CLD-AP107 Rev 8 soldering & handling Cree® XLamp® XT Family LEDs Introduction Table of Contents This application note applies to XLamp® XT Family LEDs, which Handling XLamp® XT Family LEDs............................................... 2 have order codes in the following format. Circuit Board Preparation & Layouts............................................ 5 XTxxxx-xx-xxxx-xxxxxxxxx Notes on Soldering XLamp® XT Family LEDs.............................. 6 Case Temperature (Ts) Measurement Point................................ 5 Moisture Sensitivity...................................................................... 7 This application note explains how XLamp XT Family LEDs and XLamp XT Family LED Reflow Soldering Characteristics........... 8 assemblies containing these LEDs should be handled during Chemicals & Conformal Coatings................................................ 9 manufacturing. Please read the entire document to understand Assembly Storage & Handling.................................................... 10 how to properly handle XLamp XT Family LEDs. Tape and Reel.............................................................................. 11 www.cree.com/Xlamp Packaging & Labels.................................................................... 12 Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 XLamp ® XT Family LED Soldering & Handling Handling XLamp® XT Family LEDs Manual Handling Use tweezers to grab XLamp XT Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens. Do not apply more than 1000 g of shear force directly onto the lens. Excessive force on the lens could damage the LED. P CORRECT X WRONG Cree recommends the following at all times when handling XLamp XT Family LEDs or assemblies containing these LEDs: • Avoid putting mechanical stress on the LED lens. • Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED. • Cree recommends always handling XT family LEDs with appropriate ESD grounding. • Cree recommends handling XT family LEDs wearing clean, lint‑free gloves. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 2 CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. XLamp ® XT Family LED Soldering & Handling D -B- 2 A Handling XLamp® XT Family LEDs - Continued 6 5 5 4 4 3 3 2 Whenever possible, Cree recommends the use of one of the following pick & place tools to-Aremove XLamp XT Family LEDs from the REVISONS NOTICE CE PLOT AND THE INFORMATION CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND HE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT ON OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY RODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT WITHOUTTHE WRITTEN CONSENT OF CREE INC. factory tape & reel packaging. REV All dimensions in mm 5 0.8 Pick & Place Nozzle #1 D DESCRIPTION 0.2 4X -B- 0.8 10 C 0.01 0.01 2 A A R0.1 A 4 -A- 0 0.5 6 5 5 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION 0.8 CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT 0.8 REPRODUCED OR DISCLOSED TO ANY MAY NOT BE COPIED, 9 UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT 10 OF CREE INC. 0.2 4X 4 1.34 4X 5.6 10.8 ± .02 C 0.01 B 0.01 A D A 3.35 3.9 R0.1 SECTION A-A Pick & Place Nozzle #2 4 1.34 4X 0.5 A B C 0.439 6 DIMENSIONS ARE IN MM 5 4 3.06 120° Conical A SECTION A-A THIRD ANGLE PROJECTION B UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .01 .XXX ± .005 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± .06 .XX ± .03 .XXX ± .010 X° ± .5 ° SURFACE FINISH: 5 6 4 5 3 4 63 DATE DRAWN BY D. CRONIN CHECK 09/22/09 DATE -- -- APPROVED DATE TITLE --THIRD ANGLE PROJECTION MATERIAL CRS SIZE FINAL PROTECTIVE FINISH -2 SCALE C UNLESS OTH DIMENSIONS AND AFT TOLERANCE U .XX .XX X° VAC FOR SHEET M .X DRAWING N .XX .XX X° 5.000 SURFACE F 3 0.439 Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 3 XLamp ® XT Family LED Soldering & Handling Handling XLamp® XT Family LEDs7 - Continued 8 6 4 5 3 2 Rev.urethane. The following pick & place tool is specific to the XT Family LEDs The nozzle is implemented in THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED. 8 6 7 A 5 PRINT 4 RELEASE THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED. Pick & Place NozzleD #3 1 REVISIONS DESCRIPTION APPROVED DATE JDL 10/11/2011 2 3 REVISIONS DESCRIPTION Rev. A 1 APPROVED DATE JDL 10/11/2011 PRINT RELEASE D D A All dimensions in mm [in] A A A C C C 3.734 [0.147] 3.734 [0.147] 1.016 [0.040] B B 1.016 [0.040] B ITEM NO. SECTION A-A SECTION A-A A 3.302 [0.130] PART OR IDENTIFYING NO. NOMENCLATURE OR DESCRIPTION CAD GENERATED DRAWING, PART OR UPDATE DO NOT MANUALLY IDENTIFYING NO. ANGLES MATERIAL DRAWN 32 DO NOT SCALE 6 7 5 4 7 6 5 MATERIAL SPECIFICATION ANGLES A HEW Led and Tip FINISH REV. A MATERIAL QUAL ENG DRAWING 3 RESP ENG SCALE MFG ENG 2 SHEET and OF Tip HEW Led CAD FILE: 1 32 A Tuesday, October 11, 2011 1:16:44 PM 4 Q R DATE APPROVALS XX = <MOD-PM>.002 <MOD-PM>DRAWN 1/2<MOD-DEG> 10/11/2011 XXX = <MOD-PM>.001 MFG ENG CHECKED XXXX = <MOD-PM>.0002 SIZE DWG. NO. DO NOT SCALE DRAWING 8 NOMENCLATURE OR DESCRIPTION CAD GENERATED DRAWING, DO NOT MANUALLY UPDATE DECIMALS RESP ENG FINISH 8 QTY REQD PARTS LIST DATE APPROVALS XX = <MOD-PM>.002 UNLESS OTHERWISE SPECIFIED 3.302 <MOD-PM> 1/2<MOD-DEG> 10/11/2011 XXX = <MOD-PM>.001 DIMENSIONS ARE IN INCHES XXXX = <MOD-PM>.0002 TOLERANCES ARE: [0.130] DECIMALS CHECKED A MATERIAL SPECIFICATION PARTS LIST UNLESS OTHERWISE SPECIFIED ITEM DIMENSIONS ARE IN INCHES NO. TOLERANCES ARE: QUAL ENG 3 SIZE DWG. NO. SCALE 2 SHEET CAD FILE: 1 Tuesday, October 11, 2011 1:16:44 PM Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 4 O .83 .83 C XLamp ® XT Family LED Soldering & Handling 3.30 3.45 3.45 3.30 C Circuit Board Preparation & Layouts R1.53 .65 R1.53 .65 1.30 1.30 Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or soldering XLamp XT Family LEDs onto the PCB. PRIMARY PRIMARY The diagram below shows the recommended PCB solder pad layout for XLamp XT Family LEDs. All dimensions in mm .50 .50 B .50 .50 .50 .50 .64 .64 B 3.30 3.30 .25 .25 3.30 3.30 .75 .75 A A 3.30 1.01 1.30 1.30 1.01 3.30 ALLARE MEASUREMENTS ALL MEASUREMENTS ±0.13 mmARE U 2.30 2.30 3.30 3.30 DRAWN BY UNLESS OTHERWISE SPECIFIEDUNLESS OTHERWISE SPECIFIE D. CRONIN DIMENSIONS ARE IN DIMENSIONS ARE IN MILLIMETERSCHECK AND AFTER FINIS MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS -- SPECIFIE TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XX ± .25 APPROVED .XXX ± .12 .XXX ± .125 -X° ± .5 X° ± .5 ° THIRD ANGLE PROJECTION THIRD ANGLE PROJECTION METAL PARTS ON FOR SHEET METAL PARTS ONLYFOR SHEETMATERIAL .X ± 1.5 .X ± 1.5 .XX ± .75 .XX ± .75 .XXX ± .25 .XXX ± .25 FINAL PROTECTIVE FINISH X° ± .5 X° ± .5 ° 1.6 1.6 SURFACE FINISH: SURFACE FINISH: Stencil Pattern RECOMMENDED PATTERN RECOMMENDEDRecommended STENCIL PATTERN STENCIL AREAArea IS OPENING) (Shaded Is Open) (HATCHED AREA IS(HATCHED OPENING) Recommended PCB Solder Pad RECOMMENDED RECOMMENDED PCB SOLDER PAD PCB SOLDER PAD -- 6 5 Point Case Temperature (Ts) 6Measurement -- 5 4 4 3 3 2 XLamp XT Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This measurement point is shown in the picture below. It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XT Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 5 XLamp ® XT Family LED Soldering & Handling Notes on Soldering XLamp® XT Family LEDs Notes on Soldering XLamp XP Family LEDs XLamp XT Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB XLamp XPand Family LEDs designed to profile be reflow to a PCB. on a hotplate following theare reflow soldering listedsoldered on the previous page.Reflow soldering may be done by a reflow oven or by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page. XP LEDs. Family Do solder not hand solder XLamp XP Family LEDs. Do Do not not wavewave soldersolder XLampXLamp XT Family DoLEDs. not hand XLamp XT Family LEDs. PP CORRECT CORRECT X X WRONG P WRONG CORRECT CORRECT Solder Paste TypeType Solder Paste Cree strongly recommends using “no clean” solder paste with XLamp XT Family LEDs so that cleaning the PCB after reflow soldering is Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after not required. Cree uses Kester® R276 solder paste internally. reflow soldering is not required. Cree uses the following solder paste internally: Indium Corporation of America® Partcompositions: number 82676 Cree recommends the following solder paste SnAgCu (tin/silver/copper) and SnAg (tin/silver). • Sn62/Pb36/Ag2 composition • Flux: NC-SMQ92J Solder Paste Thickness recommends following solder compositions: and TheCree choice of solder and the the application methodpaste will dictate the specificSnPbAg, amount ofSnAgCu solder. For theSnAg. most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil Solder Paste (102-μm) bond line, Thickness i.e., the solder joint thickness after reflow soldering. The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 3-mil (75-μm) bond line. P P CORRECT CORRECT X X WRONG WRONG Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Copyright © 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo 6 Inc. Cree, 4600 Silicon Drive Durham, NC 27703 XLamp ® XT Family LED Soldering & Handling Notes on Soldering XLamp® XT Family LEDs (continued) After Soldering After soldering, allow XLamp XT Family LEDs to return to room temperature before subsequent handling. Premature handling of the device, especially around the lens, could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB. Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning. Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp XT-E LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 7 XLamp ® XT Family LED Soldering & Handling XLamp XT Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp XT Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak IPC/JEDEC J-STD-020C Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 8 XLamp ® XT Family LED Soldering & Handling Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Cleaning Solutions Cree has found the following chemicals to be safe to use with XT Family LEDs. • Water • Isopropyl alcohol (IPA) Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XT Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XT Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. • Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) • Methyl acetate or ethyl acetate (i.e., nail polish remover) • Cyanoacrylates (i.e., “Superglue”) • Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether) • Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive) Hermetically Sealing Luminaires For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically sealing LEDs in an enclosed space is not recommended. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 9 XLamp ® XT Family LED Soldering & Handling Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp XT Family LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XT Family LEDs should be stacked in a way to allow at least 1 cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp XT Family LEDs. Force from the bubble wrap can potentially damage the LED. P CORRECT P CORRECT X WRONG Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 10 REF REF 4.375 X SECTION Y-Y R Ao 4 2.2 ±0. 0 Po 4.0 ±0.1 (II) CATHODE SIDE Y 5 4.375 All dimensions in mm. E1 1.75 ±0.1 5 F(III) X 3.70 +/- 0.1 Bo Ko F 3.70 2.40 5.50 8.00 12.00 +/- 0.1 +0.0/-0.1 +/- 0.05 (I) 4 +/- 0.1 +0.0/-0.1 +/- 0.05 R REV Ao (III) B 4 REF 0.59 +/- 0.1 +0.3/-0.1 Measured from centerline of sprocket hole to centerline of pocket. 2 Cumulative tolerance of 10 sprocket holes is ± 0.20. REVISONS DESCRIPTION Measured from centerline of sprocket ADDED CATHODE AND ANODE NOTE REORIENTED DEVICE hole to centerline of pocket. Other material available. (II) 3 ANODE SIDE P1 2.2 8.00 12.00 P1 W +/0.1 5 REF 3.70 R0.2 6 Ao TYPICAL NOTICEBo 3.70 CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION Y Ko CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION D1 THIS PLOT2.40 KoOF CREE, INC. MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN 1.5 MIN. CONSENT SECTION OF Y-Y CREE INC. F 5.50 Ao P1 W W Bo X D Y D1 1.5 MIN. REF 1.5 P2 2.0 ±0.05 (I) SECTION X-X REF RE R0.2 TYPICAL Ko R0.2 TYPICAL Y Ko P1 All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. D1 1.5 MIN. SECTION Y-Y REF 0.59 Tape and Reel Do F(III) Bo XLamp ® XT Family LED Soldering & Handling Bo X T 0.30 ±0.05 4.375 (IV) 1 BY DATE DC 2/26/12 APP +/- 0.1 +0.3/-0.1 SECTION X-X 1.5± .1 User Feed Direction (I) Ao 3.70 +/- 0.1 END 3.70 +/- 0.1 2.40 +0.0/-0.1 6 5.50 +/- 0.05 NOTICE CREE CONFIDENTIAL. THIS PLOT AND 8.00THE INFORMATION P +/- 0.1 CONTAINED1WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CMAY NOTW 12.00OR DISCLOSED +0.3/-0.1 BE COPIED, REPRODUCED TO ANY Bo Ko F 5 4±.1 2.5±.1 1.75 ±.10 (II) CATHODE 4 12.0 +.3 -.0 ÓÉ Foxit PDF Editor ±à¼°æȨËùÓÐ (c) by Foxit Software Company, 2004 ½öÓÃÓÚÆÀ¹À¡£ UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE, INC. 1 ANODE SIDE Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) D Measured from centerline of sprocket hole to centerline of pocket. Cumulative tolerance of 10 sprocket SIDE START holes is ± 0.20. (III) Measured from centerline of sprocket hole to centerline of pocket. 3 2 (IV) Other material available. 8±.1 6 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT Ø190 OF CREE, INC. Leader 400mm (min.) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) Loaded Pockets (1000 Lamps) 5 4 D 3 2 ÓÉ Foxit PDF Editor ±à¼°æȨËùÓÐ (c) by Foxit Software Company, 2004 ½öÓÃÓÚÆÀ¹À¡£ 1 16.40 User Feed Direction D B C D Carrier Tape C 16.40 Pocket Tape Ø190 Ø61 ± 0.5 13mm OD 7" A C 7.5 C 12.40 +2.00 0 MEASURED AT HUB '' THIRD ANGLE PROJECTION B Ø13 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 Ø61 ± 0.5X° ± .5 ° SURFACE FINISH: 6 5 4 OD D. CRONIN CHECK 4600 Silicon Drive Durham, N.C 27703 11/29/10 DATE -- Phone (919) 313-5300 -- Fax (919) 313-5558 DATE APPROVED -- B TITLE -- XP HEW LOADING SPEC MATERIAL -- SIZE C FINAL PROTECTIVE FINISH -- 1.6 3 12.40 7.5 MEASURED AT INSIDE EDGE 12.40 +2.00 '' 0 MEASURED AT HUB DATE DRAWN BY SCALE 2402-00014 SHEET 3.000 2 1 B B UNLESS OTHERWISE SPECIFIED DRAWN BY DATE CHECK DATE APPROVED DATE 2012/5/25 LIUDEZHI ®ARE IN ® A DIMENSIONS Copyright © 2012-2016 Cree, Inc. Cree and XLamp are registered trademarks and the Cree logo is a trademark Ø13All rights reserved. The information in this document is subject to change without notice. MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This .X ± 0.3 A .XX ± .13 document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 4600 Silicon Drive Durham, N.C 27703 Phone (919) 361-4770 TITLE THIRD ANGLE PROJECTION 12.40 MEASURED AT INSIDE EDGE X° ± 1° FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 X° ± 2° Reel, MATERIAL PS SIZE FINAL PROTECTIVE FINISH SCALE C 1:2 11 7" x 12mm Wide DRAWING NO. 2400-00005 REV. B SHEET 1 OF 1 REV DRAWING NO. B OF 1 XLamp ® XT Family LED Soldering & Handling Packaging & Labels The diagrams below show the packaging and labels Cree uses to ship XLamp XT Family LEDs. XLamp XT Family LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Quantity, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 12