REL-1109 -A-A Reliability Report for AME8830 Series Product Approved by Prepared by Amy Shen Quality & Reliability Dept. Manager Eric Chen Quality & Reliability Dept. Engineer Conclusion: The AME8830 series product has successfully met AME’s reliability standard that is required on all AME, Inc products. Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all AME8830 series product will still meet AME’s reliability standard in the future. Table of Contents: Ⅰ、General Description Ⅱ、Product Information Ⅲ、Failures In Time Calculation Ⅳ、Product Reliability Test Result Ⅴ、Package Reliability Test Result Ⅵ、IR-reflow Test Result Ⅰ、General Description: The AME8830 is designed for portable and wireless application with low dropout voltage and optimized performance for battery powered systems to deliver ultra low noise. The space-saving SOT-25 package is attractive for “Pocket” and “Hand-Held” applications. The AME8830 is stable with a small 1µF output capacitor. In applications requiring a low noise without slowing down the load transient response, place a 0.01µF capacitor between Bypass and Ground. Ⅱ、Product Information: Pin Operating Ambient Package Configuration Temperature Range Type A: SOT-25 E:-40℃ to 85℃ E: SOT-2X 1. IN 2. GND 3. EN 4. BYP 5. OUT Number of Pins V: 5 Output Voltage Special Feature1 250: V=2.5V Y: Lead free & Low profile Z: Lead free 285: V=2.85V 300: V=3.0V 330: V=3.3V Ⅲ、Failures In Time Calculation: Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below: FIT = ( x 2 (ν , CL ) × 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 ) =106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level. Where AF is acceleration factor setting activation energy to 1.0eV as zero failure. Ⅳ、Product Reliability Test Result: Test Item HTOL Test Condition Precondition NOTE 1 Sample Size / Failures Result 77 pcs / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass TSTRESS=125℃ Duration=1000hrs Biased, Read at 168/504/1000 hours ESD Human Body Model Pin-to-Pin test Level 2, 2kV minimum Machine Model Pin-to-Pin test Level 2, 200V minimum Latch-up Level 3, 100mA minimum NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅴ、Package Reliability Test Result: Test Item Test Condition Sample Size / Failures Result MSL 85/85 168 hours 22 pcs / 0 pcs Level 1 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 5 pcs / 0 pcs Pass IR-reflow 3 cycles Peak Temp.= 260℃ (lead-free) IPC/JEDEC J-STD-020C HTS Precondition NOTE 2 Temp.=150℃ Duration=1000 hours Unbiased, Read at 168/504/1000 hours THT Precondition NOTE 2 Temp.=85℃, R.H.=85% Duration=1000 hours Unbiased, Read at 168/504/1000 hours PCT Precondition NOTE 2 Temp.=121℃, R.H.=100% 15PSIG, Unbiased Duration=168 hours Read at 168 hours TCT Precondition NOTE 2 -65℃ ~ 150℃ 1000 cycles Unbiased, Read at 500/1000 cycles Solderability Temp.=245℃ (leaded) Temp.=260℃ (lead-free) Duration=5sec NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅵ、IR-reflow Test Result: Test Item Test Condition Sample Size / Failures Result IR-reflow See IR reflow Profile 22 pcs / 0 pcs Pass Perform 3 cycles test IR reflow Profile: Profile Feature Average Ramp-Up Rate (Tsmax to Tp) - Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-Down Rate Time 25℃ to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3℃/second max. 3℃/second max. 100℃ 150℃ 60~120 seconds 150℃ 200℃ 60~180 seconds 183℃ 60~150 seconds 217℃ 60~150 seconds 245℃ 260℃ 10~30 seconds 20~40 seconds 6℃/second max. 6 minutes max. 6℃/second max. 8 minutes max.