uClamp1211Z Ultra Small μClamp® 1-Line ESD Protection PROTECTION PRODUCTS - Z-PakTM Description Features μClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They features large cross-sectional area junctions for conducting high transient currents. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μClamp®1211Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. The leads are finished with lead-free NiPdAu. Each device will protect one line operating at 12 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and tablet PC’s. High ESD withstand Voltage: +/-30kV (Contact/Air) ® per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one data or power line Low reverse current: <50nA (VR=12V) Working voltage: +/- 12V Low capacitance: 25pF maximum Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiPdAu Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications Nominal Dimensions Cellular Handsets & Accessories Portable Instrumentation 12V Power Protection Tablet PC Schematic 0.62 0.22 1 0.32 0.16 0.355 BSC 2 0.25 SLP0603P2X3 (Bottom View) Nominal Dimensions (mm) Revision 03/7/2013 1 www.semtech.com uClamp1211Z PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 125 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 5 Amps VESD +/- 30 +/- 30 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air)1 ESD p er IEC 61000-4-2 (Contact)1 Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 to 2 or 2 to 1 Reverse Breakdown Voltage V BR It = 1mA Pin 1 to 2 or 2 to 1 Reverse Leakage Current IR VRWM = 12V, T=25°C Pin 1 to 2 or 2 to 1 Clamp ing Voltage VC Clamp ing Voltage Minimum Maximum Units 12 V 16 19 V <10 50 nA IPP = 1A, tp = 8/20μs Pin 1 to 2 or 2 to 1 20 V VC IPP = 5A, tp = 8/20μs Pin 1 to 2 or 2 to 1 25 V Dynamic Resistance2, 3 RDYN tlp = 0.2 / 100ns 0.30 Junction Cap acitance Cj VR = 0V, f = 1MHz 19 13.3 Typical Ohms 25 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2013 Semtech Corporation 2 www.semtech.com uClamp1211Z PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Non-Repetitive Peak Pulse Power vs. Pulse Time 25 10 O Clamping Voltage - VC (V) Peak Pulse Power - P PP (kW) TA = 25 C 1 0.1 DR040412-125 1 10 100 15 10 5 0 0.01 0.1 20 0 1000 1 2 Junction Capacitance vs. Reverse Voltage 4 5 6 25 30 TLP Characteristic 25 30 25 TLP Current (A) 20 Capacitance - Cj (pF) 3 Peak Pulse Current - Ipp (A) Pulse Duration - tp (µs) 15 10 5 20 15 10 5 f = 1 MHz 0 0 0 2 4 6 8 10 12 14 0 5 10 Reverse Voltage - VR (V) ESD Clamping (+8kV Contact per IEC 61000-4-2) 20 ESD Clamping (-8kV Contact per IEC 61000-4-2) 45 0 40 -5 35 -10 Clamping Voltage (V) Clamping Voltage (V) 15 TLP Voltage (V) 30 25 20 15 10 -20 -25 -30 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -35 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 5 -15 -40 0 -45 -10 0 10 20 30 40 50 60 70 80 -10 Time (ns) © 2013 Semtech Corporation 0 10 20 30 40 50 60 70 80 Time (ns) 3 www.semtech.com uClamp1211Z PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Stencil Aperture Mounting Pad Package 0.175 0.272 0.250 0.298 R ecommendation 0.270 Solder Stencil Design Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Stencil Thickness Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2013 Semtech Corporation Recommended Mounting Pattern 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com uClamp1211Z PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3 B D A DIM A A1 b D E e L N aaa bbb E TOP VIEW DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.25 0.265 0.000 0.02 0.025 0.22 0.24 0.20 0.585 0.62 0.655 0.285 0.32 0.355 0.355 BSC 0.14 0.16 0.18 2 0.08 0.10 A SEATING PLANE aaa C C A1 e/2 bbb bxN C A B 2xL e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3 DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2013 Semtech Corporation 5 www.semtech.com uClamp1211Z PROTECTION PRODUCTS Marking Code Ordering Information S Part Number Qty per Reel Reel Size uClamp 1211Z.TN T 10,000 7 Inch Notes: MicroClamp, uClamp and μClamp are trademarks of Semtech Corporation Notes: Marking will also include dot matrix date code Carrier Tape Specification A0 B0 0.37 +/-0.03 mm 0.67 +/-0.03 mm Device Orientation in Tape K0 0.32 +/-0.02 mm Note: All dimensions in mm unless otherwise specified Date Code Location (Towards Sprocket Holes) © 2013 Semtech Corporation 6 www.semtech.com uClamp1211Z PROTECTION PRODUCTS Contact Information for Semtech International AG Taiw an Branch Korea Branch Shanghai Office Japan (Osaka) Office Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Japan (Tokyo) Office Tel: 81-3-5719-7560 Fax: 81-3-5719-7561 Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 Tel: 81-6-6347-6570 Fax: 81-6-6347-6571 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. © 2013 Semtech Corporation 7 www.semtech.com