Technical Data Sheet Pb Free Specification THBTGFR421 SSC Drawn Approval Customer Approval Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet [ Contents ] 1. Description 2. Absolute maximum ratings 3. Electro-Optical characteristics 4. Characteristic diagrams 5. Reliability result 6. Rank 7. Outline Dimension 8. Material 9. Reel Structure 10. Packing 11. Soldering profile 12. Precaution for Use Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet THBTGFR421 - 1. Description Features Small size suitable for compact • 1.6 X 1.5 X 0.5 mm • Untinted, Diffused flat appliances. - THBTGFR421 Surface-mounted chip LED mold device. - • Add Zener Diode • Wavelength : Pb-free and RoHS complaint component. - High brightness, High efficiency - Tape and Reel packing. - Increases the life time of battery. -. Red : 625 nm -. Green : 525 nm -. Blue: 465nm Applications Cellular phone’s keypad lightning Information Boards Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet 2. Absolute maximum ratings ℃ (Ta=25 ) Parameter Symbol Power Dissipation Value Unit Red Green Blue Pd 69 66 66 mW Forward Current IF 30 20 20 mA Peak Forward Current IFM *1 100 50 50 mA Operation Temperature Topr. -40 ~ 85 Storage Temperature Tstg. -40 ~ 100 ℃ ℃ *1 IFM conditions: Pulse width Tw≤1ms and Duty ratio≤1/10 3. Electro-Optical Characteristics ℃ (Ta=25 ) Parameter color Symbol Condition Red Forward Voltage Green VF IF=10 ㎃ Blue Reverse Current Reverse Voltage Luminous Intensity*2 Wavelength Spectral Bandwidth Viewing Angle*3 Red Green Blue IR VR=5V VR IR=10mA Red Min Typ Max 1.7 1.9 2.3 2.7 3.1 3.3 V 2.7 3.1 3.3 - - 10 ㎂ 0.7 0.86 1.5 0.7 0.86 1.5 50 70 100 150 220 290 Blue 30 55 85 Red 615 625 635 Green IV λ Green IF=10 ㎃ 515 525 535 Blue 460 465 472 Red ㎃ - 15 - - 30 - ㎃ - 20 - - 120 - Green d Δλ IF=10 θ IF=30 (total) Blue R,G,B 2 IF=10 ㎃ 1/2 Unit mA mcd nm nm ˚ *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All measurements were made under the standardized environment of SSC. (Tolerance : Iv ± 10 %, λd ± 2 nm, VF ± 0.1 V) Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Ta = 25o Forward Current vs. Forward Voltage Relative Luminous Intensity vs. Forward Current 100 180 Relative Intensity IV[%] 160 10 1 140 120 100 80 60 40 RED GREEN BLUE 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 RED GREEN BLUE 20 0 0.1 3.6 0 5 Forward Voltage VF[V] 10 15 20 25 30 35 40 Forward Current IF[mA] Forward Current vs. Ambient Temperature (per die) Spectrum 40 1.0 Red 0.8 Intensity[a.u.] 30 Forward current IF(mA) Forward Current IF[mA] Technical Data Sheet 4. Characteristic Diagrams 20 Blue / Green 10 0 0.6 0.4 0.2 -25 0 25 50 75 o Ambient temperature Ta( C) 100 0.0 300 400 500 600 700 800 Wavelength [nm] Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet Radiation Diagram Ta = 25o 90 120 150 180 60 30 0 Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet 5. Reliability Test Item Duration / Cycle Number Of Damaged ℃ 500 hrs 0/22 ℃ 500 hrs 0/22 500 hrs 0/22 100 cycle 0/22 1 time 0/22 Test Conditions Operating at Room temperature 10mA, @25 Operating at High temperature 10mA, @85 Operating at High temperature / High humidity ℃ 10mA, @60 ,90% ℃ Shift (2hr/cycle) Thermal shock test Thermal resistance Test -40~85 ℃ 85 , 85% 24hrs Reflow 3 times (Max 260 10sec) Thermal shock 30 cycle ℃ ℃ MSL : 2a (30 , 60% : 4 weeks) *Criterion OK Iv > Initial value * 0.5 VF Initial value ± 0.1V Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet 6. Rank IF = 10mA IV [mcd] VF [V] Wd [nm] RANK RED GREEN BLUE RED GREEN BLUE RED GREEN A BLUE 460~465 2.7~2.9 B 465~472 C 460~465 2.7~2.9 2.9~3.1 D 465~472 E 460~465 3.1~3.3 F 465~472 G 460~465 2.7~2.9 H 465~472 I 460~465 50~100 150~290 30~85 1.7~2.3 2.9~3.1 2.9~3.1 J 615~635 515~535 465~472 K 460~465 3.1~3.3 L 465~472 M 460~465 2.7~2.9 N 465~472 O 460~465 3.1~3.3 2.9~3.1 P 465~472 Q 460~465 3.1~3.3 R 465~472 Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Tolerance ± 0.1, Unit : ㎜ ± 0.05 Blue Green [ Inner Circuit Diagram] Red Technical Data Sheet 7. Outline Dimension Anode Common [ Recommended Solder Pattern] 8. Material chip Item Material Package BT-Resin Red G/B Zener AlInGaP InGaN Si wire Encapsulate Electrode Gold Epoxy Au Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) ㎜ ± 0.05 ± 0.05 (2.75) 3.5 0.2 ± 0.2 ± 0.05 Unit: 8.0 2.0 1.5 - 0 1.75 +0.1 ± 0.1 ± 0.05 4.0 ±0.2, ± 0.1 Tolerance: 1.75 4.0 ± 0.05 ± 0.1 0.5 180 1.73 ± 0.05 0.7 ± 0.05 11.4 +0 -3 9 ± 0.2 +0.2 -0 2 ± 0.3 60 Technical Data Sheet 9. Reel Structure 22 13 ± 0.2 Label (1) Quantity : 4000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package ℃ Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet 10. Packing Reel RANK: XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR #### Aluminum Vinyl Bag ### DESI PAK ### ### ####### RANK: XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure 1 SIDE RANK: QUANTITY : XXXX c LOT NUMBER : XXXXXXXXXX PART NUMBER : 1 XXXXXX 2 SEOUL SEMICONDUCTOR CO., LTD. 2 SIDE RoHS b a LOT NUMBER Rank QTY Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 SEOUL SEMICONDUCTOR CO., LTD. Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet 11. Soldering profile (1) Lead Solder Lead Solder Lead Solder ℃ Pre-heat 120~150 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 240 Soldering time Condition 10 sec. Max. 2.5~5 o C / sec. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead Free Solder Lead-frame Solder ℃ Pre-heat 150~200 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 260 Soldering time Condition 10 sec. Max. 1~5 o C / sec. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Technical Data Sheet 12. Precaution for Use (1) Storage LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is recommended. To avoid absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. * Shelf Life : 12 months at < 40ºC and 90%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. After opened and mounted the soldering shall be quickly. * Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or Stored at < 10% RH (3) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (4) In the case of change color of indicator on desiccant, components shall be dried 10-12hr at 60± 5ºC. (5) When the LED is operating, the driving current should be determined after considering the maximum ambient temperature requirements. (6) When using multiple LEDs, It is recommended to connect a resistor on each LED. Otherwise, LEDs may vary due to variation in forward voltage of the LEDs. (7) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage (8) Any mechanical force or excessive vibration should be avoided during temperature cooling process to normal temperature after reflow. (9) Rapid cooling shall be avoided. (10) LED should not be placed on a flexible area on the PCB. (11) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (12) Anti radioactive ray design is not considered for the products. (13) Damage prevention from ESD or Surge. It is highly recommended to use the wrist-band or anti electrostatic gloves when handling the LED’s All devices, equipments and machines mush be properly grounded (14) The appearance and specifications of the product may be modified for improvement without notice. Rev. 02 January 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)