RClamp3321P

RClamp3321P
Ultra-Low Capacitance
1-Line, 3.3V ESD protection
PROTECTION PRODUCTS - RailClamp
Description
Features
®
u Transient protection for data lines to
The RClamp 3321P provides ESD protection for USB3.0,
HDMI1.3/1.4, and other high-speed ports. It may be
used to meet the ESD immunity requirements of IEC
61000-4-2. The RClamp3321P is designed to minimize
both the ESD peak clamping and the TLP clamping. The
dynamic resistance is minimized (0.47 Ohms typical) for
optimum protection of sensitive circuits. Maximum capacitance is only 0.35pF. This allows the RClamp3321P
to be used in applications operating in excess of 5GHz
without signal attenuation. These devices are manufactured using Semtech’s proprietary low voltage technology for superior characteritics at operating voltages up
to 3.3 volts.
The RClamp3321P is in a 2-pin SLP1006P2 package. It
measures 1.0 x 0.6 x 0.5mm. The leads are spaced at a
pitch of 0.65mm and are finished with lead-free NiPdAu.
Each device will protect one line operating at 3.3 volts.
The combination of low peak ESD clamping, low dynamic
resistance, and low capacitance makes this device suitable for applications such as USB 3.0, HDMI and V-ByOne interfaces in portable devices.
IEC 61000-4-2 (ESD) ±17kV (air), ±12kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
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Ultra-small package (1.0 x 0.6 x 0.5mm)
Protects one data or I/O line
Low capacitance: 0.35pF
Dynamic Resistance: 0.47 Ohms Typical
Low ESD clamping voltage
Operating voltage: 3.3V
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SLP1006P2 package
Molding compound flammability rating: UL 94V-0
Marking: Marking code
Packaging: Tape and Reel
Lead Finish: NiPdAu
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Applications
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Package Dimensions
USB 3.0
HDMI 1.3/1.4
V-By-One
Display Port
MHL / MDDI
LVDS Interfaces
eSATA Interfaces
Schematic & Pin Configuration
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Nominal Dimensions (mm)
7/25/2013
SLP1006P2 (Bottom View)
1
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RClamp3321P
PROTECTION PRODUCTS
Absolute Maximum Ratings
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
PPK
25
Watts
Maximum Peak Pulse Current (tp = 8/20µs)
IPP
3
Amps
VESD
+/- 17
+/- 12
kV
TJ
-55 to +125
O
TSTG
-55 to +150
O
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
C
C
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
3.3
V
7
8.5
V
Reverse Stand-Off Voltage
VRWM
Breakdown Voltage
VBR
IBR = 1mA
Reverse Leakage Current
IR
VRWM = 3.3V
10
50
nA
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
9.5
10
V
Clamping Voltage
VC
IPP = 4A, tp = 8/20µs
10.5
13
V
ESD Clamping Voltage2
VC
IPP = 4A,
tlp = 0.2/100ns
8.8
V
ESD Clamping Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
14.5
V
Trigger Voltage2
V TRIG
tlp = 0.2/100ns
8
V
Dynamic Resistance2, 3
RDYN
tlp = 0.2 / 100ns
0.47
Ω
Junction Capacitance
Cj
VR = 0V, f = 1MHz
0.22
5.5
0.35
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)TLP Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP sample window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from Ipp = 4A to Ipp = 16A using “Best Fit”
4) Device is electrically symmetrical
 2013 Semtech Corporation.
2
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RClamp3321P
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
8x20us Peak Clamping Voltage vs Peak Current
20
1000
TA = 25OC
Waveform 8x20us
15
100
Peak Clamping Voltage - VC (V)
Peak Pulse Power - PPP (W)
TA = 25OC
10
10
5
0
RC3321P_AR_8_20 Surge
DR040412-25
1
0.1
1
10
100
-5
1000
0
1
2
3
Peak Pulse Current - IPP (A)
Pulse Duration - tp (µs)
Capacitance vs. Temperature vs. Bias Voltage
5
TLP Characteristic
0.8
25
TA = 25OC
tP = 100ns
tR = 0.2ns
tMEAS = 70-90ns
RDYN = 0.47Ω
Typ. Both Directions
20
f = 1MHz
0.6
VR = 0V
TLP Current (A)
Junction Capacitance - CJ (pF)
4
VR = 3.3V
0.4
15
10
5
0.2
0
RC3321P_AR_TLP
RC3321P_AR_CJ
-5
0.0
-50
0
50
Temperature (OC)
100
0
150
10
15
20
DUT Voltage (V)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
140
20
25OC.
TA =
Waveform IEC61000-4-2 +8kV.
Measured with and corrected for 50Ω, 40dB Attenuator.
50Ω Scope Input Impedance, 2GHz BW.
ESD Gun Return connected to ESD Ground Plane.
100
0
Clamping Voltage - VC (V)
120
Clamping Voltage - VC (V)
5
80
60
40
20
0
-20
-40
-60
TA = 25OC.
Waveform IEC61000-4-2 -8kV.
Measured with and corrected for 50Ω, 40dB Attenuator.
50Ω Scope Input Impedance, 2GHz BW.
ESD Gun Return connected to ESD Ground Plane.
-80
-100
-120
RC3321P_AR_N8_ESD
RC3321P_AR_P8_ESD
-20
-140
-20
0
20
 2013 Semtech Corporation.
40
Time (ns)
60
80
100
-20
3
0
20
40
Time (ns)
60
80
100
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RClamp3321P
PROTECTION PRODUCTS
Typical Characteristics (Continued)
Typical Insertion Loss (S21)
0
Insertion Loss - IL (dB)
-2
-4
-6
-8
RC3321P_AR_IL_SIM
-10
10
100
1000
Frequency (MHz)
 2013 Semtech Corporation.
10000
4
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RClamp3321P
PROTECTION PRODUCTS
Applications Information
USB3.0 Layout Diagram
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USB3.0 Eye Diagram
 2013 Semtech Corporation.
5
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RClamp3321P
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Equivalent Circuit Diagram
These low capacitance TVS diodes are designed to
provide common mode protection for one high-speed
line or differential protection for one line pair. The
device is bidirectional and may be used on lines where
the signal polarity is positive and negative.
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Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
l Place the TVS near the input terminals or connectors
to restrict transient coupling.
l Minimize the path length between the TVS and the
protected line.
l Minimize all conductive loops including power and
ground loops.
l The ESD transient return path to ground should be
kept as short as possible.
l Never run critical signals near board edges.
l Use ground planes whenever possible.
 2013 Semtech Corporation.
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RClamp3321P
PROTECTION PRODUCTS
Outline Drawing - SLP1006P2
A
B
D
DIMENSIONS
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
E
A
A1
b
D
E
e
L
R
N
aaa
bbb
TOP VIEW
A
SEATING
PLANE
aaa C
C
A1
.016 .020 .022
.000 .001 .002
.018 .020 .022
.035 .039 .043
.020 .024 .028
.026 BSC
.008 .010 .012
.002 .004 .006
2
.003
.004
0.40 0.50 0.55
0.00 0.03 0.05
0.45 0.50 0.55
0.90 1.00 1.10
0.50 0.60 0.70
0.65 BSC
0.20 0.25 0.30
0.05 0.10 0.15
2
0.08
0.10
PIN 1 ID
R
bxN
bbb
C A B
2x L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006P2
DIMENSIONS
Y
(C)
DIM
C
G
X
Y
Z
Z
G
INCHES
(.033)
.012
.024
.022
.055
MILLIMETERS
(0.85)
0.30
0.60
0.55
1.40
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
 2013 Semtech Corporation.
7
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RClamp3321P
PROTECTION PRODUCTS
Marking
Ordering Information
Part Number
Qty per Reel
Reel Size
RClamp3321P.TNT
10,000
7 inch
Note:
RailClamp and RClamp are trademarks
of Semtech Corporation
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Notes:
1) Device is electrically symmetrical
2) Marking will also include line matrix date code
Tape and Reel Specification
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0.66 ± 0.10 mm
Note: All dimensions in mm unless otherwise specified
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1.19 ± 0.10 mm
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0.69 ± 0.10 mm
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Device Orientation in Tape
Contact Information for Semtech International AG
Taiwan Branch
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Japan (Tokyo) Office
Tel: 81-3-5719-7560
Fax: 81-3-5719-7561
Korea Branch
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Shanghai Office
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Japan (Osaka) Office
Tel: 81-6-6347-6570
Fax: 81-6-6347-6571
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the
U.S.A.
 2013 Semtech Corporation.
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