SunLED

Part Number: ZDGMECBD45S-B
3.5X2.8mm SURFACE MOUNT SMD CHIP LED
www.SunLED.com
Package Schematics
Features
● Ideal for indication light on hand held products
● Long life and robust package
● Standard Package: 2,000pcs/ Reel
● MSL (Moisture Sensitivity Level): 3
● RoHS compliant
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
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Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. Specifications are subject to change without notice.
Absolute Maximum Ratings
(TA=25°C)
Reverse Voltage
VR
Forward Current
IF
Forward Current (Peak)
1/10 Duty Cycle
0.1ms Pulse Width
iFS
Power Dissipation
PD
Electrostatic Discharge Threshold
(HBM)
Operating Temperature
Storage Temperature
TA
Tstg
DG
(InGa
N)
ME
(AlGaIn
P)
CBD
(InGa
N)
Unit
5
5
5
V
30
50
30
mA
150
195
150
mA
123
125
120
mW
450
-
250
V
-40 ~ +85
°C
ZDGMECBD45S-B
Emitting
Color
Emitting
Material
Green
InGaN
Red
AlGaInP
Blue
InGaN
ME
CBD
(AlGaIn (InGa
P)
N)
Unit
Forward Voltage (Typ.)
(IF=20mA)
VF
3.3
2
3.3
V
Forward Voltage (Max.)
(IF=20mA)
VF
4.1
2.5
4
V
Reverse Current (Max.)
(VR=5V)
IR
50
10
50
uA
Wavelength of Peak
Emission CIE127-2007*(Typ.)
(IF=20mA)
λP
515*
632*
460*
nm
Wavelength of Dominant
Emission CIE127-2007*(Typ.)
(IF=20mA)
λD
525*
624*
465*
nm
Spectral Line Full Width
At Half-Maximum (Typ.)
(IF=20mA)
△λ
30
20
25
nm
C
45
25
100
pF
Capacitance (Typ.)
(VF=0V, f=1MHz)
Part
Number
DG
(InGa
N)
Operating Characteristics
(TA=25°C)
Lens-color
Water Clear
*Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.
Mar 06,2014
Luminous Intensity
CIE127-2007*
(IF=20mA) mcd
Wavelength
CIE127-2007*
λP nm
min.
typ.
400*
577*
515*
80*
178*
632*
80*
128*
460*
SDSA9277
V1-Z
Viewing
Angle
2θ 1/2
130°
Layout: Maggie L.
P. 1/5
Part Number: ZDGMECBD45S-B
3.5X2.8mm SURFACE MOUNT SMD CHIP LED
www.SunLED.com
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
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3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise
pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
Mar 06,2014
SDSA9277
V1-Z
Layout: Maggie L.
P. 2/5
Part Number: ZDGMECBD45S-B
3.5X2.8mm SURFACE MOUNT SMD CHIP LED
www.SunLED.com
™ DG
™ ME
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™ CBD
Mar 06,2014
SDSA9277
V1-Z
Layout: Maggie L.
P. 3/5
Part Number: ZDGMECBD45S-B
3.5X2.8mm SURFACE MOUNT SMD CHIP LED
www.SunLED.com
LED is recommended for reflow soldering and
soldering profile is shown below.
™ The device has a single mounting surface.
The device must be mounted according to the
specifications.
™ Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
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™ Tape Specification (Units : mm)
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™ Reel Dimension
Remarks:
If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength),
the typical accuracy of the sorting process is as follows:
1. Wavelength: +/-1nm
2. Luminous intensity / luminous flux: +/-15%
3. Forward Voltage: +/-0.1V
Note: Accuracy may depend on the sorting parameters.
Mar 06,2014
SDSA9277
V1-Z
Layout: Maggie L.
P. 4/5
Part Number: ZDGMECBD45S-B
3.5X2.8mm SURFACE MOUNT SMD CHIP LED
www.SunLED.com
PACKING & LABEL SPECIFICATIONS
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TERMS OF USE
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.
2. Contents within this document are subject to improvement and enhancement changes without notice.
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.
5. The contents within this document may not be altered without prior consent by SunLED.
6. Additional technical notes are available at http://www.SunLED.com/TechnicalNotes
Mar 06,2014
SDSA9277
V1-Z
Layout: Maggie L.
P. 5/5