PHOTOCOUPLER PS8821-1,-2 1 Mbps ANALOG OUTPUT TYPE 8-PIN SSOP (SO-8) HIGH-SPEED PHOTOCOUPLER −NEPOC Series− DESCRIPTION The PS8821-1, -2 are optically coupled isolators containing a GaAlAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. The PS8821-2 is suitable for high density applications. FEATURES • 40% reduction of mounting area (5-pin SOP × 2) • Low power consumption (VCC = 3.3 V) PIN CONNECTION (Top View) • High isolation voltage (BV = 2 500 Vr.m.s.) • High-speed response (tPHL = 0.6 μs MAX., tPLH = 0.9 μs MAX.) • Ordering number of tape product: PS8821-1-F3, F4: 1 500 pcs/reel 8 7 1 2 PS8821-1 5 1. NC 2. Anode 3. Cathode 4. NC 5. GND 6. VO 7. NC 8. VCC 3 4 8 7 6 1 2 : PS8821-2-F3, F4: 1 500 pcs/reel • Pb-Free product • Safety standards • UL approved: File No. E72422 • DIN EN60747-5-2 (VDE0884 Part2) approved (Option) APPLICATIONS • Power over Ethernet • Computer and peripheral manufactures • Substitutions for relays and pulse transformers • Power supply 6 PS8821-2 5 1. Anode1 2. Cathode1 3. Cathode2 4. Anode2 5. GND 6. VO2 7. VO1 8. VCC 3 4 Document No. PN10591EJ03V0DS (3rd edition) Date Published August 2008 NS The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2006, 2008 PS8821-1,-2 PACKAGE DIMENSIONS (UNIT: mm) 5.21±0.25 6.0±0.2 0.1±0.1 0.15 +0.10 –0.05 3.27±0.2 3.95±0.1 2 1.27 0.4 +0.10 –0.05 0.5±0.3 0.10 S 0.25 M Data Sheet PN10591EJ03V0DS PS8821-1,-2 <R> MARKING EXAMPLE SnBi PLATING PS8821-1 8821-1 NL831 PS8821-2 8821-2 NL831 Type Number Assembly Lot Type Number Assembly Lot N N N L 8 31 N L 8 31 Week Assembled Year Assembled (Last 1 Digit) No. 1 pin Mark Initial of NEC (Engraved mark) Week Assembled Year Assembled (Last 1 Digit) No. 1 pin Mark Initial of NEC (Engraved mark) In-house Code (L: Pb-Free) In-house Code (L: Pb-Free) Rank Code Rank Code Ni/Pd/Au PLATING PS8821-1 8821-1 NT831 PS8821-2 8821-2 NT831 Type Number Assembly Lot Assembly Lot N N N T 8 31 No. 1 pin Mark Initial of NEC (Engraved mark) Type Number N T 8 31 Week Assembled Year Assembled (Last 1 Digit) No. 1 pin Mark Initial of NEC (Engraved mark) In-house Code (T: Pb-Free) Week Assembled Year Assembled (Last 1 Digit) In-house Code (T: Pb-Free) Rank Code Rank Code Data Sheet PN10591EJ03V0DS 3 PS8821-1,-2 <R> ORDERING INFORMATION Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval PS8821-1 PS8821-1-A Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS8821-1-F3 PS8821-1-F3-A (SnBi) Embossed Tape 1 500 pcs/reel (UL approved) PS8821-1-F4 PS8821-1-F4-A PS8821-2 PS8821-2-A 20 pcs (Tape 20 pcs cut) PS8821-2-F3 PS8821-2-F3-A Embossed Tape 1 500 pcs/reel PS8821-2-F4 PS8821-2-F4-A PS8821-1-V PS8821-1-V-A 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS8821-1-V-F3 PS8821-1-V-F3-A Embossed Tape 1 500 pcs/reel (VDE0884 Part2) PS8821-1-V-F4 PS8821-1-V-F4-A PS8821-2-V PS8821-2-V-A 20 pcs (Tape 20 pcs cut) PS8821-2-V-F3 PS8821-2-V-F3-A Embossed Tape 1 500 pcs/reel PS8821-2-V-F4 PS8821-2-V-F4-A PS8821-1 PS8821-1-AX Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS8821-1-F3 PS8821-1-F3-AX (Ni/Pd/Au) Embossed Tape 1 500 pcs/reel (UL approved) PS8821-1-F4 PS8821-1-F4-AX PS8821-2 PS8821-2-AX 20 pcs (Tape 20 pcs cut) PS8821-2-F3 PS8821-2-F3-AX Embossed Tape 1 500 pcs/reel PS8821-2-F4 PS8821-2-F4-AX PS8821-1-V PS8821-1-V-AX 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS8821-1-V-F3 PS8821-1-V-F3-AX Embossed Tape 1 500 pcs/reel (VDE0884 Part2) PS8821-1-V-F4 PS8821-1-V-F4-AX PS8821-2-V PS8821-2-V-AX 20 pcs (Tape 20 pcs cut) PS8821-2-V-F3 PS8821-2-V-F3-AX Embossed Tape 1 500 pcs/reel PS8821-2-V-F4 PS8821-2-V-F4-AX PS8821-1 PS8821-2 PS8821-1 Approved (Option) PS8821-2 PS8821-1 PS8821-2 PS8821-1 Approved (Option) *1 For the application of the Safety Standard, following part number should be used. 4 Application *1 Part Number Data Sheet PN10591EJ03V0DS PS8821-2 PS8821-1,-2 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit IF 25 mA/ch VR 5.0 V/ch PD 45 mW/ch Supply Voltage VCC 7 V Output Voltage VO 7 V/ch IO 8.0 mA/ch PC 100 mW/ch BV 2 500 Vr.m.s. Operating Ambient Temperature TA –55 to +100 °C Storage Temperature Tstg –55 to +125 °C Diode Forward Current Reverse Voltage Power Dissipation Detector *1 Output Current Power Dissipation Isolation Voltage *2 *3 *1 Reduced to 0.45 mA/°C at TA = 25°C or more. *2 Reduced to 1.00 mA/°C at TA = 25°C or more. *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-4 shorted together, 5-8 shorted together. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Forward Current (ON) Input Voltage (OFF) Symbol MIN. TYP. MAX. Unit VCC 3.0 3.3 3.6 V IF (ON) 16 20 mA VF (OFF) 0 0.8 V Data Sheet PN10591EJ03V0DS 5 PS8821-1,-2 ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) Parameter Diode Conditions Forward Voltage VF IF = 16 mA Reverse Current IR VR = 3 V Forward Voltage Temperature Coefficient Detector Symbol ΔVF/ΔTA MIN. IF = 16 mA TYP. MAX. Unit 1.7 2.2 V 10 μA −2.1 mV/°C 30 pF Terminal Capacitance Ct V = 0 V, f = 1 MHz High Level Output Current IOH IF = 0 mA, VCC = VO = 3.3 V 0.01 1 μA Low Level Output Voltage VOL IF = 16 mA, VCC = 3.3 V, IOL = 1.2 mA 0.1 0.4 V High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 3.3 V 0.1 10 μA 0.2 20 (PS8821-1) High Level Supply Current (PS8821-2) Low Level Supply Current (PS8821-1) ICCL IF = 16 mA, VO = open, VCC = 3.3 V 100 Low Level Supply Current 200 (PS8821-2) Coupled Current Transfer Ratio CTR IF = 16 mA, VCC = 3.3 V, VO = 0.4 V 20 Input-Output RI-O VI-O = 1 kVDC, RH = 40 to 60% 10 RI-I VI-I = 5 VDC, RH = 40 to 60% 10 CI-O V = 0 V, f = 1 MHz 40 % Ω 11 Isolation Resistance Insulation Resistance 7 (Input-Input), (PS8821-2) Input-Output 0.6 pF Isolation Capacitance Insulation Capacitance (Input-Input), (PS8821-2) CI-I Propagation Delay Time tPHL (H → L) *1 Propagation Delay Time tPLH 0.3 IF = 10 mA, VCC = 3.3 V, RL = 1.8 kΩ, CL = 15 pF, VTHHL = VTHLH = 1.5 V, TA = 0 to 100°C 0.3 0.6 0.5 0.9 μs (L → H) *1 Common Mode CMH Common Mode Transient Immunity at *2 Low Level Output 6 IF = 0 mA, VCC = 3.3 V, RL = 4.1 kΩ, 1 VCM = 1 kV Transient Immunity at *2 High Level Output CML IF = 10 mA, VCC = 3.3 V, RL = 4.1 kΩ, VCM = 1 kV Data Sheet PN10591EJ03V0DS −1 kV/μs PS8821-1,-2 *1 Test circuit for propagation delay time VCC = 3.3 V PS8821-1 (PW = 1μs, Pulse input (IF) Duty cycle = 1/10) Input (Monitor) 47 Ω 0.1 μ F RL = 1.8 kΩ VO (Monitor) CL = 15 pF (IF = 10 mA) Input 50% Output VCC = 3.3 V PS8821-2 Pulse input (IF) (PW = 1μs, Duty cycle = 1/10) Input (Monitor) tPHL 1.5 V VOL tPLH RL = 1.8 kΩ VO (Monitor) 0.1 μF CL = 15 pF 47 Ω Remark CL is approximately 15 pF which includes probe and stray wiring capacitance. *2 Test circuit for common mode transient immunity PS8821-1 VCC = 3.3 V RL = 4.1 kΩ 0.1 μF VO (Monitor) CL = 15 pF 1 kV VCM 90% 10% IF VCM 0V tr VO (IF = 0 mA) PS8821-2 SW IF VCC = 3.3 V RL = 4.1 kΩ 0.1 μF VO (Monitor) CL = 15 pF VO (IF = 10 mA) tf VOH 2V 0.8 V VOL VCM USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity. Data Sheet PN10591EJ03V0DS 7 PS8821-1,-2 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) Diode Power Dissipation PD (mW) 50 40 30 20 10 25 0 50 75 60 40 20 50 75 100 Ambient Temperature TA (˚C) FORWARD CURRENT vs. FORWARD VOLTAGE HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE High Level Output Current IOH (nA) TA = +100˚C +50˚C +25˚C 1 0˚C –25˚C 0.1 1.2 1.4 1.6 1.8 2.0 2.2 IF = 0 mA, VCC = VO = 3.3 V 100.0 10.0 1.0 –50 2.4 –25 0 25 50 75 100 Forward Voltage VF (V) Ambient Temperature TA (˚C) CURRENT TRANSFER RATIO vs. FORWARD CURRENT NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 70.0 VCC = 3.3 V, VO = 0.4 V 60.0 50.0 40.0 30.0 20.0 10.0 0 1 10 50 1.6 Normalized to 1.0 1.4 at TA = 25˚C, IF = 10 mA, VCC = 3.3 V, VO = 0.4 V 1.2 1.0 0.8 0.6 0.4 0.2 0.0 –50 Remark –25 0 25 50 75 Ambient Temperature TA (˚C) Forward Current IF (mA) 8 25 Ambient Temperature TA (˚C) Normalized Current Transfer Raio CTR Forward Current IF (mA) 80 1 000.0 0.01 1.0 Current Transfer Ratio CTR (%) 100 0 100 100 10 120 The graphs indicate nominal characteristics. Data Sheet PN10591EJ03V0DS 100 Propagation Delay Time tPHL, tPLH (μs) PROPAGATION DELAY TIME vs. FORWARD CURRENT 2.0 VCC = 3.3 V, RL = 1.8 kΩ 1.0 tPLH tPHL 0 8 10 12 14 16 18 Normalized Propagation Delay Time tPHL, tPLH PS8821-1,-2 NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 5 4 3 2 tPLH 1 0 –50 Forward Current IF (mA) Remark Normalized to 1.0 at TA = 25˚C, IF = 10 mA, VCC = 3.3 V, VO = 0.4 V, RL = 1.8 kΩ tPHL –25 0 25 50 75 100 Ambient Temperature TA (˚C) The graphs indicate nominal characteristics. Data Sheet PN10591EJ03V0DS 9 PS8821-1,-2 TAPING SPECIFICATIONS (UNIT: mm) 1.7±0.1 5.56±0.1 5.5±0.1 1.5+0.1 –0 12.0±0.2 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 4.05 MAX. 3.6±0.1 6.4±0.1 0.3±0.05 8.0±0.1 Taping Direction PS8821-1-F4 PS8821-2-F4 PS8821-1-F3 PS8821-2-F3 Outline and Dimensions (Reel) 2.0±0.5 φ 13.0±0.2 φ 21.0±0.8 φ 100±1.0 R 1.0 φ 330±2.0 2.0±0.5 φ13.0±0.2 13.5±1.0 17.5±1.0 11.9 to 15.4 Outer edge of flange Packing: 1 500 pcs/reel 10 Data Sheet PN10591EJ03V0DS PS8821-1,-2 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 1.27 0.8 1.45 5.25 Remark All dimensions in this figure must be evaluated before use. Data Sheet PN10591EJ03V0DS 11 PS8821-1,-2 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One (Allowed to be dipped in solder including plastic mold portion.) • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. 12 Data Sheet PN10591EJ03V0DS PS8821-1,-2 (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. <R> USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10591EJ03V0DS 13 PS8821-1,-2 <R> SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Speck Unit Application classification (DIN EN 60664-1 VDE0110 Part 1) for rated line voltages ≤ 300 Vr.m.s. for rated line voltages ≤ 600 Vr.m.s. IV III Climatic test class (DIN EN 60664-1 VDE0110) 55/100/21 Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.5 × UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices) UIORM Upr 566 849 Vpeak Vpeak Upr 1 061 Vpeak UTR 4 000 Vpeak Upr = 1.875 × UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2 Clearance distance >4.0 mm Creepage distance >4.0 mm Comparative tracking index (DIN IEC 112/VDE 0303 Part 1) CTI Material group (DIN EN 60664-1 VDE0110 Part 1) 175 III a Storage temperature range Tstg –55 to +125 °C Operating temperature range TA –55 to +100 °C Ris MIN. Ris MIN. 10 11 10 Package temperature Tsi 150 °C Current (input current IF, Psi = 0) Isi 150 mA Power (output or total power dissipation) Psi 600 mW Ris MIN. 10 Isolation resistance, minimum value VIO = 500 V dc at TA = 25°C VIO = 500 V dc at TA MAX. at least 100°C 12 Ω Ω Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Isolation resistance VIO = 500 V dc at TA = Tsi 14 Data Sheet PN10591EJ03V0DS 9 Ω PS8821-1,-2 • The information in this document is current as of August, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. 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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PN10591EJ03V0DS 15 PS8821-1,-2 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.