Data Sheet

Data Sheet
Rev. 1.01 / August 2014
ZSSC3027
Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner
Mobile Sensing ICs
Smart and Mobile
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Brief Description
Benefits
The ZSSC3027 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3027 can perform offset,
st
nd
span, and 1 and 2 order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
2
configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Programming the ZSSC3027 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory.
The ZSSC3027 provides accelerated signal processing in order to support high-speed control, safety,
and real-time sensing applications. It complements
ZMDI’s ZSSC30x6 products.











Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components required
Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics







Supply voltage range: 1.7 to 3.6V
Operating mode current consumption:
930µA (typical)
Sleep State current: 20nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding
Available Support


ZSSC3026 Evaluation Kit can be used to
evaluate ZSSC3027 capabilities
Support Documentation
ZSSC3027 Application Example
Features


Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing twosegment analog-to-digital converter (ADC)
Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
st
nd
1 and 2 order digital compensation of sensor
st
nd
gain as well as of 1 and 2 order temperature
gain and offset drift
Layout optimized for stacked-die bonding for
high-density chip-on-board assembly
Typical sensor elements can achieve accuracy of
better than ±0.10% FSO** @ -40 to 85°C
* I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
For more information, contact ZMDI via [email protected]
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01— August 24, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated,
stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
ZSSC3027
Block Diagram
VDDB
Vreg int
VTP
VTN
Temperature
Reference
Sensor
VDD
AGND / CM
Generator
Bias Current
Generator
Power Ctr.
Voltage
Regulator
VSS
Sensor
Bridge
Multiplexer
ZSSC3027
INP
INN
A
PreAmplifier
D
18-bit DSP Core
(Calculations,
Communication)
16 Bit
VSSB
SPI
Applications
 Barometric altitude measurement for
portable navigation or emergency call
systems
 Altitude measurement for car navigation
 Inside hard disk pressure measurement
 Weather forecast
 Fan control
 Industrial, pneumatic, and liquid pressure
 High-resolution temperature measurements
Power-ON
Reset
Clock
Generator
Ring
Oscillator
EOC
System
Control
Unit
MTP
ROM
I²CTM
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
Ordering Information (See section 6 in the data sheet for additional options for delivery)
Sales Code
Description
Delivery Package
ZSSC3027AC1B
Die—temperature range: –40°C to +85 °C
Wafer (304µm) unsawn, tested
ZSSC3027AC6B
Die—temperature range: –40°C to +85 °C
Wafer (725µm) unsawn, tested
ZSSC3027AC7C
Die—temperature range: –40°C to +85°C
Wafer (200µm) unsawn, tested
ZSSC3027AI1D
Engineering samples, die—temperature range: –40°C to +85°C
Dice in waffle pack (304µm)
ZSSC3026-KIT
Evaluation Kit for ZSSC3026, including boards, cable, software, and 1 ZSSC3026 PQFN24 sample
(equivalent to ZSSC3027—kit is recommended for evaluation of the capabilities of the ZSSC3027)
Sales and Further Information
www.zmdi.com
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.306
Fax
+49.351.8822.337
USA Phone 1.855.275.9634
Phone +1.408.883.6310
Fax
+1.408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
11th Floor, Unit JA-1102
670 Sampyeong-dong
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01—August 24, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated,
stored, or used without the prior written consent of the copyright owner.
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Table of Contents
1
2
IC Characteristics .......................................................................................................................................... 7
1.1.
Absolute Maximum Ratings .................................................................................................................... 7
1.2.
Operating Conditions .............................................................................................................................. 7
1.3.
Electrical Parameters ............................................................................................................................. 8
1.4.
Power Supply Rejection Ratio (RSRR) vs. Frequency......................................................................... 10
Circuit Description ....................................................................................................................................... 11
2.1.
Brief Description ................................................................................................................................... 11
2.2.
Signal Flow and Block Diagram............................................................................................................ 11
2.3.
Analog Front End .................................................................................................................................. 13
2.3.1.
Amplifier ......................................................................................................................................... 13
2.3.2.
Analog-to-Digital Converter ............................................................................................................ 14
2.3.3.
Temperature Measurement ........................................................................................................... 18
2.3.4.
Bridge Supply ................................................................................................................................. 18
2.4.
3
Digital Section ....................................................................................................................................... 18
2.4.1.
Digital Signal Processor (DSP) Core ............................................................................................. 18
2.4.2.
MTP Memory.................................................................................................................................. 18
2.4.3.
Clock Generator ............................................................................................................................. 19
2.4.4.
Power Supervision ......................................................................................................................... 19
2.4.5.
Interface ......................................................................................................................................... 19
Functional Description ................................................................................................................................. 20
3.1.
Power Up .............................................................................................................................................. 20
3.2.
Measurements ...................................................................................................................................... 20
3.3.
Operational Modes ............................................................................................................................... 20
3.4.
Command Interpretation ....................................................................................................................... 22
3.4.1.
3.5.
2
SPI/I C™ Commands .................................................................................................................... 22
Communication Interface ...................................................................................................................... 25
3.5.1.
Common Functionality ................................................................................................................... 25
3.5.2.
SPI ................................................................................................................................................. 26
3.5.3.
I C™ ............................................................................................................................................... 29
3.6.
2
Memory ................................................................................................................................................. 30
3.6.1.
Programming Memory ................................................................................................................... 31
3.6.2.
Memory Status Commands ........................................................................................................... 31
3.6.3.
Memory Contents ........................................................................................................................... 32
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
4 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3.7.
Calibration Sequence ........................................................................................................................... 38
3.7.1.
Calibration Step 1 – Assigning Unique Identification ..................................................................... 38
3.7.2.
Calibration Step 2 – Data Collection .............................................................................................. 38
3.7.3.
Calibration Step 3 – Coefficient Calculations ................................................................................. 39
3.8.
The Calibration Math ............................................................................................................................ 40
3.8.1.
Bridge Signal Compensation ......................................................................................................... 40
3.8.2.
Temperature Signal Compensation ............................................................................................... 43
4
Die Pad Assignments .................................................................................................................................. 44
5
Quality and Reliability .................................................................................................................................. 45
6
Ordering Sales Codes ................................................................................................................................. 45
7
Related Documents ..................................................................................................................................... 46
8
Glossary ...................................................................................................................................................... 46
9
Document Revision History ......................................................................................................................... 47
Table of Figures
Figure 2.1
ZSSC3027 Functional Block Diagram ........................................................................................... 12
Figure 2.2
ADC Offset ..................................................................................................................................... 17
Figure 3.1
Operational Flow Chart: Power Up ................................................................................................ 21
Figure 3.2
Operational Flow Chart: Command Mode and Normal Mode ....................................................... 22
Figure 3.3
SPI Configuration CPHA=0 ........................................................................................................... 26
Figure 3.4
SPI Configuration CPHA=1 ........................................................................................................... 27
Figure 3.5
SPI Command Request ................................................................................................................. 27
Figure 3.6
SPI Read Status ............................................................................................................................ 28
Figure 3.7
SPI Read Data ............................................................................................................................... 28
Figure 3.8
I2C™ Command Request .............................................................................................................. 29
Figure 3.9
I C™ Read Status .......................................................................................................................... 29
2
2
Figure 3.10 I C™ Read Data ............................................................................................................................ 30
Figure 3.11 Memory Program Operation .......................................................................................................... 31
Figure 4.1
ZSSC3027 Pad Assignments ........................................................................................................ 44
List of Tables
Table 1.1
Maximum Ratings ............................................................................................................................ 7
Table 1.2
Operating Conditions ....................................................................................................................... 7
Table 1.3
Requirements for VDD Power-on Reset .......................................................................................... 8
Table 1.4
Electrical Parameters ....................................................................................................................... 8
Table 2.1
Amplifier Gain: Stage 1 .................................................................................................................. 13
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
5 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Table 2.2
Amplifier Gain: Stage 2 .................................................................................................................. 13
Table 2.3
Gain Polarity .................................................................................................................................. 14
Table 2.4
MSB/LSB Segmentation Settings for Bridge Measurement .......................................................... 15
Table 2.5
MSB/LSB Segmentation Settings for Temperature Measurement ................................................ 15
Table 2.6
ADC Conversion Times for a Single A2D Conversion................................................................... 15
Table 2.7
Typical Conversion Times vs. Noise Performance for 16-Bit Results with Full Sensor Signal
Conditioning for AZBM, BM, AZTM, and TM ................................................................................. 16
Table 2.8
ADC Offset Settings for the Measurement Configuration Register BM_config ............................. 17
Table 3.1
SPI/I C™ Commands .................................................................................................................... 23
Table 3.2
Get_Raw Commands .................................................................................................................... 24
Table 3.3
General Status Byte ....................................................................................................................... 25
Table 3.4
Status Byte for Read Operations ................................................................................................... 25
Table 3.5
Status Byte for Write Operations ................................................................................................... 25
Table 3.6
Mode Status ................................................................................................................................... 26
Table 3.7
Memory Status Word ..................................................................................................................... 31
Table 3.8
MTP Memory Content Assignments .............................................................................................. 32
Table 4.1
Pad Assignments ........................................................................................................................... 44
2
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
6 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
1
IC Characteristics
1.1.
Absolute Maximum Ratings
Note: The absolute maximum ratings are stress ratings only. The ZSSC3027 might not function or be operable
above the recommended operating conditions. Stresses exceeding the absolute maximum ratings might also
damage the device. In addition, extended exposure to stresses above the recommended operating conditions
might affect device reliability. ZMDI does not recommend designing to the “Absolute Maximum Ratings.”
Table 1.1
Maximum Ratings
PARAMETER
SYMBOL
Min
Voltage Reference
Vss
Analog Supply Voltage
Voltage at all Analog and Digital IO Pins
Input Current into any Pin Except SDA, CLK
1)
and Supply Pins
2)
Electrostatic Discharge Tolerance – Human Body Model (HBM1)
Storage Temperature
3)
TYP
MAX
UNITS
0
0
V
VDD
-0.4
3.63
V
VA_IO, VD_IO
-0.5
VDD+0.5
V
IIN
-100
100
mA
VHBM1
4000
-
V
TSTOR
-50
125
°C
1)
Latch-up current limit for SCLK/SCL and MOSI/SDA: ±70mA.
2)
Latch-up resistance; reference for pin is 0V.
3)
HBM1: C = 100pF charged to VHBM1 with resistor R = 1.5k in series based on MIL 883, Method 3015.7. ESD protection
referring to the Human Body Model is tested with devices in ceramic dual in-line packages (CDIP) during product qualification.
1.2.
Operating Conditions
The reference for all voltages is Vss.
Table 1.2
Operating Conditions
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
Supply Voltage
VDD
1.7
-
3.6
V
VDD Rise Time
tVDD
200
μs
Bridge Current
IVDDB
1.8
Operation Temperature Range—Standard
External capacitance between VDDB and VSS
Data Sheet
August 24, 2014
mA
16.5
TAMB
-40
CL
0.01
-
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
85
°C
50
nF
7 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
A dynamic power-on-reset circuit is implemented in order to achieve minimum current consumption in idle mode.
The VDD low level and the subsequent rise time and VDD rising slope must meet the requirements in Table 1.1 to
guarantee an overall IC reset; lower VDD low levels allow slower rising of the subsequent on-ramp of VDD. Other
combinations might also be possible. For example, the reset trigger can be influenced by increasing the powerdown time and lowering the VDD rising slope requirement.
Table 1.3
Requirements for VDD Power-on Reset
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
tSPIKE
3
-
-
µs
VDD Low Level
VDDlow
0
-
0.2
V
VDD Rising Slope
SRVDD
10
-
-
V/ms
Power Down Time (duration of VDD Low Level)
1.3.
Electrical Parameters
All parameter values are valid only under the specified operating conditions. All voltages are referenced to Vss.
Table 1.4
Electrical Parameters
Note: See important table notes at the end of the table.
Parameter
Symbol
Conditions/Comments
Min
Typ
Max
Unit
1.60
1.67
1.74
V
Active State, average
930
1500
µA
Sleep State, idle current
20
250
nA
Supply
Bridge Supply Voltage,
ADC Reference Voltage
VDDB
Current Consumption
IVDD
Power Supply Rejection
20·log10(VDD/VDDB)
(see section 1.4)
PSRVDD
Memory Program Voltage
Internally generated
VDD = 1.8V
17
dB
VDD = 2V
32
dB
VDD,prog
Required voltage level at VDD pin
2.9
Mean Program Current
IVDD,prog
Mean current consumption during
multiple-time memory (MTP)
programming cycle at VDD
6
Peak Program Current
Iprog,max
MTP program at VDD pin,
dynamic switch-on current draw
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
3.6
V
mA
20
mA
8 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Parameter
Symbol
Conditions/Comments
Min
Typ
Max
Unit
16
Bit
1.08
MHz
Analog-to-Digital Converter (ADC, A2D)
Resolution
rADC
10
ADC Clock Frequency
fADC
Internal ADC clock
Reference Voltage n
Vrefn
See section 2.3.2.
VDDB
* 0.03
Reference Voltage p
Vrefp
See section 2.3.2.
VDDB
* 0.97
Offset
A2D_Offset
8-step programmable offset
Integral Nonlinearity (INL)
INLADC
Tested / verified within design
-4
-
+4
LSB
Differential Nonlinearity
DNLADC
Tested / verified within design
-1
-
+1
LSB
Conversion Rate, 16-Bit
Single
fS,raw
Conversions per second for single
16-bit A2D conversion
6
-
355
Hz
0.92
1
1/16
8/16
Amplifier
Gain
Gamp
32 steps
13.2
Gain Error
Gerr
Referenced to nominal gain
-2.5
72
-
2.5
%
0.01
%FSO
3
175
Hz
0.65
1.05
V
50
kΩ
999
Ω
Sensor Signal Conditioning Performance
IC Accuracy Error
1)
ErrA,IC
Conversion Rate, 16-Bit SSC
fS, SSC
Accuracy error for ideally linear
sensor (temperature and
measurand)
Conversion per second for fully
corrected 16-bit measurement
Input
Input Voltage Range
Bridge Resistance
VINP, VINN
Input voltage range at INP and INN
RBR
Full power supply disturbance
rejection (PSRR) capabilities
Reduced PSRR, but full
functionality
1
10
100
Power-Up
tSTA1
VDD ramp up to interface
communication (see section 3.1)
1
ms
tSTA2
VDD ramp up to analog operation
2.5
ms
tWUP1
Sleep to Active State interface
communication
0.5
ms
tWUP2
Sleep to Active State analog
operation
2
ms
Start-up Time
Wake-up Time
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
9 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Parameter
Symbol
Conditions/Comments
Min
Typ
Max
Unit
3.7
4
4.3
MHz
Oscillator
Internal Oscillator Frequency
fCLK
Internal Temperature Sensor
For both temperature ranges:
-40°C to +85°C
Temperature Resolution
0.003
K/LSB
Interface and Memory
SPI Clock Frequency
fC,SPI
I²C™ Clock Frequency
fC,I2C
Program Time
Data Retention
1.4.
tprog
2)
tRET_MTP
Maximum capacitance at MISO
line: 40pF @ VDD=1.8V
MTP programming time per 16-bit
register
1000h @ 125°C
500
10
20
MHz
3.4
MHz
600
µs
a
1)
Percentage referred to maximum full-scale output (FSO); e.g. for 16-bit measurements: ErrA,IC [%FSO] = 100 · MAX{ | ADCmeas – ADCideal | } / 216.
2)
With maximum ambient temperature of 125°C.
Power Supply Rejection Ratio (RSRR) vs. Frequency
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
10 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
2 Circuit Description
2.1.
Brief Description
The ZSSC3027 provides a highly accurate amplification of bridge sensor signals. The compensation of sensor
offset, sensitivity, temperature drift, and non-linearity is accomplished via an 18-bit DSP core running a correction
algorithm with calibration coefficients stored in a multiple-time programmable (MTP) memory (see section 2.4.2
regarding limitations). The ZSSC3027 can be configured for a wide range of resistive bridge sensor types. A
2
digital interface (SPI or I C™*) enables communication. The ZSSC3027 supports two operational modes: Normal
Mode and Command Mode. Normal Mode is the standard operating mode. Typically in Normal Mode, the
ZSSC3027 wakes up from a Sleep State (low power), runs a measurement in Active State, and automatically
returns to the Sleep State. (See section 3.3 for details on operational modes.)
2.2.
Signal Flow and Block Diagram
See Figure 2.1 for the ZSSC3027 block diagram. The sensor bridge supply VDDB and the power supply for analog
circuitry are provided by a voltage regulator, which is optimized for power supply disturbance rejection (PSRR).
See section 1.4 for a graph of PSRR versus frequency. To improve noise suppression, the digital blocks are
powered by a separate voltage regulator. A power supervision circuit monitors all supply voltages and generates
appropriate reset signals for initializing the digital blocks.
The state machine controls the analog circuitry to perform the three measurement types: bridge, temperature, and
offset measurement. The multiplexer selects the signal input to the amplifier, which can be the external signals
from the input pins INP and INN, the internal temperature reference sensor signals, or an input short for
measuring offset. A full measurement request will trigger an automatic sequence of all measurement types and all
input signals. The Temperature Reference Sensor block is based on a resistive sensing element.
* I2C™ is a trademark of NXP.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
11 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Figure 2.1 ZSSC3027 Functional Block Diagram
VDDB
Vreg int
VTP
VTN
Temperature
Reference
Sensor
VDD
AGND / CM
Generator
Bias Current
Generator
Power Ctr.
Voltage
Regulator
VSS
Sensor
Bridge
INP
INN
Multiplexer
ZSSC3027
A
PreAmplifier
D
18-bit DSP Core
(Calculations,
Communication)
16 Bit
VSSB
SPI
Power-ON
Reset
Clock
Generator
Ring
Oscillator
EOC
System
Control
Unit
MTP
ROM
I²CTM
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
The amplifier consists of two stages with programmable gain values. The 1/f noise and inherent offset are
suppressed by auto-zero and chopper stabilizer techniques. This auto-zero sequence is performed before each
bridge sensor and temperature measurement to compensate for the inherent offset of the amplifier.
The ZSSC3027 employs a 2-stage analog-to-digital converter (ADC) based on switched-capacitor technique with
inherit low-pass behavior and noise suppression. The programmable resolution from 10 to 16 bits provides
flexibility for adapting the conversion characteristics. To improve power supply noise suppression, the ADC uses
the bridge supply VDDB as its reference voltage.
The remaining IC-internal offset and the sensor element offset, i.e., the overall system offset for the amplifier and
ADC, can be canceled by an offset and auto-zero measurement, respectively.
st
nd
The DSP accomplishes the auto-zero, span, and 1 and 2 order temperature compensation of the measured
bridge signal. The correction coefficients are stored in the MTP memory.
2
The ZSSC3027 supports SPI and I C™ interface communication for controlling the ZSSC3027, configuration, and
measurement result output.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
12 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
2.3.
Analog Front End
2.3.1. Amplifier
The amplifier has a differential architecture and consists of two stages. The amplification of each stage and the
sensor bridge gain polarity are programmable via settings in the Measurement Configuration Register BM_config
(address 10HEX; see section 3.6.3) in the MTP memory (see section 2.4.2). The first five bits of BM_config are the
programmable gain settings Gain_stage1 and Gain_stage2. The options for the programmable gain settings are
listed in Table 2.1 and Table 2.2.
Table 2.1
Amplifier Gain: Stage 1
Gain_stage1
BM_config Bit G1
BM_config Bit G0
Stage 1 Gain Setting
0
0
12
0
1
20
1
0
30
1
1
40
Table 2.2
Amplifier Gain: Stage 2
Gain_stage2
BM_config Bit G4
BM_config Bit G3
BM_config Bit G2
Stage 2 Gain Setting
0
0
0
1.1
0
0
1
1.2
0
1
0
1.3
0
1
1
1.4
1
0
0
1.5
1
0
1
1.6
1
1
0
1.7
1
1
1
1.8
If needed, the polarity of the sensor bridge gain can be reversed by setting the Gain_polarity bit, which is bit 5 in
the BM_config register (see section 3.6.3). Changing the gain polarity is achieved by inverting the chopper clock.
Table 2.3 gives the settings for the Gain_polarity bit. This feature enables applying a sensor to the ZSSC3027
with swapped input signals at INN and INP; e.g., to avoid crossing wires for the final sensor module’s assembly.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
13 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Table 2.3
Gain Polarity
Gain_polarity (BM_config Bit 5)
Gain
Setting Description
0
+1
No polarity change.
1
-1
Gain polarity is inverted.
The inherent amplifier offset is suppressed by means of auto-zero and chopper techniques. The optimal gain (and
offset) setup for a specific sensor element can be determined by these steps:
1) Collect sensor elements’ characteristic, statistical data (over temperature, ambient sensor parameter, and
over production tolerances):
a. Minimum differential output voltage:
Vmin
b. Maximum differential output voltage:
Vmax
Note: The best possible setup can only be determined if the absolute value of V max is bigger than the
absolute value of Vmin. If this is not the case, the gain polarity should be reversed.
2) If Vmin and Vmax have different signs (normally: Vmax is positive and Vmin is negative), then the required
ADC offset shift can be selected using this ratio: RatioOffset = |Vmin| / (Vmax – Vmin).
In this case, the respective offset setup (A2D_offset) is the nearest integer of multiples of 1/16 in the
th
range of 1/16 to 8/16 (see Table 2.8): A2D_offset = Round_to_x16 {RatioOffset}.
3) Determine which of the two following cases is valid.
a. If RatioOffset – A2D_offset ≤ 0 then calculate
Theoretical optimum gain: Gainopt =(1 – A2D_offset) * Vref / Vmax
b. If RatioOffset – A2D_offset > 0 then calculate
Theoretical optimum gain: Gainopt = A2D_offset * Vref / |Vmin|
with:
Vref = Vrefp – Vrefn = 0.94·VDDB,min  1.5V
Finally, select the setup gain (Gainsetup) as the nearest gain to Gainopt, where Gainsetup ≤ Gainopt.
2.3.2. Analog-to-Digital Converter
A second-order charge-balancing analog-to-digital converter (ADC) is used to convert the amplifier signal. To
allow optimizing the trade-off between conversion time and resolution, the conversion is split into a MSB coarse
conversion and an LSB fine conversion. The final ADC resolution is determined by MSB + LSB. For the bridge
measurement, the MSB-LSB segmentation is programmable via the Msb and Lsb settings in the BM_config
register (10HEX; see section 3.6.3) stored in the MTP memory (see section 2.4.2). For the temperature
measurement, the MSB-LSB segmentation is programmable via the Temp_ADC settings in the BM_config
register.
MSB
LSB
The conversion time is proportional to 2
+2 . During the MSB coarse conversion, the ADC input signal is
MSB
sampled and integrated 2
times, resulting in inherit low-pass behavior and noise suppression. The longer the
MSB coarse conversion is, the better the noise suppression is. Possible settings are listed below in Table 2.4 and
Table 2.5.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
14 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Table 2.4
MSB/LSB Segmentation Settings for Bridge Measurement
Msb Setup Bits [7:6]
in BM_config
Number of MSB Coarse
Conversion Bits
Lsb Setup Bits [9:8]
in BM_config
Number of LSB Fine
Conversion Bits
00BIN
10
00BIN
0
01BIN
12
01BIN
2
10BIN
14
10BIN
4
11BIN
16
11BIN
6
Table 2.5
MSB/LSB Segmentation Settings for Temperature Measurement
Temp_ADC Setup Bits
[14:13] in BM_config
Number of MSB Coarse
Conversion Bits
Number of LSB Fine
Conversion Bits
01BIN
16
0
10BIN
10
6
11BIN
12
4
Setup according to ZMDI configuration in reserved memory
(recommended setup for best performance and speed trade-off)
00BIN
Table 2.6 gives the ADC conversion times for the MSB/LSB settings (yellow indicates 16-bit setups). Useful MSB/
LSB setups are with LSB = 0 (MSB-only conversions) or combinations that result in MSB + LSB ≤ 16. Resolutions
beyond 16-bit mainly digitize the collected front-end noise and typically do not improve the system performance.
Table 2.6
ADC Conversion Times for a Single A2D Conversion
MSB
[Bits]
LSB
[Bits]
10
0
1170
12
0
4625
14
0
18450
16
0
73745
10
2
1180
12
2
4635
14
2
18460
10
4
1200
12
4
4660
10
6
1300
Data Sheet
August 24, 2014
Bridge or Temperature Measurement
Conversion Time in s (typical)
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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15 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Table 2.7 shows the trade-off between noise performance and typical conversion time for 16-bit results for a signal that has been fully conditioned using 4 single measurements: the auto-zero bridge measurement (AZBM), the
bridge measurement (BM), auto-zero temperature measurement (AZTM), and temperature measurement (TM).
Table 2.7
Typical Conversion Times vs. Noise Performance for 16-Bit Results with Full Sensor Signal
Conditioning for AZBM, BM, AZTM, and TM
Note: The pink shading indicates ZMDI’s recommended ADC segmentation for temperature sensor measurement.
ADC Segmentation:
Temperature Sensor
[MSB/LSB]
1)
Typical Measurement
Typical 3-Sigma Noise for
ADC Segmentation: Bridge
1)
Duration, MEASURE, (ACHEX) SSC-Corrected Output
Sensor [MSB/LSB]
[ms]
[counts]
10 / 6
10 / 6
5.8
9.6
10 / 6
12 / 4
13.2
7.4
10 / 6
14 / 2
43.0
6.8
10 / 6
16 / 0
165
6.6
12 / 4
10 / 6
13.2
9.5
12 / 4
12 / 4
20.5
7.3
12 / 4
14 / 2
50.5
6.7
12 / 4
16 / 0
170.3
6.3
16 / 0
10 / 6
162.6
8.1
16 / 0
12 / 4
170.3
6.6
16 / 0
14 / 2
200.3
5.3
16 / 0
16 / 0
319.5
5.2
Reference noise values were obtained with this setup: 17kΩ sensor bridge, 25°C, Gain=54, ADC shift=-1/16 through 15/16 (see below), VDD=1.8V.
The ADC offset is programmable in 8 steps so that the ADC input voltage range can be adapted to the voltage
range at the input pins INP and INN. Possible ADC input voltages and references voltages Vrefn and Vrefp are
shown in Figure 2.2, where VAGND  VDDB/2. The ADC offset is controlled by the A2D_Offset setting bits [12:10] in
the Measurement Configuration Register BM_config (10HEX; see section 3.6.3) in the MTP memory (see section
2.4.2). The ADC offset settings are listed in Table 2.8. See section 1.4 for typical values for Vrefn and Vrefp.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
16 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Figure 2.2 ADC Offset
ADCout
1
VINP, A2D_Offset = 1/16
VINN, A2D_Offset = 1/16
8/16
VINP, A2D_Offset = 8/16
A2D_Offset
VINN, A2D_Offset = 8/16
1/16
0
Table 2.8
Vrefn
VAGND
Vrefp
VIN, VIP
ADC Offset Settings for the Measurement Configuration Register BM_config
Z2
Z1
Z0
(BM_config bit 12)
(BM_config bit 11)
(BM_config bit 10)
ADC Differential Input Range/Vref
Where Vref = Vrefp - Vrefn
A2D_Offset
0
0
0
-1/16 to 15/16
1/16
0
0
1
-2/16 to 14/16
2/16
0
1
0
-3/16 to 13/16
3/16
0
1
1
-4/16 to 12/16
4/16
1
0
0
-5/16 to 11/16
5/16
1
0
1
-6/16 to 10/16
6/16
1
1
0
-7/16 to 9/16
7/16
1
1
1
-8/16 to 8/16
8/16
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
17 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
2.3.3. Temperature Measurement
The ZSSC3027 provides an internal temperature sensor measurement to allow compensation for temperature
effects. See section 1.3 for the temperature sensor resolution. The temperature sensor uses bipolar transistors.
Any transistor circuitry mismatch is suppressed by the dynamic element matching technique. The temperature
output signal is a differential voltage that is adapted by the amplifier for the ADC input.
For temperature measurements, the ADC offset and amplifier gain setting are defined by ZMDI. The ADC
MSB/LSB segmentation is programmable by the user for optimizing noise immunity or conversion time (see
section 2.3.2).
2.3.4. Bridge Supply
The ZSSC3027 provides dedicated bridge supply pins VDDB and VSSB. The ADC reference voltages for the
sensor bridge measurement are derived from these internal voltages so that bridge supply disturbances are
suppressed. The current drive ability of VDDB is limited (see IVDDB in section 1.2).
2.4.
Digital Section
2.4.1.
Digital Signal Processor (DSP) Core
The DSP Core block performs the algorithm for correcting the sensor signal. The resulting coefficients are stored
in the MTP memory. When the measurement results are available, the "end of conversion" signal is set at the
EOC pin. The internal EOC information is valid only if both the measurement and calculation have been
completed.
2.4.2.
MTP Memory
The ZSSC3027’s memory is designed with an OTP (one-time programmable) structure. The memory is organized
in 4 one-time programmable pages. When data in the currently valid memory page needs to be updated, normally
a new page must be selected by increasing the page counter and the whole memory content must be written in its
updated version. The user has access to a 24 x 16 bit storage area for values such as calibration coefficients.
Dedicated calibration values are stored in an area not accessible to the user. The required programming voltage
is generated internally in the ZSSC3027 whereas increased ZSSC3027 power supply requirements must be
fulfilled during programming (see Memory Programming Voltage in section 1.3). There is no over-write or erase
function for the MTP memory. See section 3.4.1 for further details.
The physical memory function is such that each single bit that has not yet been set to 1 (i.e., remains 0) can still
be changed to 1, so it is possible to (partially) re-program an MTP register as shown in the following example:

Assume MTP address 11HEX was written with 8421HEX which is 1000 0100 0010 0001BIN.

Changing the register contents to A6A7HEX (i.e., 1010 0110 1010 0111binary) can be achieved by either
writing A6A7HEX (any already written bit will be ignored automatically) or just writing the difference
compared to 8421HEX, which is 2286HEX.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
18 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
The content of a re-written register can generally be determined by
contentRegister = contentold (BITWISE_OR) contentnew.
If contentRegister equals contentnew, a re-write is possible; e.g., this is not the case for contentold = FFFFHEX and
contentnew ≠ FFFFHEX. Depending on the former and the newly intended MTP addresses and register contents, a
re-programming could be possible.
2.4.3.
Clock Generator
The clock generator, implemented as a ring oscillator, provides a 4MHz clock signal. The frequency is trimmed
during production test.
2.4.4.
Power Supervision
The power supervision block as a part of the voltage regulator combined with the digital section monitors all
power supplies to ensure a defined reset of all digital blocks during power-up or power supply interruptions.
2.4.5.
Interface
2
†
The ZSSC3027 can communicate with the user’s PC via an SPI or I C™ interface . The interface type is selectable via the voltage level on the SEL pin:
 SEL = 0 -> SPI Mode
2
 SEL = 1 -> I C™ Mode
If the SEL pin is not connected, I²C™ communication will be selected (IC-internal pull-up at SEL pin). The SPIspecific pins (SS, MISO) do not need to be connected for I²C™ operation.
To also provide interface accessibility in Sleep State (all features inactive except for the digital interface logic), the
interface circuitry is directly supplied by VDD.
† Functional I2C™ interface properties correspond to the NXP I²C™ bus specification Rev. 0.3 (June 2009).
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
19 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3
Functional Description
3.1.
Power Up
Specifications for this section are given in sections 1.2 and 1.3. On power-up, the ZSSC3027 communication
interface is able to receive the first command after a time t STA1 from when the VDD supply is within operating
specifications. The ZSSC3027 can begin the first measurement after a time of tSTA2 from when the VDD supply is
operational. The wake up time from Sleep State to Active State (see section 3.3) after receiving the activating
command is defined as tWUP1 and tWUP2 (see section 1.3). In Command Mode, subsequent commands can be sent
after tWUP1. The first measurement starts after tWUP2 if a measurement request was sent.
3.2.
Measurements
Available measurement procedures are




AZBM: auto-zero bridge measurement
BM: bridge measurement
AZTM: auto-zero temperature measurement
TM: temperature measurement
AZBM: The configuration for bridge measurements is loaded. The Multiplexer block connects the amplifier input
to the AGND analog ground reference. An analog-to-digital conversion is performed so that the inherent system
offset for the bridge configuration is converted by the ADC to a 16-bit digital word.
BM: The configuration for bridge measurements is loaded. The Multiplexer connects the amplifier input to the
bridge pins INP and INN. An analog-to-digital conversion is performed. The result is a 16-bit digital word.
AZTM: The configuration for temperature measurements is loaded. The Multiplexer connects the amplifier input to
AGND. An analog-to-digital conversion is performed so that the inherent system offset for the temperature
configuration is converted by the ADC to a 16-bit digital word.
TM: The configuration for temperature measurements is loaded. The Multiplexer connects the Amplifier input to
the internal temperature sensor. An analog-to-digital conversion is performed. The result is a 16-bit digital word.
The typical application’s measurement cycle is a complete SSC measurement (using the command ACHEX) with
AZBM, BM, AZTM, and TM followed by a signal correction calculation.
3.3.
Operational Modes
Figure 3.1 illustrates the ZSSC3027 power-up sequence and subsequent operation depending on the selected
2
interface communication mode (I C™ or SPI) as determined by the SEL pin voltage level (see section 2.4.5). With
either interface, after the voltage regulators are switched on, the ZSSC3027’s low voltage section (LV) is active
while the related interface configuration information is read from memory. Then the LV section is switched off, the
ZSSC3027 goes into Sleep State, and the interface is ready to receive commands. Since the interface is always
powered by VDD, it is referred to as the high voltage section (HV).
See Table 3.1 for definitions of the commands. Figure 3.2 shows the ZSSC3027 operation in Normal Mode and
Command Mode including when the LV and HV sections are active as indicated by the color legend.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
20 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
The Normal Mode automatically returns to Sleep State after executing the requested measurements. In
Command Mode, the ZSSC3027 remains active if a dedicated command (Start_NOM) was sent, which is helpful
during calibration. Command Mode can only be entered if Start_CM is the first command received after POR.
Figure 3.1 Operational Flow Chart: Power Up
IC Power On
I2C™ Interface
SPI Interface
IO_mode = I2CTM
yes (I2CTM)
SEL==1
no (SPI)
IO_mode = SPI
Command: load IC-I²C Addr.
Switch off pull-up at SEL
Power up LV
Command: load I/O setup
Data/Status
from LV
LV Operation
Save: IC I²C Address /
Data / Status
Power up LV
CommandMode
==active
yes
Save: Setup / Data /
Status
no
Power down (switch
off LV and wait for
command)
CommandMode
==active
yes
no
Data/Status
from LV
LV Operation
Power down (switch
off LV and wait for
command)
Receive: Command
Received I²C
Slave_Addr == IC I²C
Slave_Addr
no
no
no
yes
SS == 1
Read_bit == 1
(Data fetch)
no
yes
Receive: Command
yes
Execute: Data Fetch
Received CMD ==
Read_DF
yes
Color Legend:
Execute: Data Fetch
LV-Operation
Data Sheet
August 24, 2014
HV-Operation
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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21 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Figure 3.2 Operational Flow Chart: Command Mode and Normal Mode
Start LV
Get command from HV
CM active
CMD==Start_CM
yes
Receive: Command
no
INVALID_CMD
Case (Command)
Start_NOM
Case (Command)
CM inactive
INVALID_CMD
Execute: Command
REGULAR_CMD
Data/Status
from LV
Data/Status
from LV
REGULAR_CMD
Execute: Command
LV Operation
HV Operation
End LV
Sleep Mode
3.4.
3.4.1.
Color Legend:
Command Mode
Command Interpretation
2
SPI/I C™ Commands
The user-accessible section of memory includes addresses 00HEX through 17HEX in the OTP memory that is
designated by the user memory page pointer. Because each of the four OTP memory pages cannot be rewritten
or erased, the memory page pointer must be incremented to the next OTP memory page in order to write to
memory again (see Table 3.1 for the command). After all four user-accessible OTP memory pages have been
used, further write operations are not possible and the “Memory Full” bit is returned as set in the status byte after
write operations (see section 3.5.1).
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
22 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
2
The SPI/I C™ commands supported by the ZSSC3027 are listed in Table 3.1. The command to read an address
in the user memory is the same as its address. The command to read the 16-bit memory status of the data at an
address in user memory is the address plus 20HEX. The command to write to an address in user memory is the
address plus 40HEX.
There is a ZMDI-reserved section of memory that can be read but not over-written by the user.
Table 3.1
2
SPI/I C™ Commands
Note: Every return starts with a status byte followed by the data word as described in section 3.5.1.
Command
(Byte)
Return
Description
Normal
Mode
Command
Mode
00HEX to 17HEX
16-bit user data
Read data in the user memory address
(00HEX to 17HEX) matching the command
(might not be using all addresses).
yes
yes
20HEX to 37HEX
16-bit user memory status
Read memory status for address specified by
command minus 20HEX (addresses 00HEX to
17HEX respectively; see section 3.6.2 for a
description of the memory status).
yes
yes
40HEX to 57HEX
followed by data
(0000HEX to
FFFFHEX)
—
Write data to user memory at address
specified by command minus 40HEX
(addresses 00HEX to 17HEX respectively; might
not be using all addresses).
no
yes
70HEX to 7EHEX
16-bit ZMDI-reserved
memory data
Read data in ZMDI-reserved memory at
address specified by command minus 70HEX
(second set of addresses 00HEX to 0EHEX
respectively).
no
yes
80HEX to 8EHEX
16-bit ZMDI-reserved
memory status
Read memory status bytes for ZMDIreserved memory data at address specified
by command minus 80HEX (second set of
addresses 00HEX to 0EHEX respectively; see
section 3.6.2 for a description of the memory
status bytes).
no
yes
5EHEX
—
Increment user memory page pointer.
no
yes
A0HEX to A7HEX
followed by
XXXXHEX
16-bit wide raw data
Get_Raw This command can be used to
perform a measurement and write the raw
ADC data into the output register. The LSB of
the command determines how the AFE
configuration register is loaded for the
Get_Raw measurement (see Table 3.2).
yes
yes
A8HEX
—
Start_NOM Exit Command Mode and
transition to Normal Mode.
no
yes
A9HEX
—
Start_CM Exit Normal Mode and transition
to Command Mode.
yes
no
Data Sheet
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
(see Table 3.2)
August 24, 2014
23 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Command
(Byte)
Return
Description
Normal
Mode
Command
Mode
AAHEX
—
Write_ChecksumC If not yet written, the
checksum for the valid user MTP page is calculated and written to MTP.
no
yes
ACHEX
16-bit fully corrected bridge
measurement data + 16-bit
corrected internal
temperature
Measure Triggers full measurement cycle
(AZBM, BM, AZTM, and TM, as described in
section 3.2) and calculation and storage of
data in interface (configurations from MTP).
yes
yes
FXHEX
Status followed by last data
NOP Only valid for SPI (see 3.5.1 and 3.5.2).
yes
yes
Table 3.2
Get_Raw Commands
Command
Measurement
AFE Configuration Register
A0HEX followed by 0000HEX
BM – Bridge Measurement
BM_Config
A1HEX followed by ssssHEX
BM – Bridge Measurement
ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be according to the
definitions for BM_Config.
A2HEX followed by 0000HEX
BM-AZBM – Auto-Zero Corrected
1)
Bridge Measurement
BM_Config
A3HEX followed by ssssHEX
BM-AZBM – Auto-Zero Corrected
2)
Bridge Measurement
ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be according to the
definitions for BM_Config.
A4HEX followed by 0000HEX
TM – Temperature Measurement
ZMDI-defined register
A5HEX followed by ssssHEX
TM – Temperature Measurement
ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be according to the
definitions for BM_Config being valid for temperature
measurement in this case (bits [15:13] will be ignored).
A6HEX followed by 0000HEX
TM-AZTM – Auto-Zero Corrected
1)
Temperature Measurement
ZMDI-defined register
A7HEX followed by ssssHEX
TM-AZTM – Auto-Zero Corrected
2)
Temperature Measurement
ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be according to the
definitions for BM_Config being valid for temperature
measurement in this case (bits [15:13] will be ignored).
1)
Recommended for raw data collection during calibration coefficient determination using measurement setups pre-programmed in MTP.
2)
Recommended for raw data collection during calibration coefficient determination using un-programmed (i.e., not in MTP), external measurement
setups; e.g., for evaluation purposes.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
24 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3.5.
Communication Interface
3.5.1.
Common Functionality
Commands are handled by the command interpreter in the low-voltage (LV) section. Commands that need
additional data are not treated differently than other commands because the high-voltage (HV) interface is able to
buffer the command and all the data that belongs to the command and the command interpreter is activated as
soon as a command byte is received.
Every response starts with a status byte followed by the data word. The data word depends on the previous
2
command. It is possible to read the same data more than once if the read request is repeated (I C™) or a NOP
command is sent (SPI). If the next command is not a read request (I²C™) or a NOP (SPI), it invalidates any
previous data.
The status byte contains the following bits (see Table 3.3, Table 3.4, and Table 3.5 for sequence):
 Power indication (bit 6): 1 if the device is powered (VDDB on); 0 if not powered. This is needed for SPI Mode
where the master reads all zeros if the device is not powered or in power-on reset (POR).
 Busy indication (bit 5): 1 if the device is busy, which indicates that the data for the last command is not
available yet. No new commands are processed if the device is busy.
 Actual ZSSC3027 mode (bits 4:3): 00 = Normal Mode; 01 = Command Mode; 1X = ZMDI-reserved.
 Memory integrity/error flag (bit 2): 0 if integrity test passed, 1 if test failed. This bit indicates whether the
checksum-based integrity check passed or failed. Correctable errors are not reported but can be queried
with the memory status commands (see section 3.6.2). The memory error status bit is calculated only
during the power-up sequence, so a newly written CRC will only be used for memory verification and status
update after a subsequent ZSSC3027 power-on reset (POR).
 Data transfer/correction (bit 1): If the last command was a memory write, this bit is 0 if the last memory
write was successful (memory not full yet); otherwise it is 1 (e.g., page increase but already on last MTP
page). If the last command was a memory read, this bit is 1 if the data was corrected.
Table 3.3
General Status Byte
Bit
7
6
5
Meaning
0
Powered?
Busy?
Table 3.4
3
Mode
2
1
0
Memory error?
Internal data
transfer
Special
2
1
0
Memory error?
Data corrected?
ALU saturation?
Status Byte for Read Operations
Bit
7
6
5
Meaning
0
Powered?
Busy?
Table 3.5
4
4
3
Mode
Status Byte for Write Operations
Bit
7
6
5
Meaning
0
Powered?
Busy?
Data Sheet
August 24, 2014
4
3
Mode
2
Memory error?
1
Memory full? 
MTP write reject?
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
0
Don’t care
25 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Table 3.6
Mode Status
Status[4:3]
Mode
00
Normal Mode
01
Command Mode
10
ZMDI-Reserved
11
Command Mode and Reserved
Further status information is provided by the EOC pin. The EOC pin is set when a measurement and calculation
have been completed.
3.5.2.
SPI
The SPI Mode is available when the SEL pin = 0. The polarity and phase of the SPI clock are programmable via
the CKP_CKE setting in address 02HEX as described in Table 3.8. CKP_CKE is two bits: CPHA (bit 10), which
selects which edge of SCLK latches data, and CPOL (bit 11), which indicates whether SCLK is high or low when it
is idle. The polarity of the SS signal and pin are programmable via the SS_polarity setting (bit 9). The different
combinations of polarity and phase are illustrated in the figures below.
Figure 3.3 SPI Configuration CPHA=0
CPHA=0
SCLK (CPOL=0)
SCLK (CPOL=1)
MOSI
MSB
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
LSB
MISO
MSB
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
LSB
/SS
SAMPLE
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
26 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Figure 3.4 SPI Configuration CPHA=1
CPHA=1
SCLK (CPOL=0)
SCLK (CPOL=1)
MOSI
MSB
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
LSB
MISO
MSB
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
LSB
/SS
SAMPLE
In SPI mode, each command except NOP is started as shown in Figure 3.5. After the execution of a command
(busy = 0), the expected data can be read as illustrated in Figure 3.6 or if no data are returned by the command,
the next command can be sent. The status can be read at any time with the NOP command (see Figure 3.7).
Figure 3.5 SPI Command Request
Command Request
MOSI
Command
other than
NOP
CmdDat
<15:8>
CmdDat
<7:0>
MISO
Status
Data
Data
Note: A command request always consists of 3 bytes. If the command is shorter, then it must be completed with 0s.
The data on MISO depend on the preceding command.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
27 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Figure 3.6 SPI Read Status
Read Status
MOSI
Command
= NOP
MISO
Status
Figure 3.7 SPI Read Data
Read Data
(a) Example: after the completion of a Memory Read command
MOSI
Command
= NOP
00HEX
00HEX
MISO
Status
MemDat
<15:8>
MemDat
<7:0>
(b) Example: after the completion of a Full Measurement command (ACHEX)
Data Sheet
August 24, 2014
MOSI
Command
= NOP
00HEX
00HEX
00HEX
00HEX
MISO
Status
BridgeDat
<15:8>
BridgeDat
<7:0>
TempDat
<15:8>
TempDat
<7:0>
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
28 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3.5.3.
2
I C™
2
2
I C Mode is selected by the SEL pin = 1. In I C Mode, each command is started as shown in Figure 3.8. Only the
number of bytes that is needed for the command must be sent. An exception is the HS-mode where 3 bytes must
always be sent as in SPI Mode. After the execution of a command (busy = 0), the expected data can be read as
illustrated in Figure 3.10 or if no data are returned by the command, the next command can be sent. The status
can be read at any time as described in Figure 3.9.
Figure 3.8 I2C™ Command Request
Command Request (I2C™ Write)
S SlaveAddr
0 A Command
from master to slave
S
START condition
from slave to master
P
STOP condition
A
acknowledge
N
not acknowledge
A P
write
S SlaveAddr
0 A Command
A
CmdDat
<15:8>
A
CmdDat
<7:0>
A P
write
2
Figure 3.9 I C™ Read Status
Read Status (I2C™ Read)
S SlaveAddr
1 A
Status
N P
read
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
29 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
2
Figure 3.10 I C™ Read Data
Read Data (I2C™ Read)
(a) Example: after the completion of a Memory Read command
S SlaveAddr
1 A
Status
A
MemDat
<15:8>
A
MemDat
<7:0>
N P
read
(b) Example: after the completion of a Full Measurement command (ACHEX)
S SlaveAddr
1 A
Status
A
BridgeDat
<15:8>
A
BridgeDat
<7:0>
A
TempDat
<15:8>
A
TempDat
<7:0>
N P
read
All mandatory I²C-bus protocol features are implemented. Optional features like clock stretching, 10-bit slave
address, etc., are not supported by the ZSSC3027’s interface.
In I²C-High-Speed Mode, a command consists of a fixed length of three bytes.
3.6.
Memory
In the ZSSC3027, the memory is organized page-wise and can be programmed multiple (4) times (MTP). Each
register can only be programmed once per page. The valid page is determined by the page counter which can be
incremented with the command 5EHEX – this leads to a “reset” of all registers and a re-programming is necessary.
Increasing the customer page counter will disable all old register contents of the former page. It is possible to
(re-)program a total of 4 pages. Resetting the page counter is not possible. The page counter starts with 0 and
th
can be incremented to a maximum of 3. If the 4 memory page has been used, no further changes in the memory
are possible – careful writing and page incrementing is strongly recommended. There are two MTP page types:
 Customer Page: Accessible by means of regular write operations (40HEX to 57HEX). It contains the customer
ID, interface setup data, measurement setup information, and calibration coefficients, etc.
 ZMDI Page:
Only accessible for write operations by ZMDI. The ZMDI page contains specific trim
information and is programmed during manufacturing test by ZMDI.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
30 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3.6.1.
Programming Memory
Programming memory requires a specific supply voltage level (>2.9V) at the VDD pin (see section 1.3 for
specifications). The MTP programming voltage itself is generated by means of an implemented charge pump,
generating an internal memory programming voltage (VPP); no additional, external voltage, other than VDD
needed. The program timing is shown in Figure 3.11. Supplying the ZSSC3027 with VDD>2.9V during memory
programming is required. After the memory is programmed, it must be read again to verify the validity of the
memory contents.
Figure 3.11 Memory Program Operation
command
Start_CM
MemWr
VPP
3.6.2.
MemWr
tVPP
MemWr
MemRd
tVPP
MemWr
memory write customer address
MemRd
memory read customer address
Memory Status Commands
The 16-bit memory status answer for the commands 20HEX to 37HEX and 80HEX to 8EHEX contains the following
information:
 One bit indicating if the data read was corrected.
 Two bits indicating the current page in use.
Table 3.7
Memory Status Word
Bit
15 (MSB)
14
13
12:0
Data Sheet
August 24, 2014
Description
Data was corrected (0: no, 1: yes)
Current page
Undefined – do not use
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
31 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3.6.3.
Memory Contents
Table 3.8
MTP Memory Content Assignments
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
00HEX
15:0
0000HEX
Cust_ID0
Customer ID byte 0 (combines with memory word
01HEX to form customer ID)
01HEX
15:0
0000HEX
Cust_ID1
Customer ID byte 1 (combines with memory word
00HEX to form customer ID)
Interface Configuration
6:0
000 0000BIN
Slave_Addr
8:7
00BIN
-
I²C™ slave address; valid range: 00HEX to 7FHEX
(default: 00HEX)
Note: address codes 04HEX to 07HEX are reserved for
2
entering the I C™ High Speed Mode.
Reserved
Determines the polarity of the Slave Select pin (SS)
for SPI operation:
9
0BIN
SS_polarity


02HEX
Clock polarity and clock-edge select—determines
polarity and phase of SPI interface clock with the
following modes:
11:10
00BIN
CKP_CKE

00  SCLK is low in idle state, data latch with
rising edge and data output with falling edge

01  SCLK is low in idle state, data latch with
falling edge and data output with rising edge
10  SCLK is high in idle state, data latch with
falling edge and data output with rising edge
11  SCLK is high in idle state, data latch with
rising edge and data output with falling edge


15:12
Data Sheet
August 24, 2014
0  Slave Select is active low (SPI and
ZSSC3027 are active if SS==0)
1  Slave Select is active high (SPI and
ZSSC3027 are active if SS==1)
-
Not assigned
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
32 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
Signal Conditioning Parameters
0
0BIN
Offset_B[16]
Bridge offset, bit[16]—functions as the MSB and
combines with Offset_B[15:0] in 05HEX to form the
17-bit coefficient’s absolute value
1
0BIN
Offset_B_sign
Sign for sensor bridge offset (Offset_B):
0 => a positive value or
1 => a negative value
2
0BIN
Gain_B[16]
Bridge gain, bit[16] —functions as the MSB and
combines with Gain_B[15:0] in 06HEX to form the
17-bit coefficient’s absolute value
3
0BIN
Gain_B_sign
Sign of the sensor bridge gain (Gain_B):
0 => a positive value or
1 => a negative value
Tcg[16]
1 -order temperature coefficient of the bridge gain,
bit[16] —functions as the MSB and combines with
Tcg[15:0] in 07HEX to form the 17-bit coefficient’s
absolute value
Tcg_sign
Sign of 1 -order temperature coefficient (Tcg):
0 => a positive value or
1 => a negative value
Tco[16]
1 -order temperature coefficient of the bridge offset,
bit[16] —functions as the MSB and combines with
Tco[15:0] in 08HEX to form the 17-bit coefficient’s
absolute value
Tco_sign
Sign of 1 -order temperature coefficient (Tco):
0 => a positive value or
1 => a negative value
SOT_tco[16]
2 -order temperature coefficient of the bridge offset,
bit[16] —functions as the MSB and combines with
SOT_tco[15:0] in 09HEX to form the 17-bit
coefficient’s absolute value
SOT_tco_sign
Separate sign setting for 2 -order temperature
coefficient (SOT_tco):
0 => a positive value or
1 => a negative value
SOT_tcg[16]
2 -order temperature coefficient of the bridge gain,
bit[16] —functions as the MSB and combines with
SOT_tcg[15:0] in 0AHEX to form the 17-bit
coefficient’s absolute value
st
4
0BIN
st
5
0BIN
03HEX
st
6
0BIN
st
7
0BIN
nd
8
0BIN
nd
9
0BIN
nd
10
Data Sheet
August 24, 2014
0BIN
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
33 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
nd
11
0BIN
SOT_tcg_sign
Separate sign setting for 2 -order temperature
coefficient (SOT_tcg):
0 => a positive value or
1 => a negative value
SOT_bridge[16]
2 -order coefficient of the bridge signal, bit[16] —
functions as the MSB and combines with
SOT_bridge[15:0] in 0BHEX to form the 17-bit
coefficient’s absolute value
SOT_bridge_sign
Separate sign setting for 2 -order bridge coefficient
(SOT_bridge):
0 => a positive value or
1 => a negative value
nd
12
0BIN
nd
13
0BIN
Type of second-order curve correction for the bridge
sensor signal.
14
0BIN
SOT_curve
15
0BIN
TSETL_sign
Separate sign setting for T_SETL:
0 => a positive value or
1 => a negative value
Gain_T[16]
Temperature gain of temperature sensor, bit[16] —
functions as the MSB and combines with
Gain_T[15:0] in 0DHEX to form the 17-bit coefficient’s
absolute value
Gain_T_sign
Separate sign setting for the temperature gain
(Gain_T):
0 => a positive value or
1 => a negative value
SOT_T[16]
2 -order temperature coefficient of temperature
sensor, bit[16] — functions as the MSB and
combines with SOT_T[15:0] in 0EHEX to form the
17-bit coefficient’s absolute value
SOT_T_sign
Separate sign setting for 2 -order temperature
coefficient (SOT_T):
0 => a positive value or
1 => a negative value
Offset_T[16]
Temperature offset of temperature sensor, bit[16] —
functions as the MSB and combines with
Offset_T[15:0] in 0CHEX to form the 17-bit
coefficient’s absolute value
Offset_T_sign
Separate sign setting for the temperature offset
(Offset_T):
0 => a positive value or
1 => a negative value
-
Not assigned
0
0BIN
1
0BIN
0  parabolic curve
1  s-shaped curve
nd
2
0BIN
nd
04HEX
3
0BIN
4
0BIN
5
0BIN
15:6
Data Sheet
August 24, 2014
00 0000 0000BIN
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
34 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
Bits [15:0] of the bridge offset correction coefficient,
which is an 18-bit wide absolute value (the
respective MSBs Offset_B[16] and sign,
Offset_B_sign, are under bits[1:0] in 03HEX)
Valid settings:
[-1/16 to 15/16] = 7000HEX
[-2/16 to 14/16] = 6000HEX
[-3/16 to 13/16] = 5000HEX
[-4/16 to 12/16] = 4000HEX
[-5/16 to 11/16] = 3000HEX
[-6/16 to 10/16] = 2000HEX
[-7/16 to 9/16] = 1000HEX
[-8/16 to 8/16] = 0000HEX
05HEX
15:0
0000HEX
Offset_B[15:0]
06HEX
15:0
0000HEX
Gain_B[15:0]
Bits[15:0] of 17-bit wide absolute value of the bridge
gain coefficient (the respective MSBs, Gain_B[16]
and sign, Gain_B_sign, are under bits[3:2] in 03HEX)
07HEX
15:0
0000HEX
Tcg[15:0]
Coefficient for temperature correction of the bridge
gain term (the respective MSBs, Tcg[16] and sign,
Tcg_sign, are under bits[5:4] in 03HEX)
08HEX
15:0
0000HEX
Tco[15:0]
Coefficient for temperature correction of the bridge
offset term (the respective MSBs, Tco[16] and sign,
Tco_sign, are under bits[7:6] in 03HEX)
nd
09HEX
15:0
0000HEX
SOT_tco[15:0]
2 order term applied to Tco (the respective MSBs,
SOT_tco[16] and sign, SOT_tco_sign, are under
bits[9:8] in 03HEX)
0AHEX
15:0
0000HEX
SOT_tcg[15:0]
2 order term applied to Tcg (the respective MSBs,
SOT_tcg[16] and sign, SOT_tcg_sign, are under
bits[11:10] in 03HEX)
SOT_bridge[15:0]
2 order term applied to the sensor bridge readout
(the respective MSBs, SOT_bridge[16] and sign,
SOT_bridge_sign are under bits[13:12] in 03HEX)
nd
nd
0BHEX
15:0
0000HEX
Bits [15:0] of the temperature offset correction
coefficient (the respective MSBs, Offset_T[16] and
sign, Offset_T_sign, are under bits[5:4] in 04HEX)
Valid settings:
0CHEX
Data Sheet
August 24, 2014
15:0
0000HEX
Offset_T[15:0]
[-1/16 to 15/16] = 7000HEX
[-2/16 to 14/16] = 6000HEX
[-3/16 to 13/16] = 5000HEX
[-4/16 to 12/16] = 4000HEX
[-5/16 to 11/16] = 3000HEX
[-6/16 to 10/16] = 2000HEX
[-7/16 to 9/16] = 1000HEX
[-8/16 to 8/16] = 0000HEX
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
35 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
MTP
Address
0DHEX
Word / Bit
Range
15:0
Default
Setting
0000HEX
Description
Notes / Explanations
Gain_T[15:0]
Bits [15:0] of the absolute value of the temperature
gain coefficient (the respective MSBs, Gain_T[16]
and sign, Gain_T_sign, are under bits[1:0] in 04HEX)
nd
0EHEX
15:0
0000HEX
SOT_T[15:0]
2 order term applied to the temperature reading
(the respective MSBs, SOT_T[16] and sign,
SOT_T_sign, are under bits[3:2] in 04HEX)
0FHEX
15:0
0000HEX
T_SETL
Stores raw temperature reading at the temperature
at which low calibration points were taken
Measurement Configuration Register (BM_config)
st
Gain setting for the 1 PREÀMP stage with
Gain_stage1:
1:0
00BIN
Gain_stage1


00  12
01  20


10  30
11  40
Gain setting for the 2
Gain_stage2:
4:2
000BIN
Gain_stage2
10HEX
5
0BIN
Gain_polarity

000  1.1




001  1.2
010  1.3
011  1.4
100  1.5



101  1.6
110  1.7
111  1.8
nd
PREAMP stage with
Set up the polarity of the sensor bridge’s gain
(inverting of the chopper) with


0  positive (no polarity change)
1  negative (180° polarity change)
Absolute number of bits for the MSB conversion in
the ADC with Msb:
7:6
Data Sheet
August 24, 2014
00BIN
(11BIN)
Msb




00  10-bit
01  12-bit
10  14-bit
11  16-bit
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
36 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
Absolute number of bits for the LSB conversion in
the ADC with Lsb:
9:8
00BIN
Lsb

00  0-bit (single-stage ADC)



01  2-bit
10  4-bit
11  6-bit
ADC offset and resulting A2D input range [Vref] with
A2D_Offset:
12:10
000BIN
A2D_Offset



000  1/16 results in range [-1/16, 15/16]
001  2/16 results in range [-2/16, 14/16
010  3/16 results in range [-3/16, 13/16]




011  4/16 results in range [-4/16, 12/16]
100  5/16 results in range [-5/16, 11/16]
101  6/16 results in range [-6/16, 10/16]
110  7/16 results in range [-7/16, 9/16]

111  8/16 results in range [-8/16, 8/16]
Selection between fixed ADC segmentations for
temperature measurements:
14:13
15
00BIN
0BIN

00  setup according to ZMDI-reserved memory
(recommended setup for best performance and
speed trade-off)



01  MSB=16, LSB=0 (16-bit)
10  MSB=10, LSB=6 (16-bit)
11  MSB=12, LSB=4 (16-bit)
Temp_ADC
-
Reserved
Customer Registers
11HEX
Arbitrary customer use
12HEX
Arbitrary customer use
13HEX
Arbitrary customer use
14HEX
Arbitrary customer use
15HEX
Arbitrary customer use
16HEX
Arbitrary customer use
17HEX
Generated (checksum) for user page through a
linear feedback shift register (LFSR); signature is
checked with power-up to ensure memory content
integrity
Data Sheet
August 24, 2014
15:0
-
ChecksumC
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
37 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
The memory integrity checksum (referred to as CRC) is generated through a linear feedback shift register with the
polynomial:
16
15
2
g(x) = x + x + x + 1
with the initialization value: FFFFHEX.
3.7.
Calibration Sequence
Calibration essentially involves collecting raw signal and temperature data from the sensor-IC system for different
known bridge values and temperatures. This raw data can then be processed by the calibration master (assumed
to be a PC), and the calculated calibration coefficients can then be written to MTP memory. Below is a brief
overview of the steps involved in calibrating the ZSSC3027.
There are three main steps to calibration:
1. Assigning a unique identification to the ZSSC3027. This identification is written to shadow RAM and later
programmed in MTP memory. This unique identification can be stored in the two 16-bit registers
dedicated to customer ID. It can be used as an index into a database stored on the calibration PC. This
database will contain all the raw values of bridge readings and temperature readings for that part, as well
as the known bridge measurand conditions and temperature to which the bridge was exposed.
2. Data collection. Data collection involves getting uncorrected or raw data from the bridge at different
known measurand values and temperatures. Then this data is stored on the calibration PC using the
unique identification of the device as the index to the database.
3. Coefficient calculation and storage in MTP memory. After enough data points have been collected to
calculate all the desired coefficients, the coefficients can be calculated by the calibrating PC and written
to the shadow RAM. After that, MTP memory is programmed with the contents of the shadow RAM.
4. Result. The sensor signal and the characteristic temperature effect on output will be linearized according
to the setup-dependent maximum output range.
It is essential to perform the calibration with a fixed programming setup during the data collection phase. In order
to prevent any accidental misprocessing, it is further recommended to keep the MTP memory setup stable during
the whole calibration process as well as in the subsequent operation. A ZSSC3027 calibration only fits the single
setup used during its calibration. Changes of functional parameters after a successful calibration can decrease
the precision and accuracy performance of the ZSSC3027 as well as of the whole application.
3.7.1.
Calibration Step 1 – Assigning Unique Identification
Assign a unique identification number to the ZSSC3027 by using the memory write command (40HEX followed by
two bytes of identification data and 41HEX followed by two bytes of identification data; see Table 3.1 and Table 3.8)
to write the identification number to Cust_ID0 at memory address 00 HEX and Cust_ID1 at address 01HEX as
described in section 3.6.1. These two 16-bit registers allow for more than 4 trillion unique devices.
3.7.2.
Calibration Step 2 – Data Collection
The number of unique points (measurand and/or temperature) at which calibration must be performed generally
depends on the requirements of the application and the behavior of the resistive bridge in use. The minimum
number of points required is equal to the number of bridge coefficients to be corrected with a minimum of three
different temperatures at three different bridge values. For a full calibration resulting in values for all 7 possible
bridge coefficients and 3 possible temperature coefficients, a minimum of 7 pairs of bridge with temperature
measurements must be collected.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
38 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Within this minimum 3x3 measurements field, data must be collected for the specific value pairs (at known
conditions) and then processed to calculate the coefficients. In order to obtain the potentially best and most robust
coefficients, it is recommended that measurement pairs (temperature vs. measurand) be collected at the outer
corners of the intended operation range or at least at points that are located far from each other. It is also
essential to provide highly precise reference values as nominal, expected values.
Note: The measurement precision of the external calibration-measurement equipment should be ten times more
accurate than the expected ZSSC3027 output precision after calibration in order to avoid precision losses caused
by the nominal reference values (e.g., measurand signal and temperature deviations).
Note: An appropriate selection of measurement pairs can significantly improve the overall system performance.
The determination of the measurand-related coefficients will use all of the measurement pairs. For the
temperature-related correction coefficients, three of the measurement pairs (at three different temperatures) will
be used.
Note: There is an inherent redundancy in the 7 bridge-related and 3 temperature-related coefficients. Since the
temperature is a necessary output (which also needs correction), the temperature-related information is
mathematically separated, which supports faster and more efficient DSP calculations during the normal usage of
the sensor-IC system.
The recommended approach for data collection is to make use of the raw-measurement commands:
 For bridge sensor values:

A2HEX + 0000HEX:
Single bridge measurement for which the configuration register will be loaded
from the BM_Config register (10HEX in MTP); preprogramming the measurement
setup in the MTP is required.

A3HEX + ssssHEX:
Single bridge measurement for which the BM_Config configuration register
(Gain, ADC, Offset, etc.) will be loaded as ssssHEX, which is sent as the data
following the A3HEX command.
 For temperature values (grey text indicates values that are possible but will overwrite ZMDI settings):
3.7.3.

A6HEX + 0000HEX:
Single temperature measurement for which the configuration register will be
loaded from an internal temperature configuration register (preprogrammed by
ZMDI in MTP); preprogramming of the respective configuration is done by ZMDI
prior to IC delivery. This is the recommended approach for temperature data
collection.

A7HEX + ssssHEX:
Single temperature measurement for which the configuration register (Gain,
ADC, Offset, etc.) will be loaded as ssssHEX and must be provided externally via
the interface. The data composition of the temperature configuration register is
similar to the BM_config (address 10HEX) register for the bridge sensor.
Calibration Step 3 – Coefficient Calculations
The math to perform the coefficient calculation is complicated and will not be discussed in detail. There is a brief
overview in the next section. ZMDI will provide software (DLLs) to perform the coefficient calculation (external to
the sensor-IC system) based on auto-zero corrected values. After the coefficients are calculated, the final step is
to write them to the MTP memory of the ZSSC3027.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
39 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3.8.
The Calibration Math
3.8.1.
Bridge Signal Compensation
The saturation check in the ZSSC3027 is enhanced compared with older SSCs from ZMDI. Even saturation
effects of the internal calculation steps are detected, allowing the final correction output to still be determined. It is
possible to get potentially useful signal conditioning results even if there has been an intermediate saturation
during the calculations – these cases are detectable by observing the status bit[0] for each measurement result.
Details about the saturation limits and the valid ranges for values are provided in the following equations.
SOT_curve selects whether second-order equations compensate for sensor nonlinearity with a parabolic or
S-shaped curve. The parabolic compensation is recommended.
The correction formula for the differential signal reading is represented as a two-step process depending on the
SOT_curve setting.
Equations for the parabolic SOT_curve setting (SOT_curve = 0):
Simplified equations:
T  T _ Raw  TSETL
K1  215 
T
215
 SOT _ tcg


 T  Tcg 
15
2


K 2  Offset _ B  BR _ Raw 
Z BP 
B 
(1)
Gain _ B K1
 15  K 2  215
215
2
Z BP  SOT _ bridge


 Z BP  215 
15 
15
2 
2

(2)
T  SOT _ tco


 T  Tco 
15 
15
2  2

(3)
(delimited to positive number range)
(4)
(delimited to positive number range)
(5)
Where
2
B
=
Corrected bridge reading output via I C™ or SPI; range [0HEX to FFFFHEX]
BR_Raw
=
Raw bridge reading from ADC after AZ correction; range [-1FFFFHEX to 1FFFFHEX]
Gain_B
=
Bridge gain term; range [-1FFFFHEX to 1FFFFHEX]
Offset_B
=
Bridge offset term; range [-1FFFFHEX to 1FFFFHEX]
Tcg
=
Temperature coefficient gain term; range [-1FFFFHEX to 1FFFFHEX]
Tco
=
Temperature coefficient offset term; range [-1FFFFHEX to 1FFFFHEX]
T_Raw
=
Raw temperature reading after AZ correction; range [-1FFFFHEX to 1FFFFHEX]
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
40 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
TSETL
=
T_Raw reading at which low calibration was performed (e.g., 25°C);
range [-FFFFHEX to FFFFHEX]
SOT_tcg
=
Second-order term for Tcg non-linearity; range [-1FFFFHEX to 1FFFFHEX]
SOT_tco
=
Second-order term for Tco non-linearity; range [-1FFFFHEX to 1FFFFHEX]
SOT_bridge =
Second-order term for bridge non-linearity; range [-1FFFFHEX to 1FFFFHEX]
ZBP
Intermediary term
=
Complete equations:
T  T _ Raw  TSETL 217
217 1



T
K1  215   15
2



(6)
2 1
  SOT _ tcg


 


T
 Tcg 
15

 217
  2
 217





T

K 2  Offset _ B   BR _ Raw   15
2






217 1



 217
217 1




 217
(7)
2 1
17
2 1
  SOT _ tco


 


T
 Tco
15

 217
  2
 17
2
17
217 1



 217
217 1




 217
217 1





 217

Z BP
B   15
2

217 1
2 1
 SOT _ bridge


15

 

Z

2
BP
 17
215
 2

 17
2
17
(8)
217 1
2 1


217 1 
Gain _ B  K1


15 

 


K

2
 215 2  17
  215


 2  17
2
 
 0
17
Z BP
217 1
17
(9)
216 1



 0
(10)
Where
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
41 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC

= absolute value
ulll
= bound/saturation number range from ll to ul; over/under-flow is reported as saturation in status byte
Equations for the S-shaped SOT_curve setting (SOT_curve = 1):
Simplified equations:
Z BS 
B 
Gain _ B K1
 15  K 2
215
2
(11)
Z BS  SOT _ bridge


 Z BS  215   215
15 
15
2 
2

(delimited to positive number range)
(12)
Complete equations:
17
Z BS
217 1
2 1 
 Gain _ B  K

1



K
15
 215 2  17 

 2  17
 2
2

 Z BS
B   15

 2

Data Sheet
August 24, 2014
(13)
2 1




 215 


 217

17
217 1
2 1
 SOT _ bridge


 

Z
 215 
BS 
15
2
 217

 17
2
17
216
(14)
0
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
42 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
3.8.2.
Temperature Signal Compensation
Temperature is measured internally. Temperature correction contains both linear gain and offset terms as well as
a second-order term to correct for any nonlinearities. For temperature, second-order compensation for nonlinearity is always parabolic. Again, the correction formula is best represented as a two-step process as follows:
Simplified equations:
ZT 
Gain _ T
 T _ Raw  Offset _ T   215
215
(delimited to positive number range)
(15)
T 
Z T  SOT _ T


 Z T  215 
215  215

(delimited to positive number range)
(16)
Complete equations:
217 1
2 1
 Gain _ T

217 1 


Z T  

T
_
Raw

Offset
_
T
 215 
17
2 
15
 217
 2
 0
17
216 1
2 1

217 1
 
Z T   SOT _ T

15

T  15    15  Z T 
2  
 2  2
 217
 17 

2 

0
17
(17)
(18)
Where
Gain_T
=
Gain coefficient for temperature; range [-1FFFFHEX to 1FFFFHEX]
T_Raw
=
Raw temperature reading after AZ correction; range [-1FFFFHEX to 1FFFFHEX]
Offset_T
=
Offset coefficient for temperature; range [-1FFFFHEX to 1FFFFHEX]
SOT_T
=
Second-order term for temperature source non-linearity; range [-1FFFFHEX to 1FFFFHEX]
ulll
=
bound/saturation number range from ll to ul; over/under-flow is reported as saturation in
status byte
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
43 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
4 Die Pad Assignments
The ZSSC3027 is available in die form. See Figure 4.1 for pad assignments.
Note that the ZMDI-test pads are for ZMDI use only.
Figure 4.1 ZSSC3027 Pad Assignments
Table 4.1
Pad Assignments
Name
Direction
Type
VDD
IN
Supply
IC positive supply voltage for the ZSSC3027; regular bond pad
VSS
IN
Supply
Ground reference voltage signal
VDDB
OUT
Analog
Positive bridge supply
INN
IN
Analog
Negative bridge signal
EOC
OUT
Digital
End of conversion; regular bond pad
Data Sheet
August 24, 2014
Description
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
44 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Name
Direction
Type
Description
MISO
OUT
Digital
Data output for SPI
SCLK/SCL
IN
Digital
Clock input for I²C™/SPI
MOSI/SDA
IN/Out
Digital
Data input for SPI; data in/out for I²C™
VSSB
OUT
Analog
Negative bridge supply (bridge sensor ground)
INP
IN
Analog
Positive bridge signal
SEL
IN
Digital
I²C™ or SPI interface select
SS
IN
Digital
Slave select for SPI
ZMDI-test
-
-
Do not connect to these pads
5 Quality and Reliability
The ZSSC3027 is available in a standard qualification version. For the standard version ZSSC3027CCxxx, all
data specified parameters are guaranteed if not stated otherwise.
6 Ordering Sales Codes
Sales Code
Description
Package
ZSSC3027AC1B
Die—temperature range: –40°C to +85 °C
Wafer (304µm) unsawn, tested
ZSSC3027AC6B
Die—temperature range: –40°C to +85 °C
Wafer (725µm) unsawn, tested
ZSSC3027AC7C
Die—temperature range: –40°C to +85°C
Wafer (200µm) unsawn, tested
ZSSC3027AI1D
Engineering samples, Die—temperature range: –40°C to +85°C
Dice in waffle pack (304µm)
ZSSC3026-KIT
Evaluation Kit for ZSSC3026, including boards, cable, software, and 1 ZSSC3026 PQFN24 sample.
The ZSSSC3026 is equivalent to the ZSSC3027. ZMDI recommends using the ZSSC3026 Evaluation
Kit to evaluate the capabilities of the ZSSC3027 because the ZSSC3027 is only available as die.
Contact ZMDI Sales for additional information.
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
45 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
7
Related Documents
Note: X_xy refers to the latest version of the documents.
Document
File Name
ZSSC3027 Feature Sheet
ZSSC3027_FeatureSheet_Rev_X_xy.pdf
ZSSC30x6 Evaluation Kit Documentation*
ZSSC30x6_EvaluationKit_Rev_X_xy.pdf
ZSSC30x6 Application Note—Calibration Sequence and DLL**
ZSSC30x6_Calibration_Rev_X_xy.pdf
* This document is applicable to both the ZSSC30x6 and ZSSC3027 and is included with the software for the ZSSC3026 Evaluation Kit. The software can be
freely downloaded from the ZSSC3026 product page.
** This document is applicable to both the ZSSC30x6 ICs and the ZSSC3027, and it is available on the ZSSC3026 product page at www.zmdi.com/zssc3026.
A free customer login is required to access this document. To establish a customer login, click on login in the upper right corner of the ZMDI website and
follow the instructions.
Visit the ZSSC3027 product page at www.zmdi.com/zssc3027 on ZMDI’s website www.zmdi.com or contact your nearest
sales office for ordering information or the latest version of this document.
8
Glossary
Term
Description
A2D
Analog-to-digital
ACK
Acknowledge (interface’s protocol indicator for successful data/command transfer)
ADC
Analog-to-digital converter or conversion
AZ
Auto-zero (unspecific)
AZB
Auto-zero measurement for sensor bridge path
AZT
Auto-zero measurement for temperature path
CLK
Clock
DAC
Digital-to-analog conversion or converter
DF
Data fetch (this is a command type)
DSP
Digital signal processor (digital configuration, calibration, calculation, communication unit)
FSO
Full-scale output (value in percent relative to the ADC maximum output code; resolution dependent)
LSB
Least significant bit (“fine” portion of the converted signal)
LFSR
Linear Feedback Shift Register
MR
Measurement Request (this is a command type)
MSB
Most significant bit (“coarse” portion of the converted signal)
NACK
Not Acknowledge (interface’s protocol indicator for unsuccessful data/command transfer)
POR
Power-on reset
Data Sheet
August 24, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
46 of 47
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Term
Description
PreAmp
Preamplifier
SM
Signal measurement
SOT
Second-order term
TC
Temperature coefficient (of a resistor or the equivalent bridge resistance)
TM
Temperature measurement
9
Document Revision History
Revision
Date
Description
1.00
December 10, 2013
First release of data sheet.
1.01
August 24, 2014
Update for contact information.
Minor edit for die description.
Sales and Further Information
www.zmdi.com
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.306
Fax
+49.351.8822.337
USA Phone 1.855.275.9634
Phone +1.408.883.6310
Fax
+1.408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Data Sheet
August 24, 2014
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
11th Floor, Unit JA-1102
670 Sampyeong-dong
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
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