AVR32801: UC3A3 Schematic Checklist

AVR32801: UC3A3 Schematic Checklist
Features
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Power circuit
Reset circuit
USB connection
External bus interface
ABDAC sound DAC interface
JTAG and Nexus debug ports
Clocks and crystal oscillators
MMC, SD-card, SDHC, SDIO and CE-ATA interface
32-bit
Microcontrollers
Application Note
1 Introduction
A good hardware design comes from a proper schematic. Since UC3A3 devices
have a fair number of pins and functions, the schematic for these devices can be
large and quite complex.
This application note describes a common checklist which should be used when
starting and reviewing the schematics for a UC3A3 design.
Rev. 32130B-AVR32-04/10
2 Power circuit
2.1 Single 3.3 volt power supply
Figure 2-1. Single 3.3 volt power example schematic
Common for
pin groups
Close to pin
VDDIO
DC/DC converter
100nF
GNDIO
4.7µF
3.33.3
volt
volt
VDDIN
100nF
GNDCORE
Internal
Voltage
Regulator
VDDCORE
2.2µF
470pF
Table 2-1. Single 3.3 volt power supply checklist
Signal name
Recommended pin connection
Description
VDDIO
3.0 V to 3.6 V
Decoupling/filtering capacitors
100 nF(1)(2) and 4.7 µF(1)
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
GNDIO
Connect to digital ground
VDDIO ground pin.
VDDIN
2.7 V to 3.6 V
Decoupling/filtering capacitors
100 nF(1)(2) and 4.7 µF(1)
Powers I/O lines.
Powers internal voltage regulator.
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
Output of the internal 1.8 V voltage regulator.
2
VDDCORE
Decoupling/filtering capacitors
470 pF(1)(2) and 2.2 µF(1)
Decoupling/filtering capacitors must be added to guarantee 1.8 V
stability.
GNDCORE
Connect to digital ground
VDDCORE and VDDIN ground pin.
Note 1:
These values are given only as a typical example.
Note 2:
Capacitor should be placed as close as possible to each pin in the signal group, vias should be avoided.
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2.2 ADC reference power supply
The following schematic checklist is mandatory even if the internal analog to digital
converter is not in use.
Figure 2-2. ADC power supply example schematic
DC/DC converter
Close to pin
VDDANA
ADVREF
100nF
3.33.3
volt
volt
GNDANA
Table 2-2. ADC reference power supply checklist
Signal name
Recommended pin connection
Description
Powers the on-chip ADC, must always be powered since the analog
multiplexer is powered by another domain.
VDDANA
3.0 V to 3.6 V
Decoupling/filtering capacitor
100 nF(1)(2)
Decoupling/filtering capacitor must be added to improve startup stability
and reduce source voltage drop.
ADVREF (ADC reference voltage) is internally connected to VDDANA
GNDANA
Connect to analog ground
VDDANA ground pin.
Note 1:
These values are given only as a typical example.
Note 2:
Capacitor should be placed as close as possible to each pin in the signal group, vias should be avoided.
3 Reset circuit
Figure 3-1. Reset circuit example schematic
Table 3-1. Reset circuit checklist
Signal name
Recommended pin connection
Description
RESET
Can be left unconnected in case no
reset from the system needs to be
The RESET_N pin is a Schmitt input and integrates a permanent pullup resistor to VDDIO.
applied to the product
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4 Clocks and crystal oscillators
4.1 External clock source
Figure 4-1. External clock source schematic
Table 4-1. External clock source checklist
Signal name
Recommended pin connection
Description
XIN
Connected to clock output from
external clock source
Up to VDDIO volt square wave signal up to 50 MHz.
XOUT
Can be left unconnected or used as
GPIO
4.2 Crystal oscillator
Figure 4-2. Crystal oscillator example schematic
Table 4-2. Crystal oscillator checklist
Signal name
Recommended pin connection
Description
XIN
Biasing capacitor 22 pF(1)(2)
External crystal between 3 MHz and 16 MHz for XIN0/XOUT0 and
XIN1/XOUT2, 32 kHz for XIN32/XOUT32.
XOUT
Biasing capacitor 22 pF(1)(2)
Note 1:
These values are given only as a typical example. The capacitance C of the biasing capacitors can be computed based
on the crystal load capacitance CL and the internal capacitance Ci of the MCU as follows:
C = 2 (CL – Ci)
The value of CL can be found in the crystal datasheet and the value of Ci can be found in the MCU datasheet.
Note 2:
4
Capacitor should be placed as close as possible to each pin in the signal group, vias should be avoided.
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5 USB connection
USB high-speed PCB layout design is covered in application note AVR32787, more
information in chapter 10.3 on page 21.
5.1 Not used
When the USB interface is not used, FSPDM, HSDM, FSDP and HSDP should be
connected to ground.
5.2 Device mode, powered from bus connection
Figure 5-1. USB in device mode, bus powered connection example schematic
VDD
3.3 volt
regulator
USB_VBOF
VBUS
VBUS
FSDM
39 ohm
D-
HSDM
D+
FSDP
39 ohm
HSDP
ID
GND
USB_ID
USB_VBIAS
10pF
6810 ohm
XIN
12 MHz
Table 5-1. USB bus powered connection checklist
Signal name
Recommended pin connection
Description
USB_VBOF
Can be left unconnected or used as GPIO
USB power control pin.
VBUS
Directly to connector
USB power measurement pin.
FSDM
39 ohm series resistor
Placed as close as possible to pin
Negative differential full-speed data line.
FSDP
39 ohm series resistor
Placed as close as possible to pin
Positive differential full-speed data line.
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Signal name
Recommended pin connection
Description
HSDM
Directly to connector
Negative differential high-speed data line.
HSDP
Directly to connector
Positive differential high-speed data line.
USB_ID
Can be left unconnected
Mini connector USB identification pin.
USB_VBIAS
6810 ohm ±1% resistor in parallel to a
10pF capacitor to ground
USB bias voltage reference.
External 12 MHz clock or crystal
The UTMI transceiver requires an external 12 MHz clock as a
reference to its internal 480Mhz PLL. This clock is provided by
GCLK4 and the generic clock needs a 12 MHz source.
XIN
5.3 Device mode, self powered connection
Figure 5-2. USB in device mode, self powered connection example schematic
USB_VBOF
VBUS
VBUS
FSDM
39 ohm
D-
HSDM
D+
FSDP
39 ohm
HSDP
ID
GND
USB_ID
USB_VBIAS
10pF
6810 ohm
XIN
12 MHz
Table 5-2. USB self powered connection checklist
6
Signal name
Recommended pin connection
Description
USB_VBOF
Can be left unconnected or used as GPIO
USB power control pin.
VBUS
Directly to connector
USB power measurement pin.
FSDM
39 ohm series resistor
Placed as close as possible to pin
Negative differential full-speed data line.
FSDP
39 ohm series resistor
Placed as close as possible to pin
Positive differential full-speed data line.
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Signal name
Recommended pin connection
Description
HSDM
Directly to connector
Negative differential high-speed data line.
HSDP
Directly to connector
Positive differential high-speed data line.
USB_ID
Can be left unconnected
Mini connector USB identification pin.
USB_VBIAS
6810 ohm ±1% resistor in parallel to a
10pF capacitor to ground
USB bias voltage reference.
External 12 MHz clock or crystal
The UTMI transceiver requires an external 12 MHz clock as a
reference to its internal 480Mhz PLL. This clock is provided by
GCLK4 and the generic clock needs a 12 MHz source.
XIN
5.4 Host/OTG mode, power from bus connection
Figure 5-3. USB host and OTG powering connection example schematic
Table 5-3. USB host and OTG powering connection checklist
Signal name
Recommended pin connection
Description
USB_VBOF
Can be left unconnected or used as GPIO
USB power control pin.
VBUS
Directly to connector
USB power measurement pin.
FSDM
39 ohm series resistor
Placed as close as possible to pin
Negative differential full-speed data line.
FSDP
39 ohm series resistor
Placed as close as possible to pin
Positive differential full-speed data line.
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Signal name
Recommended pin connection
Description
HSDM
Directly to connector
Negative differential high-speed data line.
HSDP
Directly to connector
Positive differential high-speed data line.
USB_ID
GPIO directly connected to connector,
mandatory in OTG mode
Mini connector USB identification pin. For OTG it will be tied to
ground in host mode, and left floating in device mode. Pull-up on
GPIO pin must be enabled.
USB_VBIAS
6810 ohm ±1% resistor in parallel to a
10pF capacitor to ground
USB bias voltage reference.
External 12 MHz clock or crystal
The UTMI transceiver requires an external 12 MHz clock as a
reference to its internal 480Mhz PLL. This clock is provided by
GCLK4 and the generic clock needs a 12 MHz source.
XIN
6 External bus interface
6.1 Static memory
6.1.1 16-bit static memory
Table 6-1. 16-bit static memory pin wiring
GPIO line name
16-bit static memory
D[0:15]
D[0:15]
A[1:23]
A[0:22]
A[0] (NBS0)
LBE
NWE1 (NBS1)
HBE
NWE0
WE
NRD
OE
NWAIT
WAIT
NCSx
CS
6.1.2 8-bit static memory
Table 6-2. 8-bit static memory pin wiring
GPIO line name
8-bit static memory
D[0:7]
D[0:7]
A[0:23]
A[0:23]
NWE0
WE
NRD
OE
NWAIT
WAIT
NCSx
CS
6.1.3 2 x 8-bit static memory
Table 6-3. 2 x 8-bit static memory pin wiring
8
GPIO line name
8-bit static memory
D[0:7]
D[0:7]
8-bit static memory
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GPIO line name
8-bit static memory
D[8:15]
8-bit static memory
D[0:7]
A[1:23]
A[0:22]
NWE0 (NBS0)
WE
NWE1 (NBS1)
A[0:22]
WE
NRD
OE
OE
NWAIT
WAIT
WAIT
NCSx
CS
CS
6.2 SDRAM
6.2.1 16-bit SDRAM
Table 6-4. 16-bit SDRAM pin wiring
GPIO line name
16-bit SDRAM
D[0:15]
DQ[0:15]
A[2:11]
A[0:9]
SDA10
A[10]
A[13:14]
A[11:12]
A[16] (BA0)
BA0
A[17] (BA1)
BA1
SDCK
CLK
SDCKE
CKE
SDWE
WE
RAS
RAS
CAS
CAS
A[0] (NBS0)
DQML
NWE1 (NBS1)
DQMH
NCS[1] (SDCS)
CS
6.2.2 2 x 8-bit SDRAM
Table 6-5. 2 x 8-bit SDRAM pin wiring
GPIO line name
8-bit SDRAM
D[0:7]
DQ[0:7]
D[7:15]
8-bit SDRAM
DQ[0:7]
A[2:11]
A[0:9]
A[0:9]
SDA10
A[10]
A[10]
A[13:14]
A[11:12]
A[11:12]
A[16] (BA0)
BA0
BA0
A[17] (BA1)
BA1
BA1
SDCK
CLK
CLK
SDCKE
CKE
CKE
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GPIO line name
8-bit SDRAM
8-bit SDRAM
SDWE
WE
WE
RAS
RAS
RAS
CAS
CAS
CAS
A[0] (NBS0)
DQM
NWE1 (NBS1)
NCS[1] (SDCS)
DQM
CS
CS
6.2.3 4 x 4-bit SDRAM
Table 6-6. 4 x 4-bit SDRAM pin wiring
GPIO line name
4-bit SDRAM
D[0:3]
DQ[0:3]
D[4:7]
4-bit SDRAM
4-bit SDRAM
DQ[0:3]
D[8:11]
DQ[0:3]
D[12:15]
DQ[0:3]
A[2:11]
A[0:9]
A[0:9]
A[0:9]
A[0:9]
SDA10
A[10]
A[10]
A[10]
A[10]
A[13:14]
A[11:12]
A[11:12]
A[11:12]
A[11:12]
A[16] (BA0)
BA0
BA0
BA0
BA0
A[17] (BA1)
BA1
BA1
BA1
BA1
SDCK
CLK
CLK
CLK
CLK
SDCKE
CKE
CKE
CKE
CKE
SDWE
WE
WE
WE
WE
RAS
RAS
RAS
RAS
RAS
CAS
CAS
CAS
CAS
CAS
A[0] (NBS0)
DQM
DQM
DQM
DQM
CS
CS
NWE1 (NBS1)
NCS[1] (SDCS)
10
4-bit SDRAM
CS
CS
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6.3 CompactFlash
Table 6-7. 8-bit and 16-bit CompactFlash pin wiring
GPIO line name
16-bit CompactFlash
D[0:7]
D[0:7]
D[8:15]
(1)
D[8:15]
A[0:10]
A[0:10]
A[22]
REG
NSC[4]
(2)
CFCS[0]
NSC[5]
(2)
CFCS[1]
NRD
OE
NWE0
WE
NWE1
IOR
NWE0 OR A[23]
CFRNW
(3)
IOW
(2)
CFRNW
CFCE1
CE1
CFCE2
CE2
NWAIT
WAIT
GPIO[n]
Notes:
(4)
CD1 or CD2
1. Only needed for 16-bit CompactFlash.
2. Not directly connected to the CompactFlash slot. Permits control of a bidirectional buffer
between the EBI and the CompactFlash slot.
3. NWE0 and A[23] must be combined externally using an OR logic gate to produce the IOW
signal for the CompactFlash slot.
4. Any GPIO line.
6.4 NAND flash
6.4.1 8-bit and 16-bit NAND flash
Table 6-8. 8-bit and 16-bit NAND flash pin wiring
GPIO line name
8-bit or 16-bit NAND flash
D[0:7]
I/O[0:7] (data bus)
D[8:15]
(1)
I/O[8:15] (data bus)
A[21]
CLE (command latch enable)
A[22]
ALE (address latch enable)
NANDOE
RE (read enable)
NANDWE
WE (write enable)
GPIO[n]
(2)
CE (chip enable)
GPIO[n]
(2)
R/B (ready/busy)
Notes:
1. Only needed for 16-bit NAND.
2. Any GPIO line.
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7 ABDAC stereo sound DAC interface
The output from the ABDAC is not intended for driving headphones or speakers. The
pads are limiting the maximum amount of current. In the majority of all practical
cases, this will not be enough to drive a low impedance source.
Because of this limitation, an external amplifier should be connected to the output
lines to amplify these signals. This amplifier device could also be used to control the
volume.
For testing purposes a line in or microphone input on a sound system can be used to
evaluate the output signal.
7.1 Line out with passive filter
Figure 7-1. Line out with passive filter example schematic
1uF
Lowpass filter
DATA[0]
220pF 20k ohm
L
DATAN[0]
R
DATA[1]
1uF
220pF 20k ohm
DATAN[1]
Table 7-1. Line out with passive filter checklist
12
Signal name
Recommended pin connection
DATA[0]
Connected to low pass filter and 1
µF capacitor to remove DC bias
DATAN[0]
Not in use
DATA[1]
Connected to low pass filter and 1
µF capacitor to remove DC bias
DATAN[1]
Not in use
Description
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7.2 High power output with external amplifier
Figure 7-2. High power output with external amplifier example schematic
100 ohm
20k ohm
330uF
8
IN1-
TPA152
Vo1
1 20k ohm
1uF
20k ohm
7
L
10uF
R
5V
100nF
6
5
GND
MUTE
VDD
BYPASS
Vo2
IN2-
2
3
DATAN[0]
DATA[1]
4
20k ohm1uF
20k ohm
DATA[0]
220pF 20k ohm
1uF
330uF
100 ohm
Lowpass filter
220pF 20k ohm
DATAN[1]
20k ohm
Optional resistors
Table 7-2. High power output with external amplifier checklist
Signal name
Recommended pin connection
DATA[0]
Connected to low pass filter and
external amplifier
DATAN[0]
Not in use
DATA[1]
Connected to low pass filter and
external amplifier
DATAN[1]
Not in use
Description
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8 JTAG and Nexus debug ports
8.1 JTAG port interface
Figure 8-1. JTAG port interface example schematic
Table 8-1. JTAG port interface checklist
Signal name
14
Recommended pin connection
Description
TMS
Test mode select, sampled on rising TCK.
TDO
Test data output, driven on falling TCK.
TCK
Test clock, fully asynchronous to system clock frequency.
RESET
Device external reset line.
TDI
Test data input, sampled on rising TCK.
EVTO
Event output, not used.
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8.2 Nexus port interface
Figure 8-2. Nexus port interface example schematic
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Table 8-2. Nexus port interface checklist
Signal name
16
Recommended pin connection
Description
TDI
Test data input, sampled on rising TCK.
TMS
Test mode select, sampled on rising TCK.
TCK
Test clock, fully asynchronous to system clock frequency.
TDO
Test data output, driven on falling TCK.
RESET
Device external reset line.
EVTI
Event input.
MDO[0:5]
Trace data output.
EVTO
Event output.
MCK0
Trace data output clock.
MSE[0:1]
Trace frame control.
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9 MMC, SD, SDHC, SDIO and CE-ATA interface
The MMC, SD, SDHC, SDIO and CE-ATA interface is provided by the MultiMedia
Card Interface (MCI). Designers are free to mix MMC, SD, SDHC, SDIO and CE-ATA
on the bus, but each slot on the MCI can only interface one type of memory.
Examples:
Slot A is used for MMC bus while slot B is used for SD/SDHC/SDIO.
Slot A is used for SD/SDHC/SDIO while slot B is used for SD/SDHC/SDIO.
Slot A is used for SD/SDHC/SDIO while slot B is used for CE-ATA.
Slot A is used for CE-ATA while slot B is used for MMC bus.
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9.1 MMC bus connection
Figure 9-1. MMC bus connection example schematic
Error! No topic specified.
Table 9-1. MMC bus connection checklist
18
Signal name
Recommended pin connection
Description
CMD0
Connect to MMC CMD signal
Pull-up resistor required, 68 kohm(1)
Command and response signal for the MMC bus on MCI slot A.
CMD1
Connect to MMC CMD signal
Pull-up resistor required, 68 kohm(1)
Command and response signal for the MMC bus on MCI slot B.
CLK
Connect to MMC CLK signal
Shared clock signal for both MCI slot A and slot B.
DATA[0:7]
MMC bus data lines for slot A. Only DATA0 is needed in 1-bit mode,
Connect to MMC data lines
DATA[0:3] is needed for 4-bit mode and DATA[0:7] is needed for 8-bit
Pull-up resistors required, 68 kohm(1) mode.
DATA[8:15]
MMC bus data lines for slot B. Only DATA8 is needed in 1-bit mode,
Connect to MMC data lines
DATA[8:11] is needed for 4-bit mode and DATA[8:15] is needed for 8Pull-up resistors required, 68 kohm(1) bit mode.
Card detect
Optional, connect to any GPIO line
Pull-up resistor required, 68 kohm(1)
Note 1:
These values are given as a typical example and must be placed as close as possible to the MMC card slot.
Card detection signal from the card slot, can be used by the firmware
to detect card insertion and removal.
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9.2 SD, SDHC and SDIO bus connection
Figure 9-2. SD, SDHC and SDIO bus connection example schematic
VDD
VDD
100n
68k
68k
100n
68k
VDD
CMD
SD/SDHC/SDIO
CLK
card slot
VDD
CMD
SD/SDHC/SDIO
CLK
card slot
DAT3/RSV/CS
DAT3/RSV/CS
DAT[0:2]
DAT[0:2]
Card detect
Card detect
Write protect
Write protect
VSS
VSS
VSS
VSS
VDD
CMD[0]
CLK
68k
DATA[0:3]
VDD
68k
GPIO[n:m]
CMD[1]
DATA[8:11]
VDD
68k
GPIO[n:m]
Table 9-2. SD, SDHC and SDIO bus connection checklist
Signal name
Recommended pin connection
Description
CMD0
Connect to SD/SDHC/SDIO CMD signal Command and response signal for the SD/SDHC/SDIO bus on MCI
Pull-up resistor required, 68 kohm(1)
slot A.
CMD1
Connect to SD/SDHC/SDIO CMD signal Command and response signal for the SD/SDHC/SDIO bus on MCI
Pull-up resistor required, 68 kohm(1)
slot B.
CLK
Connect to SD/SDHC/SDIO CLK signal
Shared clock signal for both MCI slot A and slot B.
DATA[0:4]
Connect to SD/SDHC/SDIO data lines
Pull-up resistors required, 68 kohm(1)
SD/SDHC/SDIO bus data lines for MCI slot A. Only DATA0 is
needed in 1-bit mode and DATA[0:3] is needed for 4-bit mode.
DATA[8:11]
Connect to SD/SDHC/SDIO data lines
Pull-up resistors required, 68 kohm(1)
SD/SDHC/SDIO bus data lines for MCI slot B. Only DATA8 is
needed in 1-bit mode and DATA[8:11] is needed for 4-bit mode
Card detect
Optional, connect to any GPIO line
Pull-up resistor required, 68 kohm(1)
Card detection signal from the card slot, can be used by the
firmware to detect card insertion and removal.
Write protect
Optional, connect to any GPIO line
Pull-up resistor required, 68 kohm(1)
Write protect signal from the card slot, can be used by the firmware
to identify if the card has the write protect switch set.
Note 1:
These values are given as a typical example and must be placed as close as possible to the SD/SDHC/SDIO card slot.
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9.3 CE-ATA bus connection
9.3.1 4-bit CE-ATA bus connection
Table 9-3. 4-bit CE-ATA connector pin wiring
I/O line name
Connector pin
Ground
(1)
DAT2
(1)
DAT3
(1)
CMD0
1
VSS
(1)
2
DAT2
(1)
3
DAT3
4
Supply voltage
5
CMD
6
Interface voltage
7
CLK
/ DAT10
/ DAT11
VCC 3.3 V
(2)
(1)
/ CMD1
VCC 3.3 V
4-bit CE-ATA
(2)
CLK
Ground
8
VSS
(1)
9
DAT0
(1)
10
DAT1
Ground
11
VSS
Not connected
12
Reserved
(1)
DAT0
(1)
DAT1
Notes:
/ DAT8
/ DAT9
1. Data lines and CMD line must mach for selected MCI slot. I.e. CMD0 must be
used along with DAT[0:4] and CMD1 must be used along with DAT[8:11].
2. 100 nF decoupling capacitor should be placed as close as possible to connector.
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9.3.2 8-bit CE-ATA bus connection
Table 9-4. 8-bit CE-ATA connector pin wiring
I/O line name
Connector pin
Ground
(1)
DAT2
(1)
DAT3
1
VSS
(1)
2
DAT2
(1)
3
DAT3
/ DAT10
/ DAT11
Ground
(1)
DAT4
(1)
DAT5
(1)
CMD0
4
VSS
(1)
5
DAT4
(1)
6
DAT5
7
Supply voltage
8
CMD
9
Interface voltage
10
CLK
/ DAT12
/ DAT13
VCC 3.3 V
(2)
(1)
/ CMD1
VCC 3.3 V
(2)
CLK
Ground
(1)
DAT6
(1)
DAT7
8-bit CE-ATA
11
VSS
(1)
12
DAT6
(1)
13
DAT7
/ DAT14
/ DAT15
Ground
14
VSS
(1)
15
DAT0
(1)
16
DAT1
Ground
17
VSS
Not connected
18
Reserved
(1)
DAT0
(1)
DAT1
Notes:
/ DAT8
/ DAT9
1. Data lines and CMD line must mach for selected MCI slot. I.e. CMD0 must be
used along with DAT[0:7] and CMD1 must be used along with DAT[8:15].
2. 100 nF decoupling capacitor should be placed as close as possible to connector.
10 Suggested reading
10.1 Device datasheet
The device datasheet contains block diagrams of the peripherals and details about
implementing firmware for the device. The datasheet is available on
http://www.atmel.com/AVR32 in the Datasheets section.
10.2 Evaluation kit schematic
The evaluation kit EVK1104 contains the full schematic for the board; it can be used
as a reference design. The schematic is available on http://www.atmel.com/AVR32 in
the Tools & Software section.
10.3 High-speed USB PCB layout
The application note AVR32787 AVR32 UC3A3 High Speed USB Design Guidelines
covers the basic topics of high-speed USB layout design using AVR UC3A3.
21
32130B-AVR32-04/10
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32130B-AVR32-04/10