ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM

ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Features
‧Ceramic package.
‧Top view LED
o
‧Wide viewing angle 130
‧High luminous intensity output
‧Qualification according to AEC-Q101 rev C.
‧Automotive reflow profile (IR reflow or wave soldering)
‧Pb-free
‧RoHS compliant
‧ESD protection
‧Compliance with EU REACH.
Description
The Everlight ELCH08 series package has high efficacy, high power consumption, wide viewing angle
and a compact form factor. These features make this package an ideal LED for all automobile lighting
applications.
Applications
‧Turning indicator light
‧Tail light
Revision
: 1©
1 Copyright
LifecyclePhase:
Release Date:2015-04-22
15:48:40.0
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2015, Everlight All Rights Reserved. Release Date: Apr.02.2015 Issue No: DHE-0002762 Rev.:1
Expired Period: Forever
DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Table of Contents
Product Nomenclature.......................................................................................................................................... 3
ELCH08 Soldering Temperature Location on Sample Board ........................................................................... 4
Absolute Maximum Ratings ................................................................................................................................. 5
PN of the ELCH08 series ...................................................................................................................................... 6
Product Binning .................................................................................................................................................... 7
Mechanical Dimension ....................................................................................................................................... 10
Wavelength Characteristics ............................................................................................................................... 11
Typical Radiation Patterns ................................................................................................................................. 14
Moisture Resistant Packing Materials .............................................................................................................. 15
Storage Conditions ............................................................................................................................................. 17
Revision History .................................................................................................................................................. 19
Revision
:1
Release Date:2015-04-22
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2 Copyright © 2015, Everlight All Rights Reserved. Release Date: Apr.02.2015 Issue No: DHE-0002762
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Product Nomenclature
The product name is designated as below:
ELCH08NG – CDEFGHIJ – KLMN – AM
Designation:
ELCH08 = family name.
NG = internal code
C = color[1]
DE = color bin or CCT bin
FG = min./max. luminous flux (lm) or radiation power (mW) performance
HI = min./max. forward voltage
J = operation current[2]
KLMN = internal code
AM = application
1.Table of color:
Symbol
Description
NP
White, CRI<80
KP
White, CRI>80
NA
PC-Amber
UB
Blue
UR
Red
2.Table of operation current:
Symbol
Description
Z70
700mA
Revision
:1
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
ELCH08 Soldering Temperature Location on Sample Board
TJ = Temperature of Junction
TS = Temperature of Solder Pad
TB = Temperature of MCPCB
TP = Temperature of Thermal Pad
RthJ-S = Thermal Resistance from Junction to Solder Pad
Revision
:1
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Reverse Voltage
VR
Not designed for reverse operation
V
Max. DC Forward Current (mA)
IF
700
mA
Max. Peak Pulse Current (mA)
IPulse
1000[1]
mA
Junction Temperature
Thermal Resistance
(Junction to Soldering)
TJ
125
°C
Rth
12
°C/W
Operating Temperature
Topr
-40 ~ +115
℃
Storage Temperature
Tstg
-40 ~ +120
℃
ESD Sensitivity
ESDHBM
8000
V
Max. Soldering Temperature
TSol
260
°C
Max. Allowable Reflow Cycles
N/A
3
cycles
Notes:
1.
Duty cycle = [email protected] .
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
PN of the ELCH08 series
Order Code
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Typical
Minimum
Typical
Viewing
Forward Current
Luminous Luminous Color Bin
Angle
Voltage (V) (mA)
Flux (lm)
Flux (lm)
(degrees)
2θ1/2
100
125
Y1
2.95-4.15
700
130
Notes:
1.
2.
3.
4.
Luminous flux measurement tolerance: ±10%.
The data of luminous flux measured at thermal pad=25℃
Typical luminous flux or light output performance is operated within the condition guided by this datasheet.
View angle tolerance is ± 5∘
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Product Binning
Luminous Flux Bins
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
E
1
2
3
4
5
6
7
8
9
4
5
6
8
10
13
17
20
23
5
6
8
10
13
17
20
23
27
J
1
2
3
4
5
6
7
8
9
100
110
120
130
140
150
160
180
200
110
120
130
140
150
160
180
200
225
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
F
1
2
3
4
5
6
7
8
9
27
33
39
45
52
60
70
80
90
33
39
45
52
60
70
80
90
100
K
1
2
3
4
5
6
7
8
9
225
250
275
300
325
350
375
400
425
250
275
300
325
350
375
400
425
450
Notes:
1.
Luminous flux measurement tolerance: ±10%.
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Amber Bin Structure
0.440
CIE_y
0.429
0.418
Y1
0.407
0.396
0.385
0.374
0.546
0.559
0.572
0.585
0.598
0.611
CIE_x
Amber Bin Coordinates
Bin
Y1
CIE X
0.5600
0.5450
0.5970
0.6090
CIE Y
0.4400
0.4250
0.3900
0.3900
Notes:
1.
Color coordinates measurement allowance: ±0.01.
Revision
:1
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Forward Voltage Bins
Bin
2932
3235
3538
3841
Minimum Forward
Voltage (V)
2.95
3.25
3.55
3.85
Maximum Forward
Voltage (V)
3.25
3.55
3.85
4.15
Notes:
1.
Forward voltage measurement tolerance: ±0.1V.
2.
Forward voltage bins are defined at IF=700mA operation.
Revision
:1
Release Date:2015-04-22
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Mechanical Dimension
Notes:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.1mm.
3. The thermal pad is electrically unity from the Anode and contact pads.
4. Do not handle the device by the lens. Incorrect force applied to the lens may lead to the failure of
devices.
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:1
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Wavelength Characteristics
Relative Spectral Distribution
@ Solder Pad Temperature = 25℃
Relative luminous intensity
1.0
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength (nm)
Forward Current Derating Curve
@Solder Pad Temperature
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Color: PC-Amber
Typical Relative Luminous
vs. Forward Current
@ Ts= 25℃,50ms
Forward Voltage vs. Forward Current
@ Ts = 25℃, 50ms
2.0
Relative Luminous Flux
Forward Voltage (V)
4.4
4.0
3.6
3.2
2.8
2.4
1.6
1.2
0.8
0.4
0.0
2.0
0
200
400
600
800
1000
0
200
400
600
800
1000
Forward Current(mA)
Forward Current (mA)
Chromaticity Coordinates Shift
vs. Forward Current
@ Ts= 25℃, 50ms
Chromaticity Coordinates
0.60
CIE-x
CIE-y
0.56
0.52
0.48
0.44
0.40
0
200
400
600
800
1000
Forward Current (mA)
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Relative Forward Voltage
@ Junction Temperature
Relative Luminous Flux
@ Junction Temperature
1.4
Relative Luminous Flux
Relative Forward Voltage
0.05
0.00
-0.05
-0.10
-0.15
-0.20
1.2
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
140
o
0
20
40
60
80
100
120
140
o
Junction Temperature ( C)
Junction Temperature ( C)
Chromaticity Coordinates Shift
@ Junction Temperature
Chromaticity Coordinates
0.60
CIE-x
CIE-y
0.56
0.52
0.48
0.44
0.40
0
20
40
60
80
100
120
140
o
Junction Temperature ( C)
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Typical Radiation Patterns
Typical Diagram Characteristics of Radiation for Amber
0
10
1.0
20
30
40
0.8
50
0.6
60
0.4
70
0.2
80
90
A
0
30
60
0.0
90
Notes:
1.
2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2.
Viewing angle tolerance is ± 5∘.
Revision
:1
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Moisture Resistant Packing Materials
Product Labeling
‧CPN:Customer’s Product Number
‧P/N: Everlight Product Number
‧QTY:Packing Quantity
‧CAT:Luminous Flux (Brightness) Bin
‧HUE:Color Bin
‧REF:Forward Voltage Bin
‧LO T No:Lot Number
Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel
Progress Direction
Polarity
Notes:
1.
Dimensions are in millimeters.
2.
Tolerances for fixed dimensions are ±0.1mm.
Revision
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Emitter Reel Dimensions
Notes:
1.
Dimensions are in millimeters.
2.
Tolerances unless mentioned are ±0.1mm.
Moisture Resistant Packing Process
Notes:
1.
Dimensions are in millimeters.
2.
Tolerances unless mentioned are ±0.1mm.
Revision
:1
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Storage Conditions
Precautions for Use
1. Soldering Condition (Reference: IPC/JEDEC J-STD-020D)
300
T emperature(℃ )
max. 260℃
245℃
255℃
240℃
217℃
250
200
max. 30s
150
max. 100s
max. 120s
100
max. Ramp Up 3 ℃ /s
50
max. Ramp Down 6 ℃ /s
0
0
50
100
150
200
250
300
Times(s)

Before the package is opened. The LEDs should be stored at 30°C or less and 85%RH or less after
being shipped from Everlight and the storage life limits are 1 year. The LEDs can be stored up to 3
years If in a sealed container with a nitrogen atmosphere and moisture absorbent material.

After opening the package: The LED's floor life is 1 year under 30℃ or less and 60%RH or less.
The LED should be soldered with 168hrs (7days) after opening the package. If unused LEDs
remain, it should be stored in moisture proof packages.

If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions. Baking
treatment: 60±5℃ for 24 hours.
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DATASHEET
ELCH08NG-NAY1Y1J1J72941Z70-H41
H41M-AM
Handling
Do not put mechanical stress on the LED.
Never touch the optical surface with finger or sharp object. The LED surface could be soiled or damaged,
which could affect the optical performance of the LED.
In low-humidity
humidity work environment, please keep handling the LEDs with appropriate ESD grounding.
It is recommended to handle the LED with powder-less
powder
latex gloves.
Manual Handling
When handling
ndling the product, do not apply direct pressure on the optical surface.
Do not touch the resin with tweezers to avoid scratching or other damage.
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ghts Reserved. Release Date: Apr.02.2015 Issue No: DHE-0002762
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ELCH08NG-NAY1Y1J1J72941Z70-H41M-AM
Revision History
Page
Subjects (major change in previous version)
Date of change
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:1
Release Date:2015-04-22
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