tai-saw technology co., ltd.

TAI-SAW TECHNOLOGY CO., LTD.
3.2x1.5 32.768KHz Crystal Unit
MODEL NO.: TZ1006A
REV. NO.: 8.0
Revise:
Rev.
Rev.
Page
Rev. Account
Date
Ref. No.
Reviser
4
5
P.4
P.3~4
03/24/10’ 5.0
12/02/11’ 6.0
Quinton Lo
Ginger Huang
6
P.4~5
05/30/12’ 7.0
Ginger Huang
7
P.3
ECN.#201000116
Change Features & Mechanical
Dimensions
Change base 1 drawing and
making rule
Add Shunt Capacitance Spec
10/11/12’ ECN-201200289 Ginger Huang
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
2
TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: [email protected]
Web: www.taisaw.com
SMD 3.2x1.5 32.768KHz Crystal Unit
MODEL NO.: TZ1006A
REV. NO.: 8.0
Features:
RoHS Compliant
Lead free
Lead-free soldering
z
z
z
z
Ceramic Seam Weld Package or Ceramic Glass Seal Package
Excellent Reliability Performance
Ultra Miniature Package
Available to Surface Mount Technology and IR Reflow Process
Description and Applications:
Surface mount 3.2mmx1.5mm crystal unit for use in communications devices,.
Electrical Specifications:
TZ1006A
Specification
Nominal Frequency
32.768 KHz
Operating Temperature Range
-40°C to +85°C
Turnover Temperature
25 +/- 5 °C
Parabolic Curvature Constant
-0.027 ppm / ℃2 max.
Frequency Make Tolerance (FL)
+/-20 ppm @ 25°C +/- 2°C
Equivalent Series Resistor (ESR)
80 kΩ max.
Drive Level
1.0 uW max.
Load Capacitance (CL)
12.5 pF
Shunt Capacitance (Co)
2.0 pF max ; 0.9 pF typ.
Aging
+/-3.0 ppm/year @25°C
Marking
Laser marking
Insulation Resistance
500M Ω min at DC 100V
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
3
Mechanical Dimensions (mm):
Base1
Base2
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
4
Base 1 Marking:
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
5
Base 2 Marking:
Line1 : A (Frequency ) + Y ( Year code : 9 for 2009 ) + W (Week code ) + X ( Traceability Code )
AYWWX
Tape / Reel and Packing:
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
6
Reflow Profile:
300
Reflow Area
Temperature (deg C)
Rising Area
Preheat Area
Forced Cooling Area
250
200
150
100
Max peak temperature: 260 deg C
50
0
0
60
120
180
240
300
360
Time (seconds)
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
7
Reliability Specifications
Test name
Reference
standard
Test process / method
Mechanical characteristics
resistance to
Soldering heat
(IR reflow)
Temp./ Duration : 260°C /10sec ×2 times
Total time : 4min.(IR-reflow)
Vibration
Total peak amplitude : 1.5mm
Vibration frequency
: 10 to 55 Hz
Sweep period
: 1.0 minute
Vibration directions : 3 mutually perpendicular
Duration
: 2 hr / direc.
directions : 3 impacts per axis
Acceleration : 3000g's, +20/-0 %
Duration
: 0.3 ms (total 18 shocks)
Waveform : Half-sine
Solder Temperature:265±5°C
Duration time: 5±0.5 seconds.
Mechanical
Shock
Solderability
EIAJED-4701
-300(301)M(II)
MIL-STD 202F
method 201A
MIL-STD 202F
method 213C
MIL-STD 883G
method 2003
Environmental characteristics
Thermal Shock
Humidity test
Dry heat
( Aging test )
PCT test
Heat cycle conditions
-55 ℃ (30min) ←→
* cycle time : 10 times
125 ℃ (30min)
Temperature : 70 ± 2 °C
Relative humidity : 90~95%
Duration
: 96 hours
Temperature : 125 ± 2 °C
Duration
: 168 hours
2
MIL-STD 883G
method 1010.7
MIL-STD 202F
method 103B
5
Pressure: 2.06kg/cm (2.03*10 pa)
Temperature : 121 ± 2 °C
Relative humidity : 100%
Duration
: 24 hours
TAI-SAW TECHNOLOGY CO., LTD.
MIL-STD 883G
method 1008.2
condition C
EIAJED-4701-3
B-123A
TST DCC
Release document
8