SPECIFICATION FOR APPROVAL REF. : SQ3225□□□□2□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140610-D PAGE 1 Ⅰ﹒Configuration and dimensions： A 100 Marking B C Inductance code H G E D I E K I （PCB Pattern） Unit：m/m A B C D E G H I K 3.20 ±0.3 2.50 ±0.3 2.00 ±0.4 1.30 typ. 1.20 ref. 3.80 ref. 2.80 ref. 1.40 ref. 1.00 ref. Ⅱ﹒Description： a﹒Ferrite drum core construction. b﹒Enamelled copper wire：F、H class c﹒Product weight：0.046 g（ref.） Peak Temp：260℃ max. Max. Peak Temp - 5℃：30sec max. Max time above 217℃ ：60sec~150sec max. d﹒Moisture sensitivity Level 1 Temperature Rising Area e﹒Products comply with RoHS' requirements Preheat Area +4.0℃ / sec max. f﹒Halogen free available 150 ~ 200℃ / 60 ~ 120sec Reflow Area Peak Temperature: 260℃ 250 a﹒Storage temp.：-40℃ ----+125℃ b﹒Operating temp.：-40℃----+125℃ (Temp. rise included) 217℃ Temperature ( ℃ ) Ⅲ﹒General specification： Forced Cooling Area +3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. 60sec~150sec 200 60sec max. 150 60sec~120sec 100 50 c﹒Resistance to solder heat：260℃.10 secs. 0 AR-001C 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF. : SQ3225□□□□2□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140610-D PAGE 2 Ⅳ﹒Electrical characteristics： DWG No. SQ32251R0M2□ -□□□ SQ32251R2M2□ -□□□ SQ32251R5M2□ -□□□ SQ32251R8M2□ -□□□ SQ32252R2M2□ -□□□ SQ32252R7M2□ -□□□ SQ32253R3M2□ -□□□ SQ32253R9M2□ -□□□ SQ32254R7M2□ -□□□ SQ32255R6M2□ -□□□ SQ32256R8M2□ -□□□ SQ32258R2M2□ -□□□ SQ3225100K2□ -□□□ SQ3225120K2□ -□□□ SQ3225150K2□ -□□□ SQ3225180K2□ -□□□ SQ3225220K2□ -□□□ SQ3225270K2□ -□□□ SQ3225330K2□ -□□□ SQ3225390K2□ -□□□ SQ3225470K2□ -□□□ SQ3225560K2□ -□□□ SQ3225680K2□ -□□□ SQ3225820K2□ -□□□ SQ3225101K2□ -□□□ SQ3225121K2□ -□□□ SQ3225151K2□ -□□□ SQ3225181K2□ -□□□ SQ3225221K2□ -□□□ SQ3225271K2□ -□□□ SQ3225331K2□ -□□□ SQ3225391K2□ -□□□ SQ3225471K2□ -□□□ SQ3225561K2□ -□□□ 1). Inductance ( μH ) 1.00 ± 20% 1.20 ± 20% 1.50 ± 20% 1.80 ± 20% 2.20 ± 20% 2.70 ± 20% 3.30 ± 20% 3.90 ± 20% 4.70 ± 20% 5.60 ± 20% 6.80 ± 20% 8.20 ± 20% 10.00 ± 10% 12.00 ± 10% 15.00 ± 10% 18.00 ± 10% 22.00 ± 10% 27.00 ± 10% 33.00 ± 10% 39.00 ± 10% 47.00 ± 10% 56.00 ± 10% 68.00 ± 10% 82.00 ± 10% 100.00 ± 10% 120.00 ± 10% 150.00 ± 10% 180.00 ± 10% 220.00 ± 10% 270.00 ± 10% 330.00 ± 10% 390.00 ± 10% 470.00 ± 10% 560.00 ± 10% ：Packaging information： □□□ Test Freq. ( Hz ) L 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1K 1K Code 2). ""：Reference code 3). Electrical specifications at 25℃ 4). IDC base on Temp. rise 20℃ max. & △L/L0A=10% max. AR-001C SRF (MHz) min. 100.0 100.0 75.0 60.0 50.0 43.0 38.0 35.0 31.0 28.0 25.0 23.0 20.0 18.0 16.0 15.0 14.0 13.0 12.0 11.0 11.0 10.0 9.0 8.5 8.0 7.5 7.0 6.0 5.5 5.0 5.0 5.0 5.0 5.0 RDC (Ω) max. 0.50 0.60 0.60 0.70 0.80 0.90 1.00 1.10 1.20 1.30 1.50 1.60 1.80 2.00 2.20 2.50 2.80 3.10 3.50 3.90 4.30 4.90 5.50 6.20 7.00 8.00 9.30 10.20 11.80 12.50 13.00 22.00 25.00 28.00 IDC (mA) max. 445 425 400 390 370 320 300 290 270 250 240 225 190 180 170 165 150 125 115 110 100 85 80 70 80 75 70 65 65 65 65 50 45 40 SPECIFICATION FOR APPROVAL REF. : PROD. NAME SQ3225□□□□2□-□□□ ABC'S DWG NO. SMD Power Inductor REV. 20140610-D PAGE Ⅴ﹒ Curve： 1.6 80.0 1.2 60.0 △ T(℃ ) L(uH) SQ32251R2M2□ 0.8 0.4 40.0 20.0 0.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 IDC(A) 1.5 2.0 2.5 IDC(A) SQ3225220K2□ 80.0 25.0 60.0 15.0 △ T(℃ ) L(uH) 20.0 40.0 10.0 20.0 5.0 0.0 0.0 0.0 0.1 0.2 0.3 IDC(A) 0.4 0.5 0.0 0.6 0.1 0.2 0.3 IDC(A) 0.4 0.5 0.6 SQ3225221K2□ 60.0 250.0 50.0 200.0 △ T(℃ ) L(uH) 40.0 150.0 100.0 30.0 20.0 50.0 10.0 0.0 0.0 0.00 0.05 0.10 0.15 IDC(A) 0.20 0.00 0.25 0.04 0.08 0.12 IDC(A) 0.16 0.20 SQ3225561K2□ 60.0 750.0 50.0 600.0 △ T(℃ ) L(uH) 40.0 450.0 300.0 20.0 150.0 10.0 0.0 0.0 0.00 AR-001C 30.0 0.02 0.04 0.06 IDC(A) 0.08 0.10 0.12 0.00 0.02 0.04 0.06 IDC(A) 0.08 0.10 0.12 3 SPECIFICATION FOR APPROVAL REF. : SQ3225□□□□2□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140610-D PAGE 4 Ⅵ﹒Packaging information： ( 1 ) Configuration T Cover Tape N A B 2.0±0.5 D ∮C ∮C G Embossed Carrier ※Carrier Tape Width : D 4 m/m P:4 m/m Leader no component 200 m/m min. 100 100 100 100 100 100 Start 100 End Trailer no component 400 m/m min. Components User direction of feed ( 2 ) Dimensions Unit:m/m Style A 07(S) - 08 183 B 21±0.8 C 13 D 8 G 10 +0 N 50 -0 T 12.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Code B AR-001C Outer : Carton Q'TY (pcs) G.W. (gw) Style 2,000 220 07(S) - 08 Q'TY (pcs) 100,000 G.W. (Kg) Size (cm) 15.0 42 x 41 x 24 SPECIFICATION FOR APPROVAL REF. : SQ3225□□□□2□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140610-D PAGE 5 Ⅶ﹒Reliability test： Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 Test Condition 1.Temperature: 125℃ 2.Time:96 hours. 1.Temperature: -40℃ ~ 125℃ 2.Temperature Cycling JESD22 Method JA-104 2.Number of cycle:96 cycle 3.Dwell time:30 minutes 3.Biased Humidity Test MIL-STD-202 Method 103 1.Temperature: 85±5 ℃ 2.Time:96 Hours 3.Humidity: 85±5% RH. 1.Temperature: 125℃ 2.Time:96 hours. 3.Apply rated current. 4.Operational Life MIL-PRF-27 5.External Visual MIL-STD-883 Method 2009 constructions, marking and 6.Physical Dimensions JESD22 Method JB-100 Inspect product workmanship. Test Specification 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Verify physical dimensions to the applicable product detail specification. Per product specification standard 7.Resistance to solvents MIL-STD-202 Method 215 Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±10%. 8.Vibration Test MIL-STD-202 Method 204 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 1.Highest temperature： 260±5℃. 2.Time（temp.≧ 217℃）：60~150 Second. 3.IR reflow times：3 times. 10.Rated current MIL-STD-202 Method 330 11.Temperature rise MIL-PRF-27 12.Over load MIL-PRF-27 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. Apply rated current for 5 second. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. Apply rated current for 10 minutes. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. Apply double as rated current for 5 minutes. (It's not application to some special design) 2.Inductance shall not change more than ±10%. 13.Solderability Test J-STD-002 1.Baking in pre-testing： 155±5℃ / 16Hours±30 min. 2.Peak temperature：240±5℃ 3.Time（temp.≧217℃）：60~150 second. 4.IR reflow times：1 times. 14.Electrical Characteriazation User Spec. 1.Operating temperature：-40℃~125℃ 2.Room temperature：25℃. 15.Withstanding Voltage Test MIL-STD-202 Method 201 1.DC:500V 2.Time:1minutes 16.Drop JESD22-B111 Packaged & Drop down from 1m.In 1 angle 1ridges & 2 surfaces orientation. 17.Terminal Strength Test JIS-C-6429 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. AR-001C The terminal shall be at least 95% covered with fresh solder. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.During the test no breakdown. 2.The characteristic is normal after test. 1.No case deformation or change in appearance. 2.Inductance shall not change more than ±10%. After test, inductors shall be no mechanical damage.