ROITHNER VL400

VL400-EMITTER
TECHNICAL DATA
High Power UV LED, Emitter
Features
•
•
•
•
•
Zener diode is built in the protective circuit against static electricity
Low Voltage DC Operated
High Power Intensity
Lambertian Radiation Pattern
Instant light (less than 100ns)
Specifications (25°C)
Item
Absolute Maximum Ratings
DC Forward Current
Peak Pulse Forward Current *
Reverse Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature (for 5 sec.)
Symbol
Value
Unit
IF
IFP
UR
PD
TOP
TSTG
TSOL
350
500
5
1300
-40 … +105
-40 … +120
260 ± 5
mA
mA
V
mW
°C
°C
°C
* Note: 1/10 duty cycle at 1KHz
Item
Optical Specifications
CW Output Power *1
Peak Wavelength *2
Viewing Angle
Electrical Specifications
Forward Current
Forward Voltage *3
Symbol
Min.
Typ.
Max.
Unit
PO
λP
φ
250
395
400
140
350
405
mW
nm
deg.
IF
VF
3.2
350
-
4.2
mA
V
* Note:
1. Peak wavelength measurement allowance is ± 2 nm
2. Optical ouput measurement allowance is ± 10%
3. Forward voltage measurement allowance is ± 0.2 V
Outline Dimensons (Unit: mm, Tolerance: ±0.2 mm)
* Note: the anode of the devise is denoted by a hole in the lead frame
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Typical Performance Curves
Relative Intensity vs. Wavelength
Forward Voltage vs.
Forward Current
Forward Voltage vs. Forward Current
Radiation Pattern
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Reliability
No.
Test Item
Test Conditions
Note
Sample
Pass
1
Room Temperature
Operating Life
Ta=25°C, IF=350mA
1000 hrs.
20
OK
2
Solder Heat Resistance
260±5°C, 5secs
20
OK
3
High Temperature /
High Humidity Operation Life
Ta=85°C, RH=85%, IF=350mA
1000 hrs.
20
OK
4
Temperature Cycle
200 Cycles
20
OK
5
Themal Shock
200 Cycles
20
OK
6
High Temperature Storage
Tstg=120°C
1000 hrs.
20
OK
7
Low Temperature Storage
Tstg=-40°C
1000 hrs.
20
OK
8
Variable Vibration Frequency
20
OK
9
Mechanical Shock
20
OK
10
Natural Drop
20
OK
-40°C … +105°C,
30 min dwell, 5 min transfer
-40°C … +105°C,
20 min dwell, 20 sec transfer
10-2000-10Hz
20G 1 min, 1.5mm, 3timesx/axis
1500G, 0.5msec pulse,
5 shocks each 6 axis
On concrete from 1.2m, 3xtimes
Conclusions:
1. The reliability tests were designed to evaluate both package integrity as well as workability
of product performance over time.
2. All samples have done well by competed test required and passed all the qualification
criteria with zero failure. From design standpoint, this package is robust enough to meet it’s
data sheet conditions.
3. Based on the food result shown on the above test, this product is qualified and released for
market.
Precaution for Use
1. Cautions
• This device is a UV LED, which radiates UV light during operation.
• DO NOT look directly into the UV light or look through the optical system. To prevent in
adequate exposure of UV radiation, wear UV protective glasses.
2. Reflow Soldering Characteristics
Profile Feature
Sn-Pd Eutectic Assembly Lead(Pb)-Free Assembly
Average Ramp-Up Rate (TSmax to TP)
3°C / second max.
3°C / second max.
Preheat Temperature Min (TSmin)
100°C
150°C
Preheat Temperature Max (Tsmax)
150°C
200°C
Preheat Time (tsmin to tsmax)
60-120 seconds
60-180 seconds
Time maintained above Temperature (TL)
183°C
217°C
Time maintained above Time (tL)
60-150 seconds
60-150 seconds
Peak / Classifivation Temperature (TP)
240°C
260°C
Time Within 5°C of Actual Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-Down Rate
6°C / second max.
6°C / second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
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Lead Solder
Lead-Free Solder
Classification Reflow Profile (JEDEC J-STD-020C)
Classification Reflow Profile (JEDEC J-STD-020C)
Recommended Soldering Pattern
Note:
•
Electrical isolation is required between Slug
and solder Pad.
•
For optimal thermal performance, macimize
board metalization at heat slug contact.
•
Reflow soldering should not be done more
than one time.
•
When soldering, do not put stress on the
emitters during heating.
•
After soldering, do not warp the circuit board
3. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
4. Heat Generation
• The powered LEDs generate heat. Heat dissipation should be considered in the application
design to avoid the environmental conditions for operation in excess of the absolute
maximum ratings.
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