/record) • • • HTRB • • • Electrical Test (read/record) • • • Steady State Life (1000 hrs) • • • Electrical Test (read/record) • • • Wire Bond Evaluation • • • Die Shear Evaluation • • • SEM OPT OPT OPT RHA Total Dose Evaluation OPT OPT OPT 30 DOC 2624 ISS 8 Screening & Approval Comparison Tables 11.3 Comparison of High-Rel Screening Options (Discrete Devices) The table below shows the comparison of screening options available within the CECC, BS and MIL approvals. Comparison is also shown with Semelab’s in-house QR204 options. CECC / QR209 • • • B • • • • 10 10 cycles cycles 5 5 5 cycles cycles cycles Temperature Cycle A C D • JAN* TX High Temp Storage D MIL JAN* TXV • C JQRB Pre-cap Visual B QR204 JQRA A BS 9300 • • • • • • 10 cycles 20 cycles 20 cycles 20 cycles 20 cycles • • • • • • • • • • Fine Leak test • • • • • • • • • • Gross Leak Test • • • • • • • • • • ± ± ± ± • • • • ± ± ± ± Constant Acceleration Particle impact noise detection (PIND) Device Serialisation • Variables Electrical test • • • • • 168 72 48 160 72 48 48 hrs∗ hrs∗ hrs∗ hrs∗ hrs∗ hrs∗ hrs∗ Attributes Electrical tests Burn-In (HTRB) • Variables Electrical test • • • • 168 72 48 160 72 48 48 160 160 160 160 hrs∗ hrs∗ hrs∗ hrs∗ hrs∗ hrs∗ hrs∗ hrs hrs hrs hrs ± ± ± ± • • • • Attributes Electrical tests Burn-In (Power) • Variables Electrical test Attributes Electrical tests • • • • • • • • Radiographic tests • Test Performed ± Test Performed if required by device detail specification 24 hours for PNP devices. 48 hours for NPN devices ∗ High Temp Reverse Bias for Case rated devices Power Burn-in for Ambient rated Devices CECC / QR209 : Screening carried out in accordance with CECC 50000 Appendix 6 BS : Screening carried out in accordance with BS9300 section 1.2.10 QR216 : Screening carried out in accordance with Semelab QR216 QR204 : Screening carried out in accordance with Semelab QR204 MIL : Screening carried out in accordance with MIL-PRF-19500 (Table 2) * full JANTX, JANTXV not available from Semelab 31 DOC 2624 ISS 8