AME8530

RR-AME8530 _rev. B
Reliability Report
for
AME8530 Series Product
Approved by
Prepared by
Amy Shen
Quality & Reliability Dept.
Manager
Eric Chen
Quality & Reliability Dept.
Engineer
Conclusion:
The AME8530 series product has successfully met AME’s reliability standard that is required on all
AME, Inc products.
Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all
AME8530 series product will still meet AME’s reliability standard in the future.
Table of Contents:
Ⅰ、General Description
Ⅱ、Product Information
Ⅲ、Failures In Time Calculation
Ⅳ、Product Reliability Test Result
Ⅴ、Package Reliability Test Result
Ⅵ、IR-reflow Test Result
Ⅰ、General Description:
The AME8530 family allows the user to customize the CPU monitoring function without any external
components. The user has a large choice of reset voltage thresholds and output driver configurations, all of
which are preset at the factory. Each wafer is trimmed to the customer's specifications.
These circuits will ignore fast negative going transients on VDD. The state of the reset output is
guaranteed to be correct down to 1V.
After VDD crosses above a factory-preset threshold, the AME8530 assert a reset signal. After a
predetermined time (the “reset” interval) the reset is de-asserted. If VDD ever drops below the threshold
voltage a reset is asserted immediately. The reset de-asserts after the reset interval, as explained earlier.
The AME8530 can both assert a reset manually by pulling the MRB input to ground.
Space saving SOT-25 packages and micropower quiescent current make this family a natural for
portable battery powered equipment.
Ⅱ、Product Information:
Pin
Configuration
Operating
Temperature
Range
A:
E -40℃ to
1. Reset/R 85℃
esetB
2. GND
3. ResetB/
Reset/N
C
4. MRB
5. VDD
Num
Package ber
Type
of
Output Driver
Option
Pins
E:
V: 5 A:
SOT-2X
Pin1_RESETB/ PP
Pin3_NC
B:
Pin1_RESETB/ OD
Pin3_NC
C:
Pin1_RESET/ PP
Pin3_NC
D:
Pin1_RESET/ OD
Pin3_NC
E:
Pin1_RESETB/ PP
Pin3_RESET/ PP
F:
Pin1_RESETB/ PP
Pin3_RESET/ OD
G:
Pin1_RESETB/ OD
Pin3_RESET/ PP
H:
Pin1_RESETB/ OD
Pin3_RESET/ OD
I:
Pin1_RESET/ PP
Pin3_RESETB/ PP
J:
Pin1_RESET/ PP
Pin3_RESETB/ OD
K:
Pin1_RESET/ OD
Pin3_RESETB/ PP
L:
Pin1_RESET/ OD
Pin3_RESETB/ OD
(Reset = Active High)
(ResetB = Active Low)
(PP = Push pull out)
(OD = Open Drain output polarity)
Reset
Watch
Time
Dog
(TD2NOM)
Interval
VIN Threshold
Special
Voltage (VTH)
Feature
F: TD=
X: without
22:VTH=
210ms
WDI option 2.19V
L: Low profile
Y: Lead free &
23:VTH=
Low profile
2.32V
Z: Lead free
26:VTH=
2.63V
29:VTH=
2.93V
31:VTH=
3.08V
44:VTH=
4.38V
46:VTH=
4.63V
Ⅲ、Failures In Time Calculation:
Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below:
FIT = ( x 2 (ν ,
CL )
× 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 )
=106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level.
Where AF is acceleration factor setting activation energy to 1.0eV as zero failure.
Ⅳ、Product Reliability Test Result:
Test Item
HTOL
Test Condition
Precondition
NOTE 1
Sample Size / Failures
Result
77 pcs / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
TSTRESS=125℃
Duration=1000hrs
Biased, Read at
168/504/1000 hours
ESD
Human Body Model
Pin-to-Pin test
Level 2, 2kV minimum
ESD
Machine Model
Pin-to-Pin test
Level 2, 200V minimum
Latch-up
Level 3, 100mA minimum
NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free).
Ⅴ、Package Reliability Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
MSL
85/85 168 hours
22 pcs / 0 pcs
Level 1
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
5 pcs / 0 pcs
Pass
IR-reflow 3 cycles
Peak Temp.= 260℃ (lead-free)
IPC/JEDEC J-STD-020C
HTS
Precondition NOTE 2
Temp.=150℃
Duration=1000 hours
Unbiased, Read at
168/504/1000 hours
THT
Precondition NOTE 2
Temp.=85℃, R.H.=85%
Duration=1000 hours
Unbiased, Read at
168/504/1000 hours
PCT
Precondition NOTE 2
Temp.=121℃, R.H.=100%
15PSIG, Unbiased
Duration=168 hours
Read at 168 hours
TCT
Precondition NOTE 2
-65℃ ~ 150℃
1000 cycles
Unbiased, Read at
500/1000 cycles
Solderability
Temp.=245℃ (leaded)
Temp.=260℃ (lead-free)
Duration=5sec
NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free).
Ⅵ、IR-reflow Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
IR-reflow
See IR reflow Profile
22 pcs / 0 pcs
Pass
Perform 3 cycles test
IR reflow Profile:
Profile Feature
Average Ramp-Up Rate
(Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (tsmin to tsmax)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5℃ of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3℃/second max.
3℃/second max.
100℃
150℃
60~120 seconds
150℃
200℃
60~180 seconds
183℃
60~150 seconds
245℃
217℃
60~150 seconds
260℃
10~30 seconds
20~40 seconds
6℃/second max.
6 minutes max.
6℃/second max.
8 minutes max.