Standard Products UT54BS3245 8x1 Bus Switch Preliminary Datasheet February 2015 www.aeroflex.com/busswitch FEATURES INTRODUCTION □ Provides cold-sparing capability without the need for actual cold-sparing multiplexer inputs □ Bidirectional operation □ 3.3V operating lower supply with typical 11Ω switch connection between ports □ 5V operating lower supply with typical 5 Ω switch connection between ports □ Isolates non cold-spared devices from an active bus □ Ultra low power CMOS technology □ ESD rating HBM: 2000V, Class 2 □ Operational environment: - Total dose: 300 krad(Si) - Latchup immune (LET <= 100 MeV-cm2/mg) □ Packaging: - 20-lead flatpack □ Standard Microelectronics Drawing (SMD) - QML Q and V pending The UT54BS3245 provides eight channels of high-speed CMOS compatible bus switching. The package is to provide a standard ’245 device pin out. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The device is organized as one 8-channel switch. When the output-enable (/EN) input is low, the switch is on, and port A is connected to port B. When /EN is high, the switch is open, and the high-impedance state exists between the two ports. APPLICATIONS INFORMATION Memory Interface - Solution for multiple memory devices on a bus – isolates heavy loading Bus Isolation - Ability to electrically isolate a device, or banks of devices, from memory bus or ADC output when not needed - Enables bank switching for redundancy or device failure - Provides cold-sparing capability without the need for actual cold-sparing buffers Redundancy - Allows multiple non cold-spare devices to be present on a bus Supports Analog Applications - In voltage range: 3.0 to 3.6V or 4.5 to 5.5V - Signal isolation: -60dB - Bandwidth (3dB): 500 MHz 1A1 1B1 1A8 1B8 /EN Figure 1. UT54BS3245 Block Diagram 36-00-03-004 Ver. 1.0.0 1 Aeroflex Microelectronics Solutions - HiRel NC 20 2 19 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 A8 VSS UT54RSA3245 AI 1 18 17 16 15 14 13 9 12 10 11 VDD /EN B1 B2 B3 B4 B8 B7 B6 B5 Figure 2. UT54BS3245 Pinout PIN DESCRIPTION Pin No. Name Description 2, 3, 4, 5, 6, 7, 8, 9 11, 12, 13, 14, 15, 16, 17, 18 19 10 20 1 nAn nBn Port A pins Port B pins /EN V SS V DD NC Active LOW enable pin Ground Pin Supply Pin, +3.3V –or- +5.0V No Connect (electrically not connected to die) TRUTH TABLE INPUT (/EN) Function L A port to B port -orB port to A port DISCONNECT H 36-00-03-004 Ver. 1.0.0 2 Aeroflex Microelectronics Solutions - HiRel ABSOLUTE MAXIMUM RATINGS 1 Symbol Parameter MIN MAX Unit Positive Output Supply Voltage -0.5 7.2 V Voltage on an Input pin during operation V DD + 0.3V V Continuous DC Channel Current 65 mA Maximum package power dissipation permitted at T C =125°C 1.6 W TJ Junction Temperature +150 °C Ө JC Thermal resistance, junction-to-case 15 °C/W T STG Storage Temperature +150 °C V DD VI 2 2 I CCC PD 3 -65 ESD ESD protection (Human Body Model) Class 2 2000 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. Functional operation should be restricted to recommended operating conditions. Exposure to absolute maximum rating conditions for extended periods may affect device reliability and performance. 2. All voltages referenced to VSS 3. Per MIL-STD-883, method 1012.1, section 3.4.1, PD=(Tj(max) - Tc(max)) / Өjc RECOMMENDED OPERATING CONDITIONS Symbol Parameter LIMIT Unit 1 Positive Output Supply Voltage 3.0 to 3.6 or 4.5 to 5.5 V 1 Input Voltage on any pin 0.0 to V DD V TC Case Temperature Range -55 to +125 °C tR Rise time >5 ns tF Fall time >5 ns 60 mA V DD V IN I CCC Continuous DC Channel Current Notes: 1. All voltages referenced to VSS OPERATIONAL ENVIROMENT 36-00-03-004 Ver. 1.0.0 PARAMETER LIMIT UNITS Total Ionizing Dose (TID) 3.0E5 rad(Si) Single Event Latchup (SEL) >100 MeV-cm2/mg 3 Aeroflex Microelectronics Solutions - HiRel DC CHARACTERISTICS*,1 (V DD = 5.0V ± 0.5V, 3.3V ± 0.3V, -55°C < T C < +125°C); Unless otherwise noted, Tc is per the temperature range ordered Symbol Parameter Condition V IH High level input voltage V DD =3.6V, 5.5V V IL Low level input voltage V DD =3.0V, 4.5V I ID Leakage current digital V DD = MAX; V I = V DD or V SS I IA Leakage current analog V DD = MAX; V I = V DD or V SS I DD Active Supply Current I DDQ MIN MAX 0.7*V DD Unit V 0.3*V DD V -1 1 µA -3 3 µA V DD =3.6V, 5.5V 0.5 mA/MHz Quiescent Supply Current V DD = MAX; I O = 0mA; V I = V DD or V SS 15 µA CI Input Capacitance (/EN) V I = V DD or VSS 5 pF C IO(OFF) I/O Capacitance when device OFF V DD = MAX V O = V DD or VSS V I = V DD /2 /EN = V DD 5 pF I/O Capacitance when device ON V DD = MAX V O = open V I = V DD /2 /EN = 0V 16 pF C IO(ON) R ONL 2,3 R ONM 2,3 Resistance through switch Resistance through switch V DD = 4.5V V I = VSS I O = 30mA I O = 15mA 10 13 Ω V DD = 3.0V V I = VSS I O = 30mA I O = 15mA 10 13 Ω 10 13 Ω 10 13 Ω 10 13 Ω 10 13 Ω V DD =4.5V V I = V DD /2 I O = -30mA I O = -15mA V DD =3.0V V I = V DD /2 R ONH 1,2 Resistance through switch 36-00-03-004 Ver. 1.0.0 I O = -30mA I O = -15mA V DD =4.5V V I = V DD I O = -30mA I O = -15mA V DD = 3.0V V I = V DD I O = -30mA I O = -15mA 4 Aeroflex Microelectronics Solutions - HiRel Symbol R ON(Flat) Parameter Condition MIN MAX Unit 5 6 Ω Switch On Resistance 1,2 V DD =3.0V,4.5V V I = V DD I O = -30mA I O = -15mA Notes: * For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to the maximum TID level procured. 1. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals. 2. Guaranteed by design. 36-00-03-004 Ver. 1.0.0 5 Aeroflex Microelectronics Solutions - HiRel AC CHARACTERISTICS *,1 (V DD = 5.0V ±0.5V, -55°C < T C < +125°C); Unless otherwise noted, T C is per the temperature range ordered Symbol From (INPUT) To (OUTPUT) Cond. MIN MAX Unit t PD30 1 A or B B or A I I =+/-30mA 500 ps t PD15 1 A or B B or A I I =+/-15mA 650 ps t EN /EN=V SS A or B 1 5 ns t DIS /EN=V DD A or B 1 7 ns (V DD = 3.3V ±0.3V, -55°C < T C < +125°C); Unless otherwise noted, T C is per the temperature range ordered Symbol From (INPUT) To (OUTPUT) Cond. MIN MAX Unit t PD30 1 A or B B or A I I =+/-30mA 1 ns t PD15 1 A or B B or A I I =+/-15mA 1.3 ns t EN /EN=V SS A or B 1 7 ns t DIS /EN=V DD A or B 1 8 ns Notes: * For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to the maximum TID level procured. 1. The propagation delay through the channel is based upon the RC time constant of the channel resistance and switch ON capacitance, 11 Ω and 17pF. Symbol Parameter Condition X TALK 1 Cross talk between channels V DD = 5.0V RL = 50Ω, CL = 50pF, f = 1MHz, V IN1 = 1V RMS Centered at V DD /2 Cross talk between channels V DD = 3.3V RL = 50Ω, CL = 50pF, f = 1MHz, V IN1 = 1V RMS Centered at V DD /2 X TALK 1 I SOOFF 1 Off Isolation MIN RL = 50Ω, CL = 50pF, f = 1MHz, V IN1 = 1V RMS Centered at V DD /2 MAX Unit -60 dB -60 dB -60 dB Notes: 1. Guaranteed by design. 36-00-03-004 Ver. 1.0.0 6 Aeroflex Microelectronics Solutions - HiRel Figure 3. Output Test Load Circuit VDD INPUT VDD/2 VDD/2 tPDxx VSS tPDxx OUTPUT VOH VDD/2 VDD/2 VOL Figure 4. Propagation Waveform VDD OUTPUT ENABLE VDD/2 VDD/2 VSS tEN tDIS OUTPUT Waveform #1 at Vi = VSS VDD/2 VOL+ΔV VOL tDIS tEN OUTPUT Waveform #2 at Vi = VDD VDD VOH VOH-ΔV VDD/2 VSS Figure 5. Propagation Waveform 36-00-03-004 Ver. 1.0.0 7 Aeroflex Microelectronics Solutions - HiRel PACKAGING Figure 6. 20-lead Ceramic Flatpack 36-00-03-004 Ver. 1.0.0 8 Aeroflex Microelectronics Solutions - HiRel ORDERING INFORMATION UT54BS3245 8x1 Bus Switch Analog: UT54 ****** * * * * Lead Finish: (Notes 1 and 2) (A) = Hot solder dipped (C) = Gold (X) = Factory option (gold or solder) Screening: (Notes 3 and 4) (C) = HiRel flow (-55°C to +125°C) (P) = Prototype flow (+25°C only) Package Type: (U) = 20-lead Flatpack) Access Time: (-) Device Type: (BS3245) = 8x1 Bus Switch Notes: 1. Lead finish (A,C, or X) must be specified. 2. If an “X” is specified when ordering, then the part marking will match the lead finish and will be either “A” (solder) or “C” (gold). 3. Prototype flow per Aeroflex Manufacturing Flows Document. Tested at 25°C only. Lead finish is GOLD ONLY. Radiation neither tested nor guaranteed. 4. HiRel Temperature Range flow per Aeroflex Manufacturing Flows Document. Devices are tested at -55°C, room temp, and +125°C. Radiation neither tested nor guaranteed. 36-00-03-004 Ver. 1.0.0 9 Aeroflex Microelectronics Solutions - HiRel UT54BS3245 Bus Switch Analog SMD: 5962 – XXXXX ** * * * Lead Finish: (Notes 1 & 2) A = Solder C = Gold X = Optional Package Type: X = 20-lead ceramic bottom-brazed Flatpack Class Designator: Q = QML Class Q V = QML Class V Device Type: 01 = UT54BS3245 (Temperature range -55C to +125C) Drawing Number: XXXXX = TBD Total Dose: R = 1E5 rads(Si) F = 3E5 rads(Si) Notes: 1. Lead finish (A,C, or X) must be specified. 2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold). 36-00-03-004 Ver. 1.0.0 10 Aeroflex Microelectronics Solutions - HiRel Aeroflex Colorado Springs - Datasheet Definition Advanced Datasheet - Product In Development Preliminary Datasheet - Shipping Prototype Datasheet - Shipping QML & Reduced Hi – Rel This product is controlled for export under the U.S. Department of Commerce (DoC). A license may be required prior to the export of this product from the United States. 36-00-03-004 Ver. 1.0.0 11 Aeroflex Microelectronics Solutions - HiRel