RR-AME8530 _rev. B Reliability Report for AME8530 Series Product Approved by Prepared by Amy Shen Quality & Reliability Dept. Manager Eric Chen Quality & Reliability Dept. Engineer Conclusion: The AME8530 series product has successfully met AME’s reliability standard that is required on all AME, Inc products. Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all AME8530 series product will still meet AME’s reliability standard in the future. Table of Contents: Ⅰ、General Description Ⅱ、Product Information Ⅲ、Failures In Time Calculation Ⅳ、Product Reliability Test Result Ⅴ、Package Reliability Test Result Ⅵ、IR-reflow Test Result Ⅰ、General Description: The AME8530 family allows the user to customize the CPU monitoring function without any external components. The user has a large choice of reset voltage thresholds and output driver configurations, all of which are preset at the factory. Each wafer is trimmed to the customer's specifications. These circuits will ignore fast negative going transients on VDD. The state of the reset output is guaranteed to be correct down to 1V. After VDD crosses above a factory-preset threshold, the AME8530 assert a reset signal. After a predetermined time (the “reset” interval) the reset is de-asserted. If VDD ever drops below the threshold voltage a reset is asserted immediately. The reset de-asserts after the reset interval, as explained earlier. The AME8530 can both assert a reset manually by pulling the MRB input to ground. Space saving SOT-25 packages and micropower quiescent current make this family a natural for portable battery powered equipment. Ⅱ、Product Information: Pin Configuration Operating Temperature Range A: E -40℃ to 1. Reset/R 85℃ esetB 2. GND 3. ResetB/ Reset/N C 4. MRB 5. VDD Num Package ber Type of Output Driver Option Pins E: V: 5 A: SOT-2X Pin1_RESETB/ PP Pin3_NC B: Pin1_RESETB/ OD Pin3_NC C: Pin1_RESET/ PP Pin3_NC D: Pin1_RESET/ OD Pin3_NC E: Pin1_RESETB/ PP Pin3_RESET/ PP F: Pin1_RESETB/ PP Pin3_RESET/ OD G: Pin1_RESETB/ OD Pin3_RESET/ PP H: Pin1_RESETB/ OD Pin3_RESET/ OD I: Pin1_RESET/ PP Pin3_RESETB/ PP J: Pin1_RESET/ PP Pin3_RESETB/ OD K: Pin1_RESET/ OD Pin3_RESETB/ PP L: Pin1_RESET/ OD Pin3_RESETB/ OD (Reset = Active High) (ResetB = Active Low) (PP = Push pull out) (OD = Open Drain output polarity) Reset Watch Time Dog (TD2NOM) Interval VIN Threshold Special Voltage (VTH) Feature F: TD= X: without 22:VTH= 210ms WDI option 2.19V L: Low profile Y: Lead free & 23:VTH= Low profile 2.32V Z: Lead free 26:VTH= 2.63V 29:VTH= 2.93V 31:VTH= 3.08V 44:VTH= 4.38V 46:VTH= 4.63V Ⅲ、Failures In Time Calculation: Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below: FIT = ( x 2 (ν , CL ) × 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 ) =106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level. Where AF is acceleration factor setting activation energy to 1.0eV as zero failure. Ⅳ、Product Reliability Test Result: Test Item HTOL Test Condition Precondition NOTE 1 Sample Size / Failures Result 77 pcs / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass TSTRESS=125℃ Duration=1000hrs Biased, Read at 168/504/1000 hours ESD Human Body Model Pin-to-Pin test Level 2, 2kV minimum ESD Machine Model Pin-to-Pin test Level 2, 200V minimum Latch-up Level 3, 100mA minimum NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅴ、Package Reliability Test Result: Test Item Test Condition Sample Size / Failures Result MSL 85/85 168 hours 22 pcs / 0 pcs Level 1 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 5 pcs / 0 pcs Pass IR-reflow 3 cycles Peak Temp.= 260℃ (lead-free) IPC/JEDEC J-STD-020C HTS Precondition NOTE 2 Temp.=150℃ Duration=1000 hours Unbiased, Read at 168/504/1000 hours THT Precondition NOTE 2 Temp.=85℃, R.H.=85% Duration=1000 hours Unbiased, Read at 168/504/1000 hours PCT Precondition NOTE 2 Temp.=121℃, R.H.=100% 15PSIG, Unbiased Duration=168 hours Read at 168 hours TCT Precondition NOTE 2 -65℃ ~ 150℃ 1000 cycles Unbiased, Read at 500/1000 cycles Solderability Temp.=245℃ (leaded) Temp.=260℃ (lead-free) Duration=5sec NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅵ、IR-reflow Test Result: Test Item Test Condition Sample Size / Failures Result IR-reflow See IR reflow Profile 22 pcs / 0 pcs Pass Perform 3 cycles test IR reflow Profile: Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (tsmin to tsmax) Time maintained above - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-Down Rate Time 25℃ to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3℃/second max. 3℃/second max. 100℃ 150℃ 60~120 seconds 150℃ 200℃ 60~180 seconds 183℃ 60~150 seconds 245℃ 217℃ 60~150 seconds 260℃ 10~30 seconds 20~40 seconds 6℃/second max. 6 minutes max. 6℃/second max. 8 minutes max.