Die Datasheet GA20JT12-CAL Section VIII: SPICE Model Parameters This is a secure document. Please copy this code from the SPICE model PDF file on our website (http://www.genesicsemi.com/images/hit_sic/baredie/sjt/GA20JT12-CAL_SPICE.pdf) into LTSPICE (version 4) software for simulation of the GA20JT12-CAL. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 2.2 $ * $Date: 26-FEB-2016 $ * * GeneSiC Semiconductor Inc. * 43670 Trade Center Place Ste. 155 * Dulles, VA 20166 * * COPYRIGHT (C) 2016 GeneSiC Semiconductor Inc. * ALL RIGHTS RESERVED * * These models are provided "AS IS, WHERE IS, AND WITH NO WARRANTY * OF ANY KIND EITHER EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED * TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A * PARTICULAR PURPOSE." * Models accurate up to 2 times rated drain current. * .model GA20JT12 NPN + IS 9.833E-48 + ISE 1.073E-26 + EG 3.23 + BF 88 + BR 0.55 + IKF 5000 + NF 1 + NE 2 + RB 3.09 + IRB 0.006 + RBM 0.101 + RE 0.005 + RC 0.035 + CJC 910E-12 + VJC 3.2509 + MJC 0.51624 + CJE 2.77e-9 + VJE 2.896 + MJE 0.472 + XTI 3 + XTB -1.5 + TRC1 8.500E-3 + VCEO 1200 + ICRATING 20 + MFG GeneSiC_Semiconductor * * End of GA20JT12 SPICE Model Feb 2016 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-bare-die/ Pg 1 of 1