SY89482L

SY89482L
3.3V, 622MHz to 694MHz CML Jitter
Attenuator with Internal Termination
General Description
The SY89482L is a 3.3V, fully differential CML jitter
attenuator that accepts a noisy clock between 622MHz
and 694MHz, and provides an ultra-low jitter of the input
clock signal. Output jitter is typically 1psRMS. The
SY89482L includes a 1kHz to 10kHz programmable
loop bandwidth so it can accommodate different jitter
attenuation applications and PLL requirements.
The differential input includes Micrel’s unique, 3-pin
input termination architecture that interfaces to LVPECL,
LVDS or CML differential signals, (AC-coupled or DCcoupled) as small as 100mV without any level-shifting or
termination resistor networks in the signal path. For ACcoupled input interface applications, an on-board output
reference voltage (VREF-AC) is provided to bias the VT pin.
The outputs are compatible with 400mV typical swing
into 50Ω loads, with rise/fall times guaranteed to be less
than 250ps
The SY89482L operates at 3.3V ±10% supply and the
output can accommodate 1.8V-3.3V operation with the
dedicated output supply. The part is guaranteed to
operate over the full industrial temperature range
(–40°C to +85°C). The SY89482L is part of Micrel’s
Precision Edge® product line.
Datasheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
Precision Edge®
Features
ƒ Input frequency matched, low-jitter output
ƒ I/O frequency range: 622MHz – 694MHz
ƒ Ultra-low phase noise and jitter performance
– <2psRMS output jitter gen (12 kHz-20MHz)
– Low phase noise: -80dBc/Hz at 1 kHz offset
ƒ CML-compatible output signal
ƒ 3-pin input accepts an AC- or DC-coupled differential
input (LVDS, LVPECL, and CML)
ƒ Unique, Auto-Tune circuitry enables precision
frequency calibration.
ƒ Internal source termination to minimize round-trip
reflections
ƒ Programmable loop bandwidth: 1kHz-10kHz
ƒ Output enable/disable function
ƒ Includes Loss of Lock (LOL) output pin
ƒ 1.8V ±5% to 3.3V ±10% output power supply
ƒ 3.3V ±10% power supply operation
ƒ Industrial temperature range: –40°C to +85°C
ƒ Available in 24-pin (4mm x 4mm) QFN package
Applications
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
SONET/SDH Communications
10GbE FEC
10GbE LAN PHY
High-end Routers
Add-Drop MUXes
SAS/SATA
Precision Edge is a registered trademark of Micrel, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
April 2008
M9999-040808-A
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SY89482L
Functional Block Diagram
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Ordering Information(1)
Part Number
Package
Type
Operating
Range
Package Marking
Lead
Finish
SY89482LMG
QFN-24
Industrial
482L
with Pb-Free bar-line indicator
NiPdAu
Pb-Free
SY89482LMGTR(2)
QFN-24
Industrial
482L
with Pb-Free bar-line indicator
NiPdAu
Pb-Free
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC Electricals only.
2. Tape and Reel.
VDDA
FILTERN
FILTERP
VDDA
GNDA
VDDO
Pin Configuration
GNDA
VT
VREF-AC
BW1
REFIN
BW0
/REFIN
RESET
LOL
VDDC
/EN
VDDO
/CLKOUT
CLKOUT
VDDO
GND
GNDO
GND
24-Pin QFN
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SY89482L
Pin Description
Pin Number
Pin Name
1
VT
Input Termination Center-Tap: Each side of the differential input pair terminates to VT pin.
This pin provides a center-tap to a termination network for maximum interface flexibility. See
“Input Interface Applications” subsection.
2
VREF-AC
Reference Output Voltage: This output biases to VDD-1.4V. It is used when AC-coupling the
inputs (IN, /IN). Connect VREF-AC directly to the VT pin. Bypass with 0.01uF low ESR
capacitors to VDD. Maximum current source or sink is ±0.5mA. See “Input Interface
Applications” subsection.
3, 4
REFIN,
Differential Input Pair: This input pair is the differential signal input to the device. Input
accepts AC- or DC-coupled differential signals as small as 100mV (200mVpp). Each pin of
this pair internally terminates with 50Ω to the VT pin. See Figure 2a.
/REFIN
12
/EN
6, 13
GND,
Exposed Pad
9, 10
CLKOUT,
/CLKOUT
Pin Function
Single-ended Input: This TTL/CMOS input disables and enables the output. It has an internal
pull-down and will default to a logic LOW state if left open. When HIGH, the output is forced
into the disable state (Q = LOW and /Q = HIGH). The pull-down current is typically 0.5µA.
Ground: These are the ground pins for core and input stage. Exposed pad must be
connected to a ground plane that is the same potential as the ground pin.
CML Differential Output Pair: Differential buffered output copy of the input signal with very
low jitter. The output swing is typically 400mV. The output pair is referenced to VDDO. Output
pair can be terminated 100Ω across or 50Ω to VBIAS. See “CML Output Termination”
subsection. See Figure 2b.
7
GNDO
Ground: This is the ground pin for output stage. GNDO and GND must be connected
together on the PCB.
8, 11
VDDO
CML Output Driver Power Pins: VDDO enables the output stage to operate from a lower
supply voltage than the core synthesizer voltage. These outputs can be powered from 1.8V
±5% to 3.3V ±10% power supply. For applications that only require 3.3V reference output
operation, VDDO and VDD pins may be connected to a common power supply. Connect both
VDDO pins to same power supply. Bypass with 0.1uF//0.01uF low ESR capacitors as close
to the VDD pins as possible.
15
RESET
Single-ended Input: Reset is active on the Low-to-High edge of the input pulse. It has an
internal pull-down and will default to a logic LOW state if left open. Resetting the part starts
an auto-tune sequence to provide output frequency closest to input frequency. Calibration
setting is lost on power down. The pull-down current is typically 0.5µA.
14
LOL
Single-ended Output: This LVTTL/CMOS output asserts HIGH when the PLL is out of phase
lock. LOL is asserted if the PLL frequency deviates more than ±1000ppm for more than 5ms.
This prevents false triggering. The Loss of Lock pin can be directly connected to /EN.
20, 21
FILTERN,
FILTERP
Analog Input: These pins provide reference for PLL loop filter. Connect a LOW ESR capacitor
across these pins as close to the device as possible, clear from any supply lines or adjacent
signal lines. See “External Loop Filter Considerations” for loop filter values. Loop filter
capacitor value depends on I/O frequency selection. Loop filter capacitor layout should
include a quiet ground plane under the loop filter capacitor and loop filter (FILTERP,
FILTERN) pins. Recommend 1206, X5R, 6.3V ceramic type, +/-30%. See “PLL Loop Filter
Capacitor Table”.
18, 23
GNDA
Ground: This is an analog ground pin for the PLL. Connect to “quiet” ground. It is internally
referenced to the VCO. GNDA and Ground must be shorted on the PCB.
19, 22
VDDA
Analog Power: Connect to “quiet” 3.3V ±10% power supply. These pins are not internally
connected and must be shorted on the PCB. VDDA internally connects to the VCO. Bypass
with 0.1µF//0.01µF low ESR capacitors as close to the pin as possible
16, 17
BW0, BW1
5, 24
VDDC
April 2008
Single-ended Input: These LVTTL/CMOS inputs determine the loop bandwidth of the jitter
reducing PLL. BWSEL0 and BWSEL1 will default to a logic HIGH state if left open with a
typical pull-up current of 1.3µA. See “Loop Bandwidth Table.”
Positive Power Supply: VDDC pins are connected to core and input stage that connects to a
3.3V ±10% power supply. Bypass with 0.1µF//0.01µF low ESR capacitors as close to the VCC
pins as possible.
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BW1
BW0
Nominal Loop Bandwidth (Hz)
0
0
1k
0
1
2k
1
0
5k
1
1
10k
Table 1. Loop Bandwidth Table
BW Code
00
01
10
11
BW (kHz)
1
2
5
10
Cext (uF)
4.7
1
0.22
0.15
Table 2. PLL Loop Filter Capacitor Table
Offset/loop BW
1kHz
2kHz
5kHz
10kHz
Units
100Hz offset
-50
-55
-70
-75
dBc/Hz
1kHz offset
-65
-65
-75
-80
dBc/Hz
10kHz offset
-90
-90
-90
-90
dBc/Hz
100kHz offset
-115
-110
-110
-115
dBc/Hz
Table 3. Typical Phase Noise Performance (622MHz Input, 622MHz Output)
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SY89482L
Absolute Maximum Ratings(1)
Operating Ratings(3)
Supply Voltage (VDDA,, VDD, VDDO)............. –0.5V to +4.0V
Input Voltage (VIN) ..........................–0.5V to VDDC + 0.4V
CML Output Voltage (VOUT) .............-0.5V to VDDO + 0.4V
CML Output Current (IOUT)
Continuous.......................................................50mA
Surge .............................................................100mA
Current (VT)
Source or sink on VT pin .............................±100mA
Input Current
Source or sink Current on (Ref-IN, /Ref-IN) ..±50mA
Current (VREF)
Source or sink current on VREF-AC(2) ..............±1.5mA
Maximum Junction Temperature........................... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) ....................–65°C to +150°C
ESD (Human Body Model)....................................2000V
Supply Voltage (VDDA, VDD)................. +3.0V to +3.60V
Output Supply Voltage (VDDO).......... +1.71V to +3.60V
Ambient Temperature (TA).................. –40°C to +85°C
Package Thermal Resistance(4)
QFN
Still-air (θJA) ...........................................50°C/W
Junction-to-board (ψJB) .......................30.5°C/W
DC Electrical Characteristics(5)
VDD = 3.3V + 10%, GND = 0V; TA = –40°C to +85°C, RL is 100Ω across the output pair, unless otherwise stated.
Symbol
Parameter
VDD
Power Supply Voltage Range
Condition
Min
Typ
Max
Units
3.0
3.3
3.6
V
3.6
V
85
110
mA
100
115
Ω
VDDO
Output Voltage Range
Isy
Total Supply Current
1.71
RDIFF_IN
Differential Input Resistance
(Ref-IN-to-/Ref-IN)
VIH
Input HIGH Voltage
(Ref-IN-to-/Ref-IN)
Ref-IN, /Ref-IN
1.2
VCC
V
VIL
Input LOW Voltage
(Ref-IN, /Ref-IN)
Ref-IN, /Ref-IN
0
VIH–0.1
V
VIN
Input Voltage Swing
(Ref-IN, /Ref-IN)
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
(|Ref-IN – /Ref-IN|)
VREF-AC
Output Reference Voltage
VT_IN
Voltage from Input to VT
No load, max. VCC
85
Note 6
0.2
V
VDD–1.5
VDD–1.4
VDD–1.3
V
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. Due to the limited drive capability, use for input of the same package only.
3. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ψJB and θJA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIN (max) is specified when VT is floating.
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SY89482L
CML Output DC Electrical Characteristics(7)
VDDA, VDD =+3.3V ±10%, VDDO = +1.71V to 3.6V, GND and GNDO = 0V, RL = 100Ω across the outputs; TA = –40°C to
+85°C, unless otherwise stated.
Symbol
Parameter
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VOUT
Output Voltage Swing
VDIFF_OUT
Differential Output Voltage Swing
ROUT
Output Source Impedance
Condition
Min
Typ
Max
Units
RL = 50Ω to VDDO
VDDO-0.13
VDDO-0.085
VDDO-0.04
V
RL = 50Ω to VDDO
VDDO-0.63
VDDO-0.485
VDDO-0.34
V
See Figure 3a
300
400
500
mV
See Figure 3b
600
800
1000
mV
40
50
60
Ω
Typ
Max
Units
LVTTL/CMOS DC Electrical Characteristics(7)
VDDC = 3.3V ±10%, GND = 0V, TA = –40°C to + 85°C, unless otherwise stated.
Symbol
Parameter
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Condition
Min
2
IIN
Input Leakage Current
0V < VIN < 3.6V
VOH
Output High Voltage
IOH/IOL < 4 mA
VOL
Output Low Voltage
IOH/IOL < 4 mA
V
0.8
V
+5
µA
2.4
V
0.4
V
IIH
Input HIGH Current
-1
3
µA
IIL
Input LOW Current
-5
1
µA
Notes:
7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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AC Electrical Characteristics
VDDA, VDDC =+3.3V ±10%, GND and GNDO = 0V, RL = 100Ω across the outputs; Input tr/tf < 400ps; TA = –40°C to
+85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
fRANGE
I/O Frequency Range
VIN > 100mV, VOUT > 200mV
Clock
fVCO
Internal VCO frequency
LOL
Maximum I/O frequency
PLL out of Lock, ~4ms sustained
I/O difference
TLOCK
Acquisition Lock Time(8)
Max
Units
622
694
MHz
1244
1388
MHz
-1000
1000
ppm
Min VCO frequency
450
ms
Max VCO frequency
550
ms
400
ps
REFIN
tr, tf
Input Rise/Fall Times
20% to 80%
CLKOUT
tr, tf
Output Rise/Fall Times
20% to 80%
110
RefIn
CDuty
Input Duty Cycle
40
CLKOut
CDuty
Output Duty Cycle
48
BW
Loop Bandwidth, locked
BW1 = 0, BW0 = 0
BW1 = 0, BW0 = 1
Typ
160
250
ps
60
%
50
52
%
750
1000
1250
Hz
1500
2000
2500
Hz
BW1 = 1, BW0 = 0
3750
5000
6250
Hz
BW1 = 1, BW0 = 1
7500
10000
12500
Hz
Notes:
8. Reset Low-to-High to LOL High-to-Low.
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Jitter Characteristics(9)
VDDA, VDD =+3.3V ±10%, GND= 0V, RL = 100Ω across the outputs; Input tr/tf < 400ps; TA = –40°C to +85°C, unless
otherwise stated. Contact factory for 1kHz and 2kHz Loop Bandwidth Transfer Characteristics.
BW Setting: 1kHz, BW1:0 = 00
Symbol
JGen
Parameter
Condition
CLKOUT RMS Jitter Generation
Min
Typ
Max
12kHz to 20MHz
(Ideal ref input and supply)
1
2
50kHz to 80MHz
(Ideal ref input and supply)
1
2
JTOL
Jitter Tolerance
FBW
Jitter Transfer Bandwidth
LBW = 1kHz
JP
Jitter Peaking
<1kHz
Units
psRMS
10
ns
1000
Hz
0.1
dB
Typ
Max
Units
BW Setting: 2kHz, BW1:0 = 01
Symbol
Parameter
Condition
Min
JGen
CLKOUT RMS Jitter Generation
12kHz to 20MHz
(Ideal ref input and supply)
1
2
50kHz to 80MHz
(Ideal ref input and supply)
1
2
JTOL
Jitter Tolerance
FBW
Jitter Transfer Bandwidth
LBW = 2kHz
JP
Jitter Peaking
<1kHz
psRMS
10
ns
2000
Hz
0.1
dB
Typ
Max
Units
BW Setting: 5kHz, BW1:0 = 10
Symbol
Parameter
Condition
Min
JGen
CLKOUT RMS Jitter Generation
12kHz to 20MHz
(Ideal ref input and supply)
1
2
50kHz to 80MHz
(Ideal ref input and supply)
1
2
JTOL
Jitter Tolerance
FBW
Jitter Transfer Bandwidth
LBW = 5kHz
JP
Jitter Peaking
<1kHz
psRMS
10
ns
5000
Hz
0.1
dB
Typ
Max
Units
BW Setting: 10kHz, BW1:0 = 11
Symbol
Parameter
Condition
Min
JGen
CLKOUT RMS Jitter Generation
12kHz to 20MHz
(Ideal ref input and supply)
1
2
50kHz to 80MHz
(Ideal ref input and supply)
1
2
JTOL
Jitter Tolerance
FBW
Jitter Transfer Bandwidth
LBW = 10kHz
JP
Jitter Peaking
<1kHz
psRMS
10
ns
10,000
Hz
0.1
dB
Note:
9. 5k and 10k loop bandwidth settings are recommended due to better jitter performance with jitter bandwidth below 12K Hz. The use of 1k and
2k bandwidth settings may be acceptable in certain applications where jitter bandwidth is limited to above 12K Hz. Please contact the factory
for additional information.
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Functional Description
Overall Function
The SY89482L is designed to accept a high-jitter
signal and provide ultra-low jitter CML-compatible
clock signal. Unlike normal buffers, SY89482L does
not transfer jitter across making it an ideal solution for
precision clock applications.
LC Voltage Control Oscillator (VCO)
The SY89482L uses an extremely low phase noise
VCO to prevent jitter at the output. At low frequencies,
the PLL produces more phase noise. To offset this
additional noise, the LC VCO provides an extremely
low phase noise signal that feeds to an output circuit.
Unlike many competitive VCOs, this VCO does not
require any external components.
External Loop Filter Considerations
The SY89482L features an external PLL loop filter
that allows users to tailor the PLLs behavior. It is
recommended that ceramic capacitors with NOP or
X7R dielectric be used because they have very low
effective series resistance. The SY89482L uses only a
single external filter capacitor. All other filter
components are on-chip. Internally, the filter has a
resistor in series with the external capacitor and a
much smaller capacitor in parallel with the series
combination of the internal resistor and external
capacitor. The selectable PLL bandwidths from 1kHzto-10kHz allows the user to select between different
loop filter values. The external capacitor must be
placed as close to the device pins as possible. While
laying out the board, keep any supply or signal traces
lines away from the capacitor. Loop filter capacitor
layout should include a quiet ground plane under the
loop filter capacitor and loop filter pins.
SY89482L
Power Supply Filtering Techniques
As with any high-speed integrated circuit, power
supply filtering is very important. At a minimum,
VDDA, VDD, and all VDDO pins should be individually
connected using via to the power supply plane, and
separate bypass capacitors should be used for each
pin. To achieve optimal jitter performance, each power
supply pin should use separate instances of the circuit
shown in Power Supply Scheme, Figure 1, below.
Figure 1. Power Supply Scheme
Auto-Tuning
The SY89482L has an auto-tune circuit that enables
precision frequency calibration. Auto-tuning is initiated
on a LOW to HIGH transition on the RESET input.
Auto-tuning is also initiated during power-up. Autotune requires a valid reference input.
Jitter Generation
Jitter generation is the amount of jitter generated by
the part at the output when there is no jitter present at
the input clock. While the VCO and PLL are sources
of jitter in a synthesizer, the different loop bandwidth
options aid in reducing jitter. The SY89482L
guarantees less than 2psRMS. See Jitter characteristics
subsection.
Phase Noise
The SY89482L has very low phase noise at 1kHz
offset from the center frequency. Phase noise is
measured at the output with a jitter-free signal injected
at the input. The loop bandwidth settings have a minor
impact on the phase noise values. For 10kHz loop
bandwidth, Micrel guarantees the phase noise less
than -80dBc/Hz. See Phase Noise curve.
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Phase Noise Characteristics
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Input and Output Stage
SY89482L
Single-Ended and Differential Swings
Figure 3a. Single-Ended Swing
Figure 2a. Simplified Differential Input Buffer
Figure 3b. Differential Swing
Figure 2b. Simplified CML Output Buffer
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Input Interface Applications
Figure 4a. CML Interface
(DC-Coupled)
Figure 4b. CML Interface
(AC-Coupled)
Figure 4c. LVPECL Interface
(DC-Coupled)
Option: May connect VT to VCC
Figure 4d. LVPECL Interface
(AC-Coupled)
April 2008
Figure 4e. LVDS Interface
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CML Output Termination
Figure 5a. CML DC-Coupled Termination
Figure 5b. CML DC-Coupled Termination
Figure 5c. CML AC-Coupled Termination
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Package Information
24-Pin (4mm x 4mm) QFN
Packages Notes:
1. Package meets Level 2 Moisture Sensitivity Classification.
2. All parts are dry-packed before shipment.
3. Exposed pad must be soldered to ground for proper thermal management
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PCB Thermal Consideration for 24-pin QFN Package
(Always solder, or equivalent, the exposed pad to the PCB)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for
surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury
to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and
Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2008 Micrel, Incorporated.
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