TAI-SAW TECHNOLOGY CO., LTD. 3.2x1.5 32.768KHz Crystal Unit MODEL NO.: TZ1006A REV. NO.: 9.0 Revise: Rev. Rev. Page Rev. Account Date Ref. No. Reviser 4 5 P.4 P.3~4 03/24/10’ 5.0 12/02/11’ 6.0 Quinton Lo Ginger Huang 6 P.4~5 05/30/12’ 7.0 Ginger Huang 7 8 P.3 P.3 ECN.#201000116 Change Features & Mechanical Dimensions Change base 1 drawing and making rule Add Shunt Capacitance Spec Change Electrical Spec 10/11/12’ ECN-201200289 Ginger Huang 01/04/13’ ECN-201300009 Ginger Huang TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 2 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: [email protected] Web: www.taisaw.com SMD 3.2x1.5 32.768KHz Crystal Unit MODEL NO.: TZ1006A REV. NO.: 9.0 Features: RoHS Compliant Lead free Lead-free soldering z z z z Ceramic Seam Weld Package or Ceramic Glass Seal Package Excellent Reliability Performance Ultra Miniature Package Available to Surface Mount Technology and IR Reflow Process Description and Applications: Surface mount 3.2mmx1.5mm crystal unit for use in communications devices,. Electrical Specifications: TZ1006A Specification Nominal Frequency 32.768000 KHz Operating Temperature Range -40°C to +85°C Turnover Temperature 25 +/- 5 °C Parabolic Curvature Constant -0.04 ppm / ℃2 max. Frequency Make Tolerance (FL) +/-20 ppm @ 25°C +/- 2°C Equivalent Series Resistor (ESR) 80 kΩ max. Drive Level 1.0 uW max. Load Capacitance (CL) 12.5 pF Shunt Capacitance (Co) 2.0 pF max ; 0.9 pF typ. Aging +/-3.0 ppm/year @25°C Marking Laser marking Insulation Resistance 500M Ω min at DC 100V TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 Mechanical Dimensions (mm): Base1 Base2 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 Base 1 Marking: TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 Base 2 Marking: Line1 : A (Frequency ) + Y ( Year code : 9 for 2009 ) + W (Week code ) + X ( Traceability Code ) AYWWX Tape / Reel and Packing: TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 Reflow Profile: 300 Reflow Area Temperature (deg C) Rising Area Preheat Area Forced Cooling Area 250 200 150 100 Max peak temperature: 260 deg C 50 0 0 60 120 180 240 300 360 Time (seconds) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7 Reliability Specifications Test name Test process / method Reference standard Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260°C /10sec ×2 times Total time : 4min.(IR-reflow) Vibration Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature:265±5°C Duration time: 5±0.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Humidity test Dry heat ( Aging test ) PCT test Heat cycle conditions -55 ℃ (30min) ←→ * cycle time : 10 times 125 ℃ (30min) Temperature : 70 ± 2 °C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 ± 2 °C Duration : 168 hours 2 MIL-STD 883G method 1010.7 MIL-STD 202F method 103B 5 Pressure: 2.06kg/cm (2.03*10 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration : 24 hours TAI-SAW TECHNOLOGY CO., LTD. MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A TST DCC Release document 8