Technical Data Sheet Pb Free Specification SSC-LCW100Z1 (Rev. 3.3 - 101123) Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet [ Contents ] 1. Description 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Electro-Optical characteristic diagram 5. Reliability Test 6. Binning & Labeling 7. Outline Dimension 8. Reel Structure 9. Packing 10. Soldering profile 11. Precaution for Use Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet SSC-LCW100Z1 SSC-LCW100Z1 1. Description Features Small size suitable for compact • 3.5 X 2.8 X 1.6 mm appliances. • Emitted Color : White - Surface-mounted chip LED device. • CIE chromaticity - Pb-free and RoHS complaint - component. - High brightness, High efficiency - Tape and Reel packing. - Increases the life time of battery. x : 0.33 y : 0.34 x : 0.37 y : 0.37 x : 0.44 y : 0.41 Material : InGaN Applications • Array lighting • Other decoration lighting • Information Boards • Lighting for Small Size Device. Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 2. Absolute maximum ratings (Ta=25℃) Parameter Symbol Value Unit Power Dissipation Pd 175 mW Forward Current IF 50 mA Peak Forward Current IFM *1 60 mA ESD Sensitivity HBM 10,000 V Operation Temperature Topr. -30 ~ 85 ℃ Storage Temperature Tstg. -40 ~ 95 ℃ Junction Temperature Tj. 115 ℃ *1 IFM conditions: Pulse width Tw≤ 1msec and Duty ratio≤1/10. 3. Electro-Optical Characteristics (Ta=25℃) Parameter- Symbol Condition Min Typ Max Unit Forward Voltage VF IF=20 ㎃ 2.7 3.1 3.7 V Zener Forward Voltage VF(z) IF=5 ㎃ 0.6 0.8 1.5 V Color Temperature CCT IF=20 ㎃ 2600 - 8200 K Luminous Intensity Iv IF=20 ㎃ 1270 2100 - mcd Luminous Flux*2 Фv IF=20 ㎃ 4 6.6 - lm CRI Ra IF=20 ㎃ 70 75 80 - Luminous Intensity Iv IF=20 ㎃ 1270 1700 - mcd Luminous Flux*2 Фv IF=20 ㎃ 4 5.4 - lm CRI Ra IF=20 ㎃ 75 80 90 - Viewing Angle*3 2θ1/2 IF=20 ㎃ - 120 - ˚ Thermal Resistance Rθ(J-S) IF=20 ㎃ 4,700 K ~ 8,200 K 2,600 K ~ 4,700 K 57 ˚C/W *2 Фv is total luminous flux output as measured with an integrating sphere. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, color coordinate 0.01, VF ±0.1 V) Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Forward Current vs. Forward Voltage Ta = 25o Relative Luminous Flux vs. Forward Current 2 .4 100 2 .0 Relative Luminous Flux Forward Current IF[mA] 2 .2 10 1 .8 1 .6 1 .4 1 .2 1 .0 0 .8 0 .6 0 .4 0 .2 1 2 .4 0 .0 2 .6 2 .8 3 .0 3 .2 3 .4 3 .6 0 10 F o rw ard V o ltage V F [V ] 20 30 40 50 Forw ard C urrent I F [m A] Ambient Temperature vs Allowable Forward Current Relative Light Output vs. Junction Temperature at IF=20mA 120 60 100 50 80 40 O RjaT = 90 C/W Current[mA] Relative Light Output(%) Technical Data Sheet 4. Electro-Optical Characteristic Diagram 60 40 Natural White, Warm White Pure White 20 O RjaT = 200 C/W O RjaT = 250 C/W 30 O RjaT = 300 C/W 20 10 0 0 25 50 75 100 125 150 0 O 20 40 60 80 100 O Junction Temperature( C) Ambient Temperature[ C] Radiation Diagram Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) 1. 4700K ~ 8200K Relative Spectral Power Distribution 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 900 Wavelength [nm] 2. 2600K ~ 4700K 1 .0 Relative Spectral Power Technical Data Sheet Spectrum Distribution 0 .8 0 .6 0 .4 0 .2 0 .0 30 0 40 0 50 0 6 00 7 00 800 W a v e le n g th Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 5. Reliability Test Item Thermal Shock Test Conditions Ta = -40℃ (1 hour) ~ 85℃ (1 hour) Duration / Cycle Number Of Damaged 100 Cycle 0/22 Ta = 85℃, RH = 85% Thermostable (24 hours Storage) Æ Reflow 3 cycle Æ Thermal Shock 30 Cycle 0/22 High Temperature Storage Ta = 85℃ 1000 Hours 0/22 High Temp. High Humidity Storage Ta = 85℃, RH = 85% 1000 Hours 0/22 Low Temperature Storage Ta = -40℃ 1000 Hours 0/22 High Temp. High Humidity Life Test Ta = 60℃, RH = 90%, IF = 20mA 1000 Hours 0/22 High Temperature Life Test Ta = 85℃, IF = 20mA 1000 Hours 0/22 Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 6. Binning & Labeling 0.46 2600K 2900K 0.44 F2 4200K y coordinate G2 3700K 0.42 0.40 F0 H1 E0 C2 0.36 7000K B0 A0 8200K 0.30 Z0 G1 F1 D0 B2 E1 C0 0.34 G0 D2 5300K 6000K H0 E2 4700K 0.38 0.32 H2 3200K D1 C1 B1 A1 Z1 ANSI 0.28 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 x coordinate Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet (1) Color Coordinate : x, y <IF=20mA, Ta=25℃> 8200~7000 K Z0 7000~6000 K Z1 A0 A1 x y x y x y x y 0.2950 0.2980 0.3019 0.2760 0.3205 0.3481 0.3068 0.3113 0.2890 0.3150 0.2950 0.2980 0.3028 0.3304 0.3221 0.3261 0.3028 0.3304 0.3068 0.3113 0.3068 0.3113 0.3234 0.3105 0.3068 0.3113 0.3104 0.2940 0.3221 0.3261 0.3104 0.2940 6000~5300 K B0 B1 B2 x y x y x y 0.3376 0.3616 0.3222 0.3243 0.3376 0.3616 0.3207 0.3462 0.3234 0.3105 0.3380 0.3770 0.3222 0.3243 0.3365 0.3258 0.3200 0.3560 0.3366 0.3369 0.3366 0.3369 0.3207 0.3462 5300~4700 K C0 C1 C2 x y x y x y 0.3551 0.3760 0.3365 0.3258 0.3565 0.3910 0.3376 0.3616 0.3366 0.3369 0.3551 0.3760 0.3366 0.3369 0.3515 0.3487 0.3376 0.3616 0.3515 0.3487 0.3500 0.3360 0.3380 0.3770 Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 4700~4200 K D0 D1 D2 x y x y x y 0.3737 0.3549 0.3513 0.3671 0.3875 0.3743 0.3471 0.3580 0.3513 0.3500 0.3650 0.3671 0.3471 0.3360 0.3450 0.3580 0.3737 0.3770 0.3565 0.3549 0.3875 0.4030 0.3910 0.3743 4200~3700 K E0 E1 E2 x y x y x y 0.4007 0.3737 0.3671 0.3900 0.4043 0.3875 0.3580 0.3718 0.3650 0.3671 0.3898 0.3850 0.3450 0.3580 0.3716 0.3600 0.4050 0.4007 0.3737 0.3770 0.4190 0.4043 0.3875 0.4030 3700~3200 K F0 F1 F2 x y x y x y 0.4298 0.3998 0.3892 0.4150 0.4163 0.4015 0.3695 0.3816 0.3892 0.3850 0.4100 0.4150 0.3695 0.3600 0.3700 0.3816 0.4298 0.4360 0.4050 0.3998 0.4163 0.4310 0.4190 0.4015 3200~2900 K G0 G1 G2 x y x y x y 0.4560 0.4298 0.4150 0.4377 0.4260 0.4163 0.3816 0.3896 0.4100 0.4150 0.4377 0.4320 0.3700 0.3816 0.3896 0.3780 0.4640 0.4560 0.4298 0.4360 0.4410 0.4260 0.4163 0.4310 2900~2600K H0 H1 H2 x y x y x y 0.4812 0.4560 0.4377 0.4595 0.4318 0.4260 0.3896 0.3942 0.4377 0.4320 0.4510 0.4595 0.3896 0.3780 0.3800 0.3942 0.4812 0.4920 0.4640 0.4560 0.4318 0.4510 0.4410 0.4260 Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet (2) Luminous Intensity : LI [mcd] / Luminous Flux: LF [lm] Rank IV [mcd] LF [lm] A 1270~1590 4.0~5.0 B 1590~1910 5.0~6.0 C 1910~2230 6.0~7.0 D 2230~2550 7.0~8.0 Condition 20mA (3) Forward Voltage: VF [V] Rank VF [V] A 2.70~2.95 B 2.95~3.20 C 3.20~3.45 D 3.45~3.70 Condition 20mA Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) : k n a R Technical Data Sheet (4) Labeling #### QUANTITY : 2000 LOT NUMBER : #######-##-###-### 1 Z 0 0 1 W C L : R E B M U N T R A P C S S 1 Z 0 0 1 W C L Day Month Year (5) Rank #1#2#3#4 - #1 : Luminous Intensity : LI [mcd] / Luminous Flux : LF [lm] - #2#3 : Color Coordinates : x, y - #4 : Forward Voltage : VF [V] Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 7. Outline Dimension Tolerance: ±0.1, Unit: ㎜ Cathode Mark 2.8 R1.3 1.6 K : CATHODE 0.3 3.5 1.1 [TOP VIEW] A : ANODE 0.2 [SIDE VIEW] [INNER CIRCUIT] 2.84 K 0.75 0.3 1.05 0.5 0.5 *A 2.25 2.55 0.5 A [BOTTOM VIEW] [Recommended Solder Pattern] *A : This area can be covered with thin resin. [Recommended Array Pattern] Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 8. Reel Structure Cathode Anode Tolerance: ±0.2, Unit: ㎜ (1) Quantity: 2,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10˚angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Reel : k n a R Technical Data Sheet 9. Packing #### QUANTITY : 2000 LOT NUMBER : #######-##-###-### 1 Z 0 0 1 W C L : R E B M U N T R A P C S S 1 Z 0 0 1 W C L Aluminum Vinyl Bag : k n a R #### QUANTITY : 2000 LOT NUMBER : #######-##-###-### LEVEL 2a 1 Z 0 0 1 W C L This bag contains MOISTURE SENSITIVE DEVICES 1 Z 0 0 1 W C L : R E B M U N T R A P C S S CAUTION ############################# ############################# ############################# ################## ############################# ############################# ############################# ############################# Outer Box *Material: Paper(SW3B(B)) TYPE SIZE(mm) a 7inch 245 b 220 c 142 c TUV CHIP LED MADE IN KOREA 1 Z 0 0 1 W C L C S S : : E D O C T R A P Acriche Semiconductor EcoLight b D T L , . O C R O T C U D N O C I M E S L U O E S a A E 0 0 0 , 0 2 : : : O N E T T T Y O A ' Q L D RoHS Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 10. Soldering profile (1) Lead Solder Lead Solder Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 o C / sec. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 o C / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. 10 sec. Max. (3) Hand Soldering conditions Do not exceed 1 second at maximum 280ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 11. Precaution for Use 1. Storage To avoid absorption of moisture, it is recommended to store parts in a dry box (or desiccator) with a desiccant. Otherwise, storage in the following environment is recommended. ※ Temperature : 5℃~30℃ Humidity : 60%HR max. 2. Parts stored more than four weeks after opening or if desiccant indicator shower color changes, it is highly recommended that LED’s should be baked for 10 ~ 12 hours at 60˚C±5˚C 3. LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more after shipment from SSC, storage in a sealed container with a nitrogen is recommended. 4. If the LED is considered to be wet, it is highly recommended that the LED should be dried for 100Hr at 80±5℃ or 12Hr at 100±5℃. 5. Any mechanical force or excess vibration should be avoided during temperature cooling process to normal temperature after reflow. 6. Rapid cooling should be avoided 7. LED should not be placed on a flexible area of the PCB 8. This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. 9. When the LED is operating in DC mode, the driving current should be determined after considering the thermal properties of the application and maximum ambient temperature requirements. 10. Damage prevention from ESD or Surge. ☞ It is highly recommended to use the wrist-band or anti electrostatic gloves when handling the LED’s ☞ All devices, equipments and machines mush be properly grounded Rev. 3.3 November 2010 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0)