FSMD075-1206R

Surface Mountable PPTC Resettable Fuse: FSMD075-1206R
1. Summary
(a) RoHS Compliant & Halogen Free
(b) Applications: All high-density boards
(c) Product Features: Small surface mountable, Solid state, Faster time to trip than
standard SMD devices, Lower resistance than standard SMD devices
(d) Operation Current: 0.75A
(e) Maximum Voltage: 6V
(f) Temperature Range : -40℃ to 85℃
2. Agency Recognition
UL: E211981
TÜV: R50090556
C-UL: Pending
3. Electrical Characteristics (23℃)
Part
Number
FSMD075-1206R
Hold
Trip
Rated
Max
Typical
Max Time to Trip
Resistance
Current
Current
Voltage
Current
Power
Current
Time
RMIN
R1MAX
IH, A
IT, A
VMAX, Vdc
IMAX, A
Pd, W
Amp
Sec
Ω
Ω
0.75
1.50
6
100
0.6
8.00
0.20
0.090
0.290
IH=Hold current-maximum current at which the device will not trip at 23℃still air.
IT=Trip current-minimum current at which the device will always trip at 23℃ still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
RMIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
4. FSMD Product Dimensions (Millimeters)
Part
Number
FSMD075-1206R
A
B
C
D
E
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
3.00
3.50
1.50
1.80
0.45
1.25
0.25
0.75
0.10
0.45
5. Thermal Derating Curve
Thermal Derating Curve, FSMD075-1206R
Percent of Rated Hold and Trip
Current
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Temperature (C)
6. Typical Time-To-Trip at 23℃
FSMD075-1206R
10
Time-to-trip (S)
1
0.1
0.01
0.001
1
10
Fault current (A)
100
7. Material Specification
T erminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
8. Part Numbering and Marking System
Part Numbering System
Part Marking System
F S M D □ □ □ – 1206R
FE
Current rating
F
□
Part Identification
Example
9. Pad Layouts、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1206 device
Pad dimensions (millimeters)
A
B
Device
Nominal
Nominal
FSMD075-1206R
2.00
1.00
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (T smin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Pb-Free Assembly
3 ℃/second max.
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
20-40 seconds
Temperature (tp)
Ramp-Down Rate :
6 ℃/second max.
8 minutes max.
Time 25 ℃ to Peak Temperature :
Note 1: All temperatures refer to of the package,
measured on the package body surface.
C
Nominal
1.90
Solder reflow
※ Due to “Lead Free” nature, Temperature and
Dwelling time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard
methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Envorinment : < 30℃ / 60%RH
Caution:
1. If reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
2. Devices are not designed to be wave soldered
to the bottom side of the board.
Reflow Profile
Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible
甲、
electrical arcing and/or flame.
-PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent
condition and/or prolonged trip are not anticipated.
-Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device
performance.