RT8300 - Richtek

®
RT8300
4-CH 150mA Constant Current LED Driver
General Description
Features
The RT8300 is a 4-CH 150mA constant current sink LED
driver capable of driving four channel constant currents
with good matching ability and wide range VF variations.
z
4 Constant Current Output Channels
z
Wide Power Supply Voltage Range : 5V to 24V
Maximum Constant Current Output Voltage : 60V
Low Dropout Voltage : 600mV at 120mA Output
Current
Constant Output Current Accuracy Between
Channels : <±3%
Dynamic Headroom Control (DHC) Function
Constant Output Current Range : 5mA to 150mA
Support 400ns Narrow PWM Pulse
Fault Detection for OTP, LED Open/Short
RoHS Compliant and Halogen Free
The RT8300 provides four channel constant currents with
less than 3% differences in output current value among
the 4-CH and ICs respectively. The constant current output
is adjustable from 5mA to 150mA via an external resistor
(RISET). The LED brightness can also be adjusted via the
PWMI pin with pulse width modulation from 0% to 100%.
Thus allowing for wide VF variation. Moreover, the RT8300
provides Dynamic Headroom Control (DHC) function which
can generate feedback signal to DC/DC control loop and
regulate the output voltage of the RT8300.
The RT8300 features LED open/short protection. If any
channel has open or short condition, that particular output
channel will be turned off and the FAULT pin will pull low.
The RT8300 also supports Over Temperature Protection
(OTP). When OTP is triggered, all output channels will be
turned off and the FAULT pin will pull low.
The RT8300 is available in DIP-16 (BW) and SOP-16
packages to achieve optimized solution for PCB space.
Ordering Information
z
z
z
z
z
z
z
z
Applications
z
LED Backlight
Marking Information
RT8300GN
RichTek
RT8300
GNYMDNN
RT8300GN : Product Number
YMDNN : Date Code
RT8300GS
RT8300
RT8300GS : Product Number
Package Type
N : DIP-16 (BW)
S : SOP-16
RT8300
GSYMDNN
YMDNN : Date Code
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
`
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`
Suitable for use in SnPb or Pb-free soldering processes.
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS8300-00 January 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT8300
Pin Configurations
(TOP VIEW)
FB
VIN
PWMI
14
13
2
12
3
GND
LED1
LED2
GND
4
ISET
5
10
LED4
FAULT
6
9
LED3
SLP
7
8
NC
11
GND
GND
PWMI
VIN
FB
ISET
FAULT
SLP
GND
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
GND
NC
LED1
LED2
LED3
LED4
NC
GND
SOP-16
DIP-16 (BW)
Typical Application Circuit
Max 150mA
Max 150mA
Max 150mA
VIN
Max 150mA
VLED 60V (Max)
VLED
VIN
VH
RPH
VIN
CIN1
LED1
LED4
RT8300
FAULT LED Driver [1]
PWMI
ISET
GND
PWMI
RISET1
FB (DHC)
CIN2
RSLP1
FB
LED1
LED4
SLP
RT8300
FAULT LED Driver [N]
PWMI
ISET
GND
RSLP2
FB
RISET2
CFB
1nF
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
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2
SLP
VIN
is a registered trademark of Richtek Technology Corporation.
DS8300-00 January 2012
RT8300
Functional Pin Description
Pin No.
Pin Name
Pin Function
DIP-16 (BW)
SOP-16
3
3
PWMI
2
4
VIN
Constant Current Output Channel Enable/Disable Input.
High : Enable, Low : Disable
Power Supply Input.
1
5
FB
Feedback Control Voltage Output.
5
6
ISET
Constant Current Set Pin. Connect to an external resistor to
adjust constant current output.
6
7
FAULT
Open Drain Output for Fault Detection.
7
8
SLP
4, 11, 14
1, 2, 9, 16
GND
LED Short Protection Voltage Set Pin.
Ground. The exposed pad must be soldered to a large PCB
and connected to GND for maximum power dissipation.
10, 9, 12, 13
11 to 14
8
10, 15
LED4 to
LED1
NC
Constant Current Sink Output.
No Internal Connection.
Function Block Diagram
LED1
LED2
LED3 LED4
VIN
ISET
PWMI
DHC Function
IOUT
Regulator
Open/Short
Detection
Constant Current Control
Circuit with PWM Control
FB
FAULT
Thermal
Protection
GND
SLP
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS8300-00 January 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
3
RT8300
Absolute Maximum Ratings
z
z
z
z
z
z
z
z
(Note 1)
Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------Output Voltage LED1 to LED4 -----------------------------------------------------------------------------------------FB, PWMI, FAULT, ISET to GND --------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
DIP-16 (BW) ----------------------------------------------------------------------------------------------------------------SOP-16 ----------------------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
DIP-16 (BW), θJA ----------------------------------------------------------------------------------------------------------SOP-16, θJA ----------------------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------------Junction Temperature -----------------------------------------------------------------------------------------------------Storage Temperature Range ---------------------------------------------------------------------------------------------
Recommended Operating Conditions
z
z
z
−0.3V to 32V
−0.3V to 70V
−0.3V to 28V
2.5W
1.176W
40°C/W
85°C/W
260°C
150°C
−65°C to 150°C
(Note 3)
Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------- 5V to 24V
Junction Temperature Range --------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range --------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 24V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
VIN Rising
--
3.6
--
VIN Falling
--
3.1
--
--
--
60
V
116.4
120
123.6
mA
--
±0.5
±3
%
--
±0.1
±0.5
%/V
μA
Under Voltage Lockout
Threshold
VUVLO
Output Voltage
VLEDx
LED1 to LED4, all CHs off
LED Current Accuracy
ILEDX2
VLEDX = 0.6V, RISET = 900Ω
LED Current Matching
dI LEDX2
Output Current vs. Output
Voltage Regulation
%/dVLEDX
Output Current of SLP
ISLP
VSLP = 0.43V to 2V
--
16
--
VSLPH
VLEDX = 14V
--
2
--
VSLPL
VLEDX = 3.03V
--
0.43
--
VOLP
VLEDx
--
50
--
Logic-High
VPWMIH
TA = −40°C to 85°C
2
--
--
Logic-Low
VPWMIL
TA = −40°C to 85°C
--
--
0.8
VFBH
IFBH = 50μA
--
3.3
--
VFBL
IFBL = 1mA
--
0.2
--
SLP Pin Voltage
Open LED Protection (OLP)
Voltage
PWMI Input
Voltage
Feedback Voltage
ILEDX = 120mA, VLEDX = 0.6V,
RISET = 900Ω
VLEDX within 0.5V and 3V,
RISET = 900Ω
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
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4
Unit
V
V
mV
V
is a registered trademark of Richtek Technology Corporation.
DS8300-00 January 2012
RT8300
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
I FBH
VFB = 3.3V
--
50
--
μA
I FBL
--
1
--
mA
I OH
VFB = 0.2V
VLEDx = 50V, all CHs off,
PWMI = Low
--
---
0.5
μA
TOTP
Junction Temperature
--
140
--
°C
ΔTOTP
Junction Temperature
--
50
--
°C
Supply Current
I DD(ON)
RISET = 3.6kΩ, PWMI = High
--
3
5
mA
Shutdown Current
I SHDN
Shutdown
--
6
20
μA
FB Pin Output Current
Output Leakage Current
Thermal Protection
Temperature
Thermal Protection
Temperature Hysteresis
Low to High
PWMI to LEDx
Transition
Propagation
High to Low
Delay Time
Transition
Shutdown Delay Time
t PLH
0.1
t PHL
0.05
0.1
0.4
t SHDN
--
32
--
ms
Power On Reset Time
t RESET
--
256
--
μs
Soft-Start Time
t SS
--
128
--
ms
Fault Blanking Time
t FB
--
32
--
ms
PWMI High Blanking Time
t RB
--
4
--
μs
Fault Detection Time
tF
--
2
--
μs
PWM = 100%
0.3
0.6
μs
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. The device is not guaranteed to function outside its operating conditions.
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS8300-00 January 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5
RT8300
Typical Operating Characteristics
Supply Current vs. Input Voltage
Shutdown Current vs. Input Voltage
4.0
7
Shut down Current (μA)1
Supply Current (mA)
3.5
3.0
2.5
2.0
1.5
6
5
4
3
PWMI = High, RISET = 3.6kΩ
1.0
2
5
9
13
17
21
25
5
9
Input Voltage (V)
LED Current vs. Input Voltage
17
21
25
Low Dropout Voltage vs. LED Current
1.0
Low Dropout Voltage (V)
130
124
LED Current (mA)
13
Input Voltage (V)
LED1
LED2
LED3
LED4
118
112
106
0.8
0.6
0.4
0.2
VLEDx = 0.6V, RISET = 900Ω
0.0
100
5
VIN
(20V/Div)
PWMI
(5V/Div)
FB
(5V/Div)
9
13
17
21
70
90
110
130
Input Voltage (V)
LED Current (mA)
Power On Sequence
Power Off Sequence
150
VIN
(20V/Div)
PWMI
(5V/Div)
FB
(5V/Div)
tSS = 128ms
I LED
(1A/Div)
I LED
(1A/Div)
VIN = 24V, PWM = 100%
Time (50ms/Div)
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6
50
25
VIN = 24V, PWM = 100%
Time (50ms/Div)
is a registered trademark of Richtek Technology Corporation.
DS8300-00 January 2012
RT8300
Application Information
The RT8300 is a 4-CH LED current source controller with
an internal N-MOSFET driver. The RT8300 regulates the
lowest voltage of the LED strings and generates a feedback
control signal to a primary controller to regulate the LED
current. Each LED channel current is accurately matched
and controlled by sensing an internal resistor in series
with the MOSFET. All channels' LED brightness can be
precisely controlled by applying a PWM signal to the
PWMI pin. The RT8300 also features several protections
including Short LED Protection (SLP), Open LED
Protection (OLP), and Over Temperature Protection (OTP).
Dynamic Headroom Control Function
LED Current Setting
R3 (MIN) =
Each channel's LED current can be calculated by following
equation :
ILED ≅ 108
RISET
Where RISET is the resistor between the ISET pin and
GND. This setting is the reference for the LED current at
the LED pin and represents the sensed LED current for
each string.
The RT8300 brightness dimming control is decided by
the signal on the PWMI pin. Refer to the following figure.
The minimum dimming duty can be as low as 1% for the
200Hz frequency.
LED Current vs. PWM Duty
LED Current (mA)
100
80
60
40
20
PWM = 200Hz
0
20
V
- 0.2
VOUT (MAX) = VOUT (Default) +R1( REF
)
R3
V
- 3.3
VOUT (MIN) = VOUT (Default) +R1( REF
)
R3
VFB - VREF
IFB(typ.)
Where VOUT is converter output voltage, VREF is converter
reference voltage and typical IFB is 50μA. The connection
is shown as the following figure.
VOUT
R1
R3
30
40
50
60
70
80
VFB
0.2V to 3.3V
R2
Figure 2
Power On and Power Off Sequence
120
10
VOUT (Default) = VREF (1+ R1 )
R2
Converter VREF
Brightness Control
0
The Dynamic Headroom Control (DHC) function is used
to generate feedback signal to primary DC/DC control loop
and regulate the LED current of the RT8300. This function
can improve IC's thermal performance and efficiency. The
R1, R2 and R3 selection is shown in below equation :
90
PWM Duty (%)
100
When power converter output voltage and VIN are both
ready. PWMI pulled high will enable the RT8300, and IC
will check channel unused or not in first period (256μs).The
unused channel is needed to short to GND or FAULT will
be turned on. The second period is 128ms soft start time,
the RT8300 feedback voltage is 3.3V in this period. Then,
IC gets into the fault blanking time (32ms) when PWM
duty is 100% since fault blanking counter depends on the
PWM on period. After the third period, fault function will
turn on. About power off sequence, IC will shut down after
32ms when PWMI pin is pulled low. The power on and
power off sequence are shown as the following figure.
Figure 1
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS8300-00 January 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
7
RT8300
channels are re-enabled when the junction temperature
cools down by approximately 50°C.
Power On
VIN
PWMI
SS start VFB = 3.3V FAULT Blanking
~32ms
~128ms
IC reset (checking
unused Chs) ~256µs
Status
ILED
Open LED Protection
Normal
If the VLEDx is < 50mV after a fault blanking period, the
counter will be triggered when PWM is high. Moreover,
there is a 4μs blanking time on every rising part of PWM.
When the counter accumulates to 2μs, only this open
channel will be off but not latched. The FAULT will be turned
on and pulled low.
The time of startup depends on VOUT
Power Off
VIN
PWMI
Status
Shutdown Delay
~32ms
Shutdown
Short LED Protection
ILED
Figure 3
Over Temperature
The RT8300 has an Over Temperature Protection function
to prevent excessive power dissipation from overheating
the device. The OTP will disable all channels if the junction
temperature exceeds 140°C and sends a fault signal. The
If the voltage of VLEDx is >112 x 10-6 x RSLP (7 x VSLP) after
fault blanking period, the counter will be triggered when
PWM is high. Moreover, there is a 4μs blanking time on
every rising part of PWM. When the counter accumulates
to 2μs, this short channel will be off and latched. The
FAULT pin will be pulled low. The fault state can only be
released by PWM off after 32ms. The operation and
protection flow is shown as the following figure.
VIN and PWMI
Power On Start
(RESET)
Disable this
Channel
Un-used
Status of Channel
is VLEDX Floating?
(Un-used channel need
short to GND)
Soft-Start Function
and ILED Turn-On
(128ms)
Over Temperature
Protection ?
Tj >140°C
Follow the
Normal Flow
PWMI = low after
32ms or VIN < UVLO
SLP: Fault pulled low, only this
channel off and latch
OLP: Fault pulled low, only this
channel off and non-latch
VFB = 3.3V
OLP = SLP = L
Fault Blacking Time VFB = 0.2V to 3.3V
(32ms)
OLP = SLP = L
Tj <90°C
Auto-recovery
Turn-Off All Channel
FLT Pulled Low
Normal Operation
TF < 2µs
TF > 2µs
Open / Short
Detection Time
LED Short / Open
Protection ?
Figure 4
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is a registered trademark of Richtek Technology Corporation.
DS8300-00 January 2012
RT8300
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications of
the RT8300, the maximum junction temperature is 125°C
and TA is the ambient temperature. The junction to ambient
thermal resistance, θJA, is layout dependent. For DIP-16
Maximum Power Dissipation (W)1
Thermal Considerations
2.6
2.4
Four-Layer PCB
DIP-16 (BW)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
SOP-16
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 5. Derating Curves for the RT8300 Packages
(BW) package, the thermal resistance, θJA, is 40°C/W on
a standard JEDEC 51-7 four-layer thermal test board. For
SOP-16 packages, the thermal resistance, θJA, is 85°C/
W on a standard JEDEC 51-7 four-layer thermal test board.
The maximum power dissipation at TA = 25°C can be
calculated by the following formula :
P D(MAX) = (125°C − 25°C) / (40°C/W) = 2.5W for
DIP-16 (BW) package
PD(MAX) = (125°C − 25°C) / (85°C/W) = 1.176W for
SOP-16 package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. For the RT8300 packages, the derating
curves in Figure 5 allow the designer to see the effect of
rising ambient temperature on the maximum power
dissipation.
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS8300-00 January 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
9
RT8300
Outline Dimension
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
3.700
4.320
0.146
0.170
A1
0.381
0.710
0.015
0.028
A2
3.200
3.600
0.126
0.142
b
0.360
0.560
0.014
0.022
b1
1.143
1.778
0.045
0.070
b2
2.920
3.100
0.115
0.122
c
0.204
0.360
0.008
0.014
D
18.80
19.30
0.740
0.760
E
6.200
6.600
0.244
0.260
E1
7.320
7.920
0.288
0.312
E2
8.350
9.250
0.329
0.364
L
0.100
2.540
e
3.000
3.600
0.118
0.142
16-Lead DIP (BW) Plastic Package
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is a registered trademark of Richtek Technology Corporation.
DS8300-00 January 2012
RT8300
H
A
M
B
J
F
C
I
D
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
9.804
10.008
0.386
0.394
B
3.810
3.988
0.150
0.157
C
1.346
1.753
0.053
0.069
D
0.330
0.508
0.013
0.020
F
1.194
1.346
0.047
0.053
H
0.178
0.254
0.007
0.010
I
0.102
0.254
0.004
0.010
J
5.791
6.198
0.228
0.244
M
0.406
1.270
0.016
0.050
16–Lead SOP Plastic Package
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS8300-00 January 2012
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11