DATA SHEET SE2622L: 2.4 GHz, 256 QAM Power Amplifier Applications Description DSSS 2.4 GHz WLAN (IEEE 802.11b) The SE2622L is a 2.4 GHz power amplifier designed for use in the 2.4 GHz ISM band for wireless LAN applications. The device incorporates a power detector for closed loop monitoring of the output power. OFDM 2.4 GHz WLAN (IEEE 802.11g) OFDM 2.4 GHz WLAN (IEEE 802.11n) OFDM 2.4 GHz WLAN (256 QAM) The SE2622L includes a digital enable control for device on/off control. Access points, PCMCIA, PC cards Integrated temperature compensated power detector Digital power amplifier enable pin (VEN) N/U Small signal gain: 31 dB typical N/C Single 3.3 V supply operation: 18 dBm, EVM = 35 dB, 256 QAM OFDM 20 dBm, EVM = 30 dB, 802.11n 23 dBm, ACPR < 32 dBc, 802.11b VCC Features GND The SE2622L temperature compensated power detector is highly immune to mismatch at its output with less than 1.5 dB of variation with a 2:1 mismatch. The device package and pinout for the 16-pin QFN are shown in Figure 1. A block diagram of the SE2622L is shown in Figure 2. 16 15 14 13 12 GND RF_IN 1 Lead Free, Halogen Free and RoHS compliant 11 RF_OUT/VCC EN 2 GND 3 10 N/U N/U 4 9 GND 6 7 8 N/U GND 5 DET Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. GND Small footprint QFN (16-pin, 3 3 0.9 mm) package (MSL1, 260 C per JEDEC J-STD-020) Y1122 Figure 1. SE2622L Pinout – 16-Pin QFN (Top View) VCC EN RF_IN Bias Input Match Inter-Stage Match Inter-Stage Match RF_OUT Detector VDET ts042 Figure 2. SE2622L Block Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014 1 DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER Electrical and Mechanical Specifications Signal pin assignments and functional pin descriptions are described in Table 1. The absolute maximum ratings of the SE2622L are provided in Table 2. Recommended operating conditions are specified in Table 3. Electrical specifications are provided in Tables 4, 5, and 6. Typical performance characteristics of the SE2622L are illustrated in Figure 3. Table 1. SE2622L Signal Descriptions Pin Name Description Pin Name Description 1 RF_IN Power amplifier RF input; DC block required 10 N/U Not used 2 EN Digital pin used to power up and power down the IC 11 RF_OUT/VCC Power Amplifier RF output / Final stage collector supply 3 GND Ground 12 GND Ground 4 N/U Not used 13 N/U Not used 5,6 GND Ground 14 N/C No connect 7 DET Analog power detector output 15 VCC Stages 1, 2 collector supply 8 N/U Not used 16 GND Ground 9 GND Ground Paddle GND Exposed die paddle; electrical and thermal ground Table 2. SE2622L Absolute Maximum Ratings (Note 1) Minimum Maximum Units Supply voltage on pins VCC Parameter VCC Symbol 0.3 +4 V Power amplifier enable VEN 0.3 +3.6 V +10 dBm 40 +150 C 500 V RF input power, RF_OUT terminated into 50 match RFIN Storage temperature range TSTG Electrostatic discharge: ESD Human Body Model (HBM), Class 1B Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SE2622L Recommended Operating Conditions Parameter Symbol Minimum Maximum Units Supply voltage VCC 3.0 3.6 V Supply voltage on pins VCC3 VCC3 3.0 3.6 V Ambient temperature TA –40 85 C Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 September 29, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202733C DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER Table 4. SE2622L Electrical Specifications: DC Characteristics (Note 1) (VCC = VCC3 = VEN = 3.3 V, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units Supply current (Sum of Vcc0, Vcc, Vcc3) Icc-802.11b POUT = +23 dBm, 11 Mbps CCK signal, BT = 0.45, VCC = VCC3 = 3.3 V 250 mA Supply current (Sum of Vcc, Vcc3) Icc-802.11g Pout = +19 dBm, 54 Mbps OFDM signal, Vcc = Vcc3 = 3.3 V 175 mA Supply current (Sum of Vcc, Vcc3) ICQ No RF 125 mA Supply current IOFF VEN = 0 V, No RF Logic high voltage VENH 1.3 Logic low voltage VENL 0 Input current logic high voltage IENH 300 A Input current logic low voltage IENL <1 A Enable pin input impedance ZEN 10 kΩ 2 Passive pull down 10 A VCC V 0.5 V Note 1: Performance is guaranteed only under the conditions listed in this table. Table 5. SE2622L Electrical Specifications: AC Characteristics (Note 1) (VCC = VCC3 = VEN = 3.3 V, f = 2.45 GHz, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted) Parameter Frequency range Symbol Test Condition f Output power POUT Min Typ 2400 OFDM, 256 QAM, HT40, 35 dB EVM +18 OFDM, 256 QAM, HT20, 35 dB EVM +19 OFDM, 256 QAM, HT40, 38 dB EVM +16 OFDM, 64 QAM, HT20, 30 dB EVM +20 CCK signal, BT = 0.045, Mask +23 802.11n, HT20, all data rates, Mask +23 802.11n, HT40, all data rates, Mask +22 Output 1dB compression point P1dB Input return loss S11 No modulation Small signal gain S21 PIN = 25 dBm Gain Variation over band S21 PIN = 25 dBm, f = 2400 to 2500 MHz +24.5 26 Max Units 2500 MHz dBm +27 dBm 12 10 dB 31 34 dB 1 dB 50 dBm/MHz 3f 50 dBm/MHz Rise and fall time tR, tF 0.5 s Stability STAB POUT = +23 dBm, 54 Mbps OFDM signal, 64 QAM, VSWR = 6:1. All Phases All non-harmonically related outputs less than 50 dBc/100 kHz Tolerance to output load mismatching VSVR POUT = +23 dBm, 54 Mbps OFDM signal, 64 QAM, VSWR = 10:1. All Phases No damage 2f Harmonic POUT = +23 dBm, CW Note 1: Performance is guaranteed only under the conditions listed in this table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014 3 DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER Table 6. SE2622L Electrical Specifications: Power Detector Characteristics (Note 1) (VCC = VCC3 = VEN = 3.3 V, f = 2.45 GHz, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical 0 Max Units P1dB dBm POUT detect range PDR Detector voltage VDET POUT = +23 dBm 1.04 V Detector voltage VDET POUT = +21 dBm 0.87 V Detector voltage VDET POUT = No RF 0.33 V Output impedance PDZOUT 2.3 k DC load impedance PDZLOAD 10 k Note 1: Performance is guaranteed only under the conditions listed in this table. 1.2 1.1 1 0.8 0.7 0.6 2400 0.5 2450 0.4 2500 0.3 3 5 7 9 11 13 15 17 19 21 23 ts043 VDET (V) 0.9 25 Output Pow er (dBm ) Figure 3. SE2622L Power Detector Characteristics Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 September 29, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202733C DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER Evaluation Board Description schematic diagram is provided in Figure 4. Table 7 provides the Bill of Materials (BOM) list for Evaluation Board components. The SE2622L-EK1 Evaluation Board is used to test the performance of the SE2622L-R PA. A typical application Header 6 J3 C4 1500 pF VDET 1 2 3 4 5 6 C3 10 pF C5 DNI C6 DNI VCC VCC VEN VCC N/C 1 RF_IN VEN GND 2 EN RF_OUT/VCC U1 SE2622L 3 GND C2 DNI N/U 4 N/U GND 12 T2 T1 C15 15 pF 10 T3 T4 9 C17 1.0 pF C16 1.5 pF N/U DET J2 SMA L3 1.5 nH 8 7 GND GND 6 5 VCC T5 11 C14 1.8 pF DNI = Do Not Install C11 4.7 μF L2 4.7 nH J1 SMA RFIN C10 DNI 13 N/U 14 15 VCC GND GND 16 Pad C9 10 pF C13 DNI Notes: VDET R1 DNI C19 DNI T1: L = 0.9 mm, W = 0.424 mm T1 length is measured from the outside edge of the device lead to the middle edge of the C14 land pad. T5: L = 1.50 mm, W = 0.424 mm T5 length is measured from the inside edge of the C15 land pad to the inside edge of the L3 land pad. T2: L = 1.95 mm, W = 0.424 mm T2 length is measured from the middle edge of the C14 land pad to the inside edge of the C15 land pad. C17 is placed immediately after L3 with the top land pad directly on the TX track. T3: L = 1.04 mm, W = 0.424 mm T3 length is measured from the outside edge of the TX line to the inside edge of the C14 land pad. T4: L = 1.04 mm, W = 0.424 mm T4 length is measured from the outside edge of the TX line to the inside edge of the C16 land pad. C16 is centered on the middle edge of the right land pad of C15. L2 is placed 1.4 mm away from the device. This dimension is measured from the outside edge of the device lead to the middle edge of the land pad of L2. The outer edge of the land pad is aligned with the center of the TX track. All trace dimensions are based on having a ground plane immediately below the trace with 0.254 mm off FR406 as the substrate. Y1118 Figure 4. SE2622L Evaluation Board Schematic Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: Paths to ground should be made as short as possible. The ground pad of the SE2622L-R has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For further information, refer to the Skyworks Application Note, PCB Design Guidelines for High Power Dissipation Packages, document number 201211. Bypass capacitors should be used on the DC supply lines. An RF inductor is required on the VCC supply line to block RF signals from the DC supply. Refer to the schematic drawing below for further details. The RF lines should be well separated from each other with solid ground between traces to maximize input-to-output isolation. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014 5 DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER Evaluation Board Test Procedure 7. Enable the power supply. 1. Connect GND to all ground pins. 8. Enable the RF signal. 2. Connect a power supply to the VCC1, VCC2, and the two RF_OUT pins. 9. Take measurements. 3. If desired, connect a voltage meter to the VDET pin. CAUTION: If the input signal exceeds the rated power, the Evaluation Board can be permanently damaged. 4. Connect a +3.3 V supply to EN pin. 5. Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of –30 dBm or less to the Evaluation Board. DO NOT enable the RF signal. NOTE: It is important to adjust the VCC voltage source so that the target supply voltage (+5) is measured at the board. The high collector currents will drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate." 6. Connect a spectrum analyzer to the RF signal output port. Table 7. SE2622L Evaluation Board Bill of Materials Component U1 Part number Description Manufacturer SE2622L Skyworks PCB Z053-B Skyworks R1, C2, C5, C6, C10, C13, C19 DNI C3, C9 10 pF GRM1555C1H100JZ01 C4 1500 pF GRM155R71H152KA01 Murata C11 4.7 F GRM188R60J475KE19 Murata C14 1.8 pF GRM1555C1H1R8CZ01 Murata C15 15 pF GRM1555C1H150JZ01 Murata C16 1.5 pF GRM1555C1H1R5CZ01 Murata C17 1.0 pF GRM1555C1H1R0CZ01 Murata J1, J2 SMA 142-0701-851 Johnson J3 HEADER 6 22-28-4063 Molex L2 4.7 nH LQG18HN4N7S00D Murata L3 1.5 nH LQG15HN1N5S02D Murata Package Dimensions The PCB layout footprint for the SE2622L is provided in Figure 5. Typical case markings are shown in Figure 6. Package dimensions for the 16-pin QFN are shown in Figure 7, and tape and reel dimensions are provided in Figure 8. Package and Handling Information Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE2622L is capable of withstanding a Pb free solder reflow. Care Murata must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For details on both attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to: Skyworks Application Note: Quad Flat No-Lead Module Solder Reflow & Rework Information, Document Number QAD-00045. Skyworks Application Note: Handling, Packing, Shipping and Use of Moisture Sensitive QFN, Document Number QAD-00044. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 September 29, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202733C 2X 1.32 0.98 3X 0.61 1.32 1.27 3.40 0 3X 0.61 DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER 2X 1.40 3X 0.61 1.09 0.500 Typ 3.40 0 1.90 0 3X 0.61 1.27 0.25 Typ 0 1.40 1.55 0.60 Typ 1.90 Board Metal 3.50 3.40 0.20 0.500 Typ 0.500 Typ 0.35 Typ 0.65 Typ 0.65 Typ 1.70 3.50 0.70 Typ 13X ø0.254 Via Pattern (Note 4) 0.20 3.40 0.25 Typ Package Outline 1.70 0.60 Typ Stencil Pattern (Note 5) Solder Mask Pattern (Note 6) 58% solder coverage on center pad Notes: 1. 2. 3. 4. All dimensions are in millimeters. Dimensions and tolerances according to ASME Y14.5M-1994. Unless specified, dimensions are symmetrical about center lines. Via hole recommendations: 0.025 mm Cu via wall plating (minimum), via hole to be filled with conductive paste and plated over. 5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures, trapezoidal walls and rounded corners offer better paste release. 6. Solder mask recommendations: contact board fabricator for recommended solder mask offset and tolerance. Y1177 Figure 5. PCB Layout Footprint for the SE2622L Pin 1 Indicator Part Number Lot Code Y1121 Figure 6. Typical Case Markings (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014 7 DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER 2X 0.10 C A 3.000 ± 0.050 1.700 ± 0.050 0.850 ± 0.050 See Note 3 B 0.30 X 45° 0.203 Ref R0.075 Typ 3.000 ± 0.050 2X 0.500 1.700 ± 0.050 Seating Plane 0.10 C 16X 0.230 ±0.050 0.10 M C A B 0.05 M C 0.10 C 0.000–0.050 16X 0.375 ±0.050 C Top View Bottom View Notes: 1. Dimensions and tolerances according to ASME Y14.5M-1994. 2. All measurements are in millimeters. Unless otherwise specified, the following values apply: Decimal Tolerance: Angular Tolerance: X.X (1 place) ± 0.1 mm ± 0.5° X.XX (2 places) ± 0.05 mm X.XXX (3 places) ± 0.025 mm 3. Terminal 1 identification mark located within marked area. 4. Unless specified, dimensions are symmetrical about center lines. Y1123 Figure 7. SE2622L 16-Pin QFN Package Dimensions 4.0 ± 0.1 (Note 2) 2.00 ± 0.051 (Note 1) 3.30 ± 0.10 Y 1.75 + 0.10 “A” Ø1.5 Min. 12.00 ± 0.30 Ø1.55 + 0.05 (Note 1) 5.50 ± 0.10 0.30 ± 0.05 Ref. 3º Pin #1 Y 8.00 ± 0.10 1.10 ± 0.10 Ref. R0.25 3.30 ± 0.10 R 0. ef. 25 Section Y-Y Notes: 1. Measured from centreline of sprocket hole to centreline of pocket. 2. Cumulative tolerance of 10 sprocket holes is ±0.20 mm. 3. Other material available. 4. All measurements are in millimeters unless otherwise stated. View “A” ts019 Figure 8. SE2622L Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 September 29, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202733C DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER Ordering Information Model Name SE2622L 2.4 GHz, 256 QAM Power Amplifier Manufacturing Part Number Evaluation Board Part Number SE2622L SE2622L-EK1 Copyright © 2013-2014 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. 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Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014 9