EHP-C04/NT01A-P01/TR Received Revised record

EHP-C04/NT01A-P01/TR
Received
■MASS PRODUCTION
□ PRELIMINARY
□ CUSTOMER DESIGN
DEVICE NO. : DHE-0000878
PAGE : 12
Revised record
REV.
DESCRIPTION
RELEASE DATE
1
New spec
2010.08.25
2
3
4.
5
1 Copyright
Revision
:5©
LifecyclePhase:
1.Change Format
2.Add VF V1 BIN
1.Change format
2.Change IV、CCT、VF BIN
3.Change Package Dimension
1.New Everlight Logo
2. Change format
1. Change notes color bin(3)
2. Add page 3 note.
2011.03.30
2011.09.06
2011.10.06
2012.12.26
Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-00000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
EHP-C04/NT01A-P01/TR
MASS
PRODUTION
Features
Small
& compact package and with high efficiency
Typical
luminous flux: 160 lm @ 1000mA
Typical
color temperature: 5700 [email protected]
Optical
[email protected] : 45 lm/W
ESD
protection up to 8KV
Moisture
Sensitivity Level (MSL) Class 1
Grouping
parameter: total luminous flux, color coordinates.
RoHS
compliant & Pb free.
Applications
Mobile
Torch
Phone Camera Flash(Camera flash light /strobe light for mobile devices )
light for DV(Digital Video) application
Indoor
lighting applications
Signal
and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.)
TFT
backlighting
Exterior
and interior illumination applications
Decorative
Exterior
and Entertainment Lighting
and interior automotive illumination
2 Copyright
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:5©
LifecyclePhase:
Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
Device Selection Guide
Chip
Emitted Color
Materials
InGaN
White
Absolute Maximum Ratings (Tsolder pad =25℃)
Parameter
Symbol
Rating
Unit
DC Forward Current (mA)
IF
350
mA
Ipulse
1500
mA
ESD Resistance
VB
8000
V
Reverse Voltage
VR
[1]
V
Junction Temperature
TJ
125
℃
Thermal Resistance(junction to lead)
Rs
10
℃/W
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +110
℃
Power Dissipation (Pulse Mode)
Pd
6.5
W
Soldering Temperature
Tsol
260
℃
Allowable Reflow Cycles
n/a
2
cycles
Viewing Angle(2)
2θ1/2
120
deg
Peak Pulse Current (mA)
(400ms : ON,3600ms : OFF)
Note:
1. The EHP-C04 series LEDs are not designed for reverse bias used.
2. View angle tolerance is ± 5∘.
3. Avoid operating EHP-C04 series LEDs at maximum operating temperature exceed 1 hour.
4. All specification is assured by reliability test for 1000hr, IV degradation less than 30%.
5. For 1500 mA all reliability items are tested under good thermal management with 1.0x 1.0 cm2 MCPCB.
For 1000 mA all reliability items are tested under good thermal management with 1.0x 1.0 cm2 FR4.
6. Peak pulse current shall be applied under conditions as max duration time 50ms and max duty cycle 10%.
7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters.
Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a
long period will result potential reliability issue.
3 Copyright
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:5©
LifecyclePhase:
Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
JEDEC Moisture Sensitivity
Soak Requirements
Standard
Floor Life
Level
1
Time
(hours)
Conditions
Time
(hours)
Conditions
unlimited
≦30℃ / 85% RH
168(+5/-0)
85℃/ 85 RH
Electro-Optical Characteristics (Tsolder pad =25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Flux(1)
Фv
VF
160
----
---4.35
lm
Forward Voltage(2) (3)
140
2.95
CCT
4500
----
7000
K
Bin Code
Min.
Typ.
Max.
Unit
2932
3235
3538
3841
4143
2.95
3.25
3.55
3.85
4.15
----------------
3.25
3.55
3.85
4.15
4.35
V
Bin Code
Min.
Typ.
Max.
Unit
J3
J4
J5
140
160
180
-----------
160
180
200
lm
Correlated Color Temperature
V
Condition
IF=1000mA
Note:
1. Luminous flux measurement tolerance: ±10%
2. Forward voltage measurement tolerance: ±0.1V
3. Electric and optical data is tested at 50 ms pulse condition
Bin Range of Forward Voltage Binning
Condition
IF=1000mA
Bin Range of Luminous Intensity
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:5©
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Condition
IF=1000mA
Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
White Bin Structure
0.45
4500
5000
(1)
0.40
5700
y
(2)
0.35
7000
(3)
0.30
0.25
0.25
0.30
0.35
0.40
0.45
x
Notes:
1. Color Bin (1) : 4550K
2. Color Bin (2) : 5057K
3. Color Bin (3) : 5770K
White Bin Coordinate
Bin
CIE-X
CIE-Y
CCT Reference Range
4550
0.3738
0.3524
0.3440
0.3620
0.4378
0.4061
0.3420
0.3720
4500K ~ 5000K
5057
0.3300
0.3300
0.3440
0.3524
0.3200
0.3730
0.3420
0.4061
5000K ~ 5700K
5770
0.3030
0.3300
0.3300
0.3110
0.3330
0.3730
0.3200
0.2920
5700K ~ 7000K
Note:
1. Color coordinates measurement allowance: ±0.01
2. Color bins are defined at IF = 1000mA and 50ms pulse operation condition.
5 Copyright
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:5©
LifecyclePhase:
Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
Typical Electro-Optical Characteristics Curves
Relative Spectral Distribution, [email protected], Tsolder pad =25℃
1 .0
Relative Intensity(a.u.)
0 .8
0 .6
0 .4
0 .2
0 .0
4 0 0
5 0 0
6 0 0
W
7 0 0
a v e le n g th ( n m
Typical Radiation Patterns
8 0 0
)
Typical Polar Radiation Pattern for Lambertian
X axis
Y axis
-15
0.8
Relative Intensity(a.u.)
Relativety Luminous intensity
1.0
1.0
0.6
0
-30
-45
0.8
0.6
-60
15
30
45
60
0.4
0.4
-75
0.0
0.0
-90
75
0.2
0.2
-60
-30
0
30
60
-90
90
90
2q (Degree)
Degree
Note:
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. View angle tolerance is ± 5∘.
.
6 Copyright
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:5©
LifecyclePhase:
Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
Forward Voltage vs Forward Current,
Tsolder pad =25℃
Correlated Color Temperature(CCT) vs. Forward Current
6200
Correlated Color Temperatrue(K)
4.2
Forward Voltage(V)
3.9
3.6
3.3
3.0
2.7
2.4
6000
5800
5600
5400
2.1
0
250
500
750
1000
1250
0
1500
250
500
750
1000
1250
1500
Forward Current([email protected])
Forward Current([email protected])
Luminous Flux vs Forward Current,
Tsolder pad =25℃
Forward Current Derating Curve,
Derating based on T j MAX=125°C at torch mode
500
1.4
Forward Current (mA)
Relative Luminous Flux(lm)
1.2
1.0
0.8
0.6
0.4
400
300
200
100
0.2
0.0
0
250
500
750
1000
1250
1500
0
0
25
50
75
o
Solder temperature ( C)
Forward Current([email protected])
Note:
1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm2 MCPCB
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Date:2013-01-04
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2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
100
DATASHEET
EHP-C04/NT01A-P01/TR
Package Dimension
0 .3 -0. 05 /+0
0.3
1,64
Optical center
2,04
0.75
Chip position
Top view
1,64
0,25
1,1
Optical center
1,45
0,5
Anode pad
Cathode pad
0,125
Note:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.1mm.
8 Copyright
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:5©
LifecyclePhase:
Date:2013-01-04
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2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer Specification (when required)
‧P/N: Everlight Production Number
‧QTY: Packing Quantity
‧CAT: Luminous Flux (Brightness) Bin
‧HUE: Color Bin
‧REF: Forward Voltage Bin
‧LOT No: Lot Number
Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel
Progress Direction
Polarity
Note:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.1mm.
9 Copyright
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:5©
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Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
Reel Dimensions
Note:
1. Dimensions are in millimeters.
Moisture Resistant Packing Process
10 Copyright
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:5©
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Date:2013-01-04
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2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
Reflow Soldering Characteristics
Soldering and Handling
1.
Over-current-proof
Though EHP-C04 series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors
for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen.
2.
Storage
i.
Do not open the moisture-proof bag before the products are ready to use.
ii.
Before opening the package, the LEDs should be stored at temperature less than 30℃ and less and relative humidity less than 90%.
After opening the package, the LEDs should be stored at temperature less than 30℃ and relative humidity less than 85%.
iii.
If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should
be implemented based on the following conditions: Pre-curing at 60±5℃ for 24 hours.
3.
Thermal Management
i.
For maintaining the high flux output and achieving reliability, EHP-C04 series LEDs should be mounted on a metal core printed circuit
board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation.
ii.
Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving
and LEDs lifetime will decrease critically
iii.
When operating , the solder pad temperature ( or the board temperature nearby the LED) must controlled under 70℃.
4. Soldering Condition
4.1 Soldering Pad
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Date:2013-01-04
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2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01A-P01/TR
4.2 For Reflow Process
i.
Lead reflow soldering temperature profile
i. Reflow soldering should not be done more than two times.
ii. While soldering, do not put stress on the LEDs during heating.
iii. After soldering, do not warp the circuit board.
12 Copyright
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:5©
LifecyclePhase:
Date:2013-01-04
13:33:43.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000878
www.everlight.com
Expired Period: Forever