1 Amp Adjustable CMOS LDO Voltage Regulator

CAT6241
1 Amp Adjustable CMOS
LDO Voltage Regulator
Description
The CAT6241 is a low dropout CMOS voltage regulator providing
up to 1000 mA of output current with fast response to load current and
line voltage changes. CAT6241 offers a user adjustable output voltage
from 0.5 V to 5.0 V and its low quiescent current make CAT6241 ideal
for energy conscious designs. CAT6241 is available in space saving
2 mm x 2 mm UDFN−8 and 3 mm x 3 mm WDFN−6 packages, each
with a power pad for heat sinking to the PCB.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Guaranteed 1000 mA Continuous Output Current
VOUT: 0.5 V to 5.0 V, Minimum VIN: 1.6 V
Dropout Voltage of 350 mV Typical at 1000 mA
±2.0% Output Voltage Accuracy at Room Temperature
No−load Ground Current of 70 mA Typical
Full−load Ground Current of 140 mA Typical
“Zero” Current Shutdown Mode
Under Voltage Lockout
Stable with Ceramic Output Capacitors
Current Limit and Thermal Protection
2 mm x 2 mm UDFN−8 and 3 mm x 3 mm WDFN−6 Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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1
WDFN−6
3 x 3 mm
CASE 511AP
PIN CONNECTIONS
EN
1
VIN
GND
ADJ
BYP
VOUT
VIN
VIN
GND
EN
1
VOUT
VOUT
ADJ
BYP
(Top Views)
MARKING DIAGRAMS
Typical Applications
•
•
•
•
•
UDFN−8
2 x 2 mm
CASE 517AW
DSP Core and I/O Voltages
FPGAs, ASICs
PDAs, Mobile Phones, GPS
Camcorders and Cameras
Hard Disk Drives
62XX
LAAA
YWW
G
(WDFN−6)
1
XXL
YM
G
(UDFN−8)
1
XX
62XX
L
AAA
Y
M
WW
G
= Specific Device Code
= Specific Device Code
= Assembly Location Code
= Assembly Lot Number
= (Last Three Digits)
= Production Year (Last Digit)
= Production Month (1−9, O, N, D)
= Production Week (Two Digits)
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 17 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
July, 2013 − Rev. 6
1
Publication Order Number:
CAT6241/D
CAT6241
VIN
VIN
VOUT
VOUT
ENABLE
CIN
1 mF
COUT
2.2 mF
CAT6241
BYP
CBYP
(Optional)
ADJ
GND
Figure 1. Application Schematic
VOUT
VOUT
VIN
VIN
ISENSE
Thermal
Shutdown
+
ADJ
−
+
VREF −
Enable
Logic
EN
BYP
2.5 M
GND
Figure 2. Simplified Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin #
WDFN−6
Pin #
UDFN−8
Pin Name
1
4
EN
2, PAD
3, PAD
GND
Power Supply Ground; Device Substrate. The center pad is internally connected to Ground
and as such can cause short circuits to signal traces running beneath the IC. This pad is
intended for heat sinking the IC to the PCB and is typically connected to the PCB ground
plane.
3
5
BYP
Bypass input. Placing a capacitor of 100 pF to 470 pF between BYP and ground reduces
noise on VOUT. This capacitor is optional.
4
7, 8
VOUT
Regulated Output Voltage. A protection block eliminates any current flow from output to
input if VOUT > VIN. Connect both pins for specified dropout performance.
5
6
ADJ
Output Voltage Adjust Input. This input ties to the common point of a resistor divider which
determines the regulator’s output voltage. See Applications section for details on selecting
resistor values.
6
1, 2
VIN
Positive Power Supply Input. Supplies power for VOUT as well as the regulator’s internal
circuitry. Connect both pins for specified dropout performance.
Description
The Enable Input. An active HIGH input, turning ON the LDO. This input should be tied to
VIN if the LDO is not intended to be shut off during normal operation. A pull−down 2.5 MW
resistor maintains the circuit in the OFF state if the pin is left open.
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CAT6241
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 to 6.0
V
VOUT
−0.3 to 6.0
V
Enable Input Range
EN
−0.3 to 5.5 V or (VIN + 0.3),
whichever is lower
V
Adjust Input Range
ADJ
−0.3 to 5.5 V
V
Bypass Input Range
BYP
−0.3 to 5.5 V or (VIN + 0.3),
whichever is lower
V
Power Dissipation
PD
Internally Limited
mW
TJ(max)
150
°C
TSTG
−65 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2
kV
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
TSLD
260
°C
Input Voltage Range (Note 1)
Output Voltage Range
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating range.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 3. THERMAL CHARACTERISTICS
Rating
Symbol
Value
RqJA
RyJL
55
10
Thermal Characteristics, WDFN−6, 3 x 3 mm
Thermal Resistance, Junction−to−Air: 1 in2/1 oz. copper (Note 4)
Thermal Reference, Junction−to−Case (Note 4)
Unit
°C/W
4. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
Table 4. OPERATING RANGES (Note 5)
Symbol
Min
Max
Unit
Input Voltage (Note 6)
VIN
1.6
5.5
V
Output Current
IOUT
0.1
1000
mA
Output Voltage
VOUT
0.5
5.0
V
TA
−40
85
°C
Rating
Ambient Temperature
5. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating range.
6. Minimum VIN_MIN = 1.6 V or (VOUT + VDO), whichever is higher.
Table 5. ELECTRICAL CHARACTERISTICS (VIN = (VOUT + 1 V) or VIN_MIN, whichever is higher, CIN = 1 mF, COUT = 2.2 mF, for
typical values TA = 25°C, for Bold values TA = −40°C to 85°C; unless otherwise noted.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
INPUT / OUTPUT
VIN
VOUT
VOUT−ACC
VADJ
TCOUT
IOUT
Input Voltage
1.6
5.5
V
Output Voltage Range
0.5
5.0
V
−2
2
%
−3
3
Output Voltage Accuracy
Initial accuracy, IOUT = 1 mA
Voltage at ADJ input
0.485
Output Voltage Temp. Coefficient
Output Current
0.0001
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3
0.5
0.515
V
50
ppm/°C
1
A
CAT6241
Table 5. ELECTRICAL CHARACTERISTICS (VIN = (VOUT + 1 V) or VIN_MIN, whichever is higher, CIN = 1 mF, COUT = 2.2 mF, for
typical values TA = 25°C, for Bold values TA = −40°C to 85°C; unless otherwise noted.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIN = VOUT + 1.0 V to 5.5 V,
IOUT = 10 mA
−0.3
±0.08
0.3
%/V
VIN = VOUT + 1.0 V to 5.5 V,
IOUT = 10 mA
−0.45
INPUT / OUTPUT
VR−LINE
VR−LOAD
VDO
Line Regulation
0.45
Load Regulation
VOUT ≥ 0.8 V
IOUT = 100 mA to 1000 mA
VOUT = 1.2 V
IOUT = 300 mA
TA = 25°C
460
IOUT = 1 A
TA = 25°C
700
VOUT = 2.5 V
1.5
VOUT = 2.5 V
85
350
275
IADJ
ADJ Input Current
100
IGND
Ground Current
nA
mA
70
IOUT = 0 mA
100
IOUT = 0 mA
IOUT = 1000 mA
140
IOUT = 1000 mA
ISC
mV
110
VOUT = 3.3 V
IGND−SD
%
3
IOUT = 100 mA to 1000 mA
VOUT = 3.3 V
VOUT = 1.2 V
2
200
250
Shutdown Ground Current
VEN < 0.4 V
Output short circuit current limit
VOUT = 0 V
900
mA
f = 1 kHz, BYP = 470 pF,
IOUT = 10 mA
54
dB
f = 20 kHz, BYP = 470 pF,
IOUT = 10 mA
42
BW = 10 Hz to 100 kHz
BYP = 470 pF, IOUT = 10 mA
45
5
mA
PSRR AND NOISE
PSRR
eN
Power Supply Rejection Ratio
Output Noise Voltage for 1.2 V output
mVrms
UVLO, ROUT AND ESR
VUVLO
ROUT−SH
ESR
Under voltage lockout threshold
1.4
ON resistance of Discharge Transistor
150
COUT equivalent series resistance
5
1.55
V
W
500
mW
ENABLE INPUT
VHI
Logic High Level
VIN = 1.6 to 5.5 V
VLO
Logic Low Level
VIN = 1.6 to 5.5 V
IEN
Enable Input Current
VEN = 0.4 V
REN
Enable pull−down resistor
VEN = VIN = 2.5 V
V
1.6
0.4
V
0.15
1
mA
1
3
2.5
MW
CBYP = 0 pF
230
ms
CBYP = 470 pF
1600
TIMING
TON
Turn−On Time
THERMAL PROTECTION
TSD
Thermal Shutdown
145
°C
THYS
Thermal Hysteresis
10
°C
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Output current capability depends upon the value of both VIN and VOUT. For VOUT ≤ 0.8 V, output current capability is 90% of ISC (see
Figure 13). For VOUT > 0.8 V, current capability is 1 A for VIN ≥ 1.8 V.
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CAT6241
TYPICAL CHARACTERISTICS
(shown for VADJ = VOUT = 0.5 V, VIN = 1.6 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
510
1 mA
500
OUTPUT VOLTAGE (mV)
OUTPUT VOLTAGE (mV)
600
400 mA
400
300
200
100
0
0
505
500
495
490
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0
0.5 1.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 3. Dropout Characteristics
Figure 4. Line Regulation
5.0 5.5
550
530
OUTPUT VOLTAGE (mV)
OUTPUT VOLTAGE (mV)
500
520
510
500
490
480
470
0
100
200
300
200
150
100
0
100
200
300
400
500
OUTPUT LOAD CURRENT (mA)
Figure 5. Load Regulation
Figure 6. Output Current Capability
600
100
90
GROUND CURRENT (mA)
90
GROUND CURRENT (mA)
300
250
OUTPUT LOAD CURRENT (mA)
100
80
70
60
50
40
30
20
400
350
50
0
500
400
450
0
100
200
300
400
80
70
60
50
40
30
20
10
0
500
0
0.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
OUTPUT LOAD CURRENT (mA)
INPUT VOLTAGE (V)
Figure 7. Ground Current vs. Load Current
Figure 8. Ground Current vs. Input Voltage
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CAT6241
TYPICAL CHARACTERISTICS
520
80
515
70
GROUND CURRENT (mA)
OUTPUT VOLTAGE (mV)
(shown for VADJ = VOUT = 0.5 V, VIN = 1.6 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
510
505
500
495
490
485
0
40
20
60
80
40
30
20
0
−40 −20
120
100
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 9. Output Voltage vs. Temperature
Figure 10. Ground Current vs. Temperature
1.2
FALLING ENABLE THRESHOLD (V)
1.2
1.0
0.8
0.6
0.4
0.2
2.0
2.5
3.0
3.5
4.0
4.5
5.5
5.0
1.0
0.8
0.6
0.4
0.2
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 11. Rising Enable Threshold vs. Input
Voltage
Figure 12. Falling Enable Threshold vs. Input
Voltage
1400
SHORT CIRCUIT CURRENT (mA)
RISING ENABLE THRESHOLD (V)
50
10
480
−40 −20
0
1.5
60
1200
1000
VOUT = 0
800
600
400
200
0
0
1
3
2
4
5
INPUT VOLTAGE (V)
Figure 13. Output Short−circuit Current vs.
Input Voltage
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CAT6241
TRANSIENT CHARACTERISTICS
(shown for VOUT = 0.5 V, VIN = 1.6 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
Figure 14. Enable Turn−on (1 mA Load)
Figure 15. Enable Turn−off (1 mA Load)
Figure 16. Enable Turn−on (350 mA Load)
Figure 17. Enable Turn−off (350 mA Load)
Figure 18. Enable Turn−on (1 mA Load)
CBYP = 470 pF
Figure 19. Enable Turn−on (350 mA Load)
CBYP = 470 pF
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CAT6241
TRANSIENT CHARACTERISTICS
(shown for VOUT = 0.5 V, VIN = 1.6 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
Figure 20. Load Transient Response
(1 mA to 350 mA)
Figure 21. Load Transient Response
(1 mA to 500 mA) VIN = 1.8 V
Figure 22. Load Transient Response
(1 mA to 500 mA) VIN = 1.9 V
Figure 23. Load Transient Response
(1 mA to 500 mA) VIN = 2.0 V
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CAT6241
TYPICAL CHARACTERISTICS
(shown for VOUT = 1.0 V, VIN = 2.0 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
1100
1010
RL = 1 KW
OUTPUT VOLTAGE (mV)
800
RL = 2 W
700
600
500
400
300
200
100
0
0
0.5
1005
1000
995
990
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Figure 24. Dropout Characteristics
Figure 25. Line Regulation
1100
1030
1000
1020
900
1010
1000
990
980
970
960
0
0.5
INPUT VOLTAGE (V)
1040
950
940
0
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (mV)
OUTPUT VOLTAGE (mV)
RL = 1 W
900
100 200 300 400 500 600 700
800
700
600
500
400
300
200
100
0
800 900 1000
0
200
400
600
800
1000
1200 1400
OUTPUT LOAD CURRENT (mA)
OUTPUT LOAD CURRENT (mA)
Figure 26. Load Regulation
Figure 27. Output Current Capability
100
90
GROUND CURRENT (mA)
OUTPUT VOLTAGE (V)
1000
80
70
60
50
40
30
20
0
200
600
400
800
1000
OUTPUT LOAD CURRENT (mA)
Figure 28. Ground Current vs. Load Current
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CAT6241
TRANSIENT CHARACTERISTICS
(shown for VOUT = 1.0 V, VIN = 2.0 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
Figure 29. Enable Turn−on (1 mA Load)
Figure 30. Enable Turn−off (1 mA Load)
Figure 31. Enable Turn−on (1 A Load)
Figure 32. Enable Turn−off (1 A Load)
Figure 33. Enable Turn−on (1 mA Load)
CBYP = 470 pF
Figure 34. Enable Turn−on (1 A Load)
CBYP = 470 pF
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CAT6241
TRANSIENT CHARACTERISTICS
(shown for VOUT = 1.0 V, VIN = 2.0 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
Figure 35. Load Transient Response
(1 mA to 1 A)
Figure 36. Load Transient Response
(1 mA to 1 A) VIN = 2.2 V
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CAT6241
PIN FUNCTIONS
VIN
100 pF to 470 pF. Values larger than this will provide no
additional improvement and will further extend CAT6241’s
startup time.
A bypass capacitor is not required for operation and BYP
may be left open or floating if no capacitor is used but DO
NOT ground BYP as this will interfere with the error
amplifier’s functioning.
Positive Power Input. Power is supplied to the device
through the VIN pin. A bypass capacitor is required on this
pin if the device is more than six inches away from the main
input filter capacitor. In general it is advisable to include a
small bypass capacitor adjacent to the regulator. In
battery−powered circuits this is particularly important
because the output impedance of a battery rises with
frequency, so a bypass capacitor in the range of 1 mF to 10 mF
is recommended.
ADJ
ADJ = Adjust and is the voltage control input. ADJ
connects to the center point of a resistor divider which
determines the CAT6241’s output voltage. See Applications
Section for resistor selection guidelines.
GND
Ground. The negative voltage of the input power source.
The center pad on the back of the package is also electrically
ground. This pad is used for cooling the device by making
connection to the buried ground plane through solder filled
vias or by contact with a topside copper surface exposed to
free flowing air.
VOUT
VOUT is the regulator’s output and supplies power to the
load. VOUT can be shut off via the ENABLE input. All
CAT6241 members are designed to block reverse current,
meaning anytime VOUT becomes greater than VIN the pass
FET will be shut off so there is no reverse current flow from
output to input. CAT6241 is also equipped with an output
discharge transistor that is turned ON anytime ENABLE is
at a logic Low. This transistor ensures VOUT discharges to
0 V when the regulator is shutdown. This is especially
important when powering digital circuitry because if VOUT
fails to reach 0 V their POR (power−ON reset) circuitry may
not trigger and scrambled data or unpredictable operations
may result.
A minimum output capacitor of 2.2 mF should be placed
between VOUT and GND to insure stable operation.
Increasing the size of COUT, up to 22 mF, will improve
transient response to large changes in load current.
ENABLE
ENABLE is an active high logic input which controls the
regulator’s the output state. If ENABLE < 0.4 V the
regulator is shutdown and VOUT = 0 V. If ENABLE > 1.6 V
the regulator is active and supplying power to the load.
If the regulator is intended to operate continuously and
won’t be shut down from time to time ENABLE should be
tied to VIN.
BYP
The Bypass Capacitor input is used to decrease output
voltage noise by placing a capacitor between BYP and
ground. The recommended range of capacitance is from
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CAT6241
APPLICATIONS INFORMATION
Input Decoupling (CIN)
VIN
A ceramic or tantalum 1 mF capacitor is recommended and
should be connected close to the CAT6241’s package.
Higher capacitance and lower ESR will improve the overall
line and load transient response.
ENABLE
CIN
BYP
CBYP
The minimum output decoupling value is 2.2 mF and can
be augmented to fulfill stringent load transient
requirements. Larger values, up to 22 mF, improve noise
rejection and load regulation transient response. The
CAT6241 is a highly stable regulator and performs well over
a wide range of Equivalent Series Resistances (ESR) with
ceramic chip capacitors.
As power in the CAT6241 increases, it may become
necessary to provide thermal relief. The maximum power
dissipation supported by this device is dependent upon
board design and layout. Mounting pad configuration on the
PCB, the board material, and the ambient temperature affect
the rate of junction temperature rise for the part. When the
CAT6241 has good thermal conductivity through the PCB,
the junction temperature will be relatively low even with
high power applications. The maximum dissipation the
CAT6241 can handle is given by:
P D(MAX) +
The output voltage can be adjusted from 0.5 V to 5.0 V
using resistors between the output and the ADJ input. The
output voltage and resistors are chosen using Equation 1 and
Equation 2.
R2 ^
0.5 V
I DIV
ǒ
R1 ^ R2
V OUT
*1
0.5 V
R 1Ǔ
ƪTJ(MAX) * TAƫ
R qJA
(eq. 4)
Since TJ is not recommended to exceed 125°C, then with
CAT6241 soldered to 645 mm2 (1 sq inch), 1 oz copper area,
FR4 PCB material can dissipate in excess of 1 W when the
ambient temperature (TA) is 25°C. Note that this assumes the
pad in the center of the package is soldered to the dissipating
copper foil. See Figure below for RqJA versus PCB area for
heat dissipating areas smaller than 645 mm2. Power
dissipation can be calculated from the following equations:
(eq. 1)
(eq. 2)
Ǔ
R2
Thermal Considerations
Output Voltage Adjust
Ǔ
GND
Input bias current, IADJ, for all practical designs can be
ignored (IADJ = 0). Considering that the lowest
recommended IOUT value is 100 mA, then, when there is no
load on VOUT, Idivider must be 100 mA to keep CAT6241 in
regulation. This then sets R2’s value using Equation 2 to
5 KW, which minimizes output noise. Use Equation 3 to find
the required value for R1. If needed, lower values for IDIV
can be considered, but not lower than 10 mA. The trade−off
will be worse values for both load regulation and TCOUT.
The CAT6241 adjustable regulator will operate properly
under conditions where the only load current is through the
resistor divider that sets the output voltage. However, in the
case where the CAT6241 is configured to provide a 0.5 V
output, there is no resistor divider and the ADJ pin is
connected to VOUT. If the part is enabled under no−load
conditions, leakage current through the pass transistor at
junction temperatures above 85°C can approach several
microamperes, especially as junction temperature
approaches 150°C. If this leakage current is not directed into
a load, the output voltage will rise above nominal until a load
is applied. For this reason it is recommended that a minimum
load of 100 mA be present at all times. Normally the voltage
setting resistor divider will serve this function but if no
divider is used (VOUT = 0.5 V) then an external load of
5 KW should be provided.
R1
) ǒI ADJ
R2
COUT
ADJ
Figure 37. Adjustable Output Resistor Divider
No−Load Regulation Considerations
ǒ
R1
CAT6241
Output Decoupling (COUT)
V OUT + 0.5 1 )
VOUT
VOUT
VIN
P D [ V IN(I GND ) I OUT) ) I OUT(V IN * V OUT) (eq. 5)
(eq. 3)
or
V IN(MAX) [
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P D(MAX) ) (V OUT
I OUT ) I GND
I OUT)
(eq. 6)
CAT6241
300
1 oz C.F
250
Theta JA (°C/W)
2 oz C.F
1 oz Sim
200
2 oz Sim
150
100
50
0
0
25
50
75
100
125
150
175
200
225
250
275
300
650
Copper heat spreading area (mm2)
Figure 38. Thermal Resistance vs. PCB Copper Area for 3 mm x 3 mm WDFN Package
PCB Layout Top Layer and
connections to heat spreading plane
Close−up of pad area
Figure 39. Topside Copper Foil Pattern for Heat Dissipation
Design Hints
external components, especially the input and output
capacitors, as close as possible to the CAT6241, and keep
traces between power source and load as short as possible.
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is high
due to narrow trace width or long length, there is a chance
to pick up noise or cause the regulator to malfunction. Place
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CAT6241
PACKAGE DIMENSIONS
WDFN6 3x3, 0.95P
CASE 511AP−01
ISSUE O
A
D
B
L1
PIN 1
REFERENCE
2X
0.15 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
0.15 C
0.10 C
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÇÇ
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
DETAIL B
0.08 C
(A3)
SIDE VIEW
ÇÇÇ
ÉÉÉ
A1
A1
C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.35
0.45
3.00 BSC
2.40
2.60
3.00 BSC
1.50
1.70
0.95 BSC
0.20
−−−
0.30
0.50
−−−
0.15
SEATING
PLANE
D2
L
e
1
6X
A3
ALTERNATE
CONSTRUCTIONS
A
6X
MOLD CMPD
DETAIL B
7X
DETAIL A
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
4X
3
SOLDERING FOOTPRINT*
E2
K
6
2.60
PKG
OUTLINE
6X
0.63
4
6X
BOTTOM VIEW
b
0.10 C A B
0.05 C
1.70
3.30
NOTE 3
1
0.95
PITCH
6X
0.45
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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15
CAT6241
PACKAGE DIMENSIONS
UDFN8, 2x2
CASE 517AW−01
ISSUE O
D
A
D2
DETAIL A
E
E2
PIN #1
IDENTIFICATION
A1
PIN #1 INDEX AREA
TOP VIEW
SYMBOL
MIN
SIDE VIEW
NOM
MAX
A
0.45
0.50
0.55
A1
0.00
0.02
0.05
b
0.18
0.25
0.30
D
1.90
2.00
2.10
D2
1.50
1.60
1.70
E
1.90
2.00
2.10
E2
0.80
0.90
1.00
e
L
BOTTOM VIEW
b
L
e
0.50 BSC
0.20
0.30
DETAIL A
0.45
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-229.
http://onsemi.com
16
CAT6241
Table 6. ORDERING INFORMATION (Notes 9 − 12)
Output Voltage
Package
Shipping
CAT6241−ADJMT5T3
Adjustable
WDFN−6, 3 mm x 3 mm (Pb−Free)
3,000 / Tape & Reel
CAT6241−ADJHU2MUTAG
Adjustable
UDFN−8, 2 mm x 2 mm (Pb−Free)
3,000 / Tape & Reel
Device
9. The standard lead finish is Matte−Tin.
10. For additional package and temperature options, contact your nearest ON Semiconductor Sales office.
11. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
12. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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17
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAT6241/D