REL-1049 -F-A Reliability Report for AME5145 Series Product Approved by Prepared by Amy Shen Quality & Reliability Dept. Manager Eric Chen Quality & Reliability Dept. Engineer Conclusion: The AME5145 series product has successfully met AME’s reliability standard that is required on all AME, Inc products. Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all AME5145 series product will still meet AME’s reliability standard in the future. Table of Contents: Ⅰ、General Description Ⅱ、Product Information Ⅲ、Failures In Time Calculation Ⅳ、Product Reliability Test Result Ⅴ、Package Reliability Test Result Ⅵ、IR-reflow Test Result Ⅰ、General Description: The AME5145 switching regulator is current-mode boost converters operating at fixed frequency of 1.6 MHz. The use of SOT-25/TSOT-25, DFN-8(3mmx3mmx0.75mm) & MSOP-8 packages, made possible by the minimal power loss of the internal 1.8A switch, and use of small inductor and capacitors result in the industry's highest power density. The 30V internal switch makes these solutions perfect for boosting to voltages up to 30V. These parts have a logic-level shutdown pin that can be used to reduce quiescent current and extend battery life. Protection is provided through cycle-by-cycle current limiting and thermal shutdown. Internal compensation simplifies and reduces component count. Ⅱ、Product Information: Operating Pin Out Ambient Package Configuration Temperature Type Range A: SOT-25 TSOT-25 1. SW 2. GND 3. FB 4. EN 5. IN A: DFN-8 1. NC 2. FB 3. NC 4. SW 5. NC 6. IN 7. EN 8. NC A: MSOP-8 1. IN 2. EN 3. GND 4. FB 5. SW 6. SW 7. GND 8. GND A: SOT-25 1. Vout 2. Vdd 3. Vss 4. NC 5. NC E:-40℃ to 85℃ E: SOT-2X V: DFN Q: MSOP Numb er of Output Voltage Pins V: 5 A: 8 ADJ: Adjustable Special Special Feature2 Feature1 (For DFN package only) Y: Lead free & 3: 3x3x0.75(mm) (LxWxH) Low profile Z: Lead free Ⅲ、Failures In Time Calculation: Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below: FIT = ( x 2 (ν , CL ) × 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 ) =106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level. Where AF is acceleration factor setting activation energy to 1.0eV as zero failure. Ⅳ、Product Reliability Test Result: Test Item HTOL Test Condition Precondition NOTE 1 Sample Size / Failures Result 77 pcs / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs package pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass TSTRESS=125℃ Duration=1000hrs Biased, Read at 168/504/1000 hours ESD Human Body Model Pin-to-Pin test Level 2, 2kV minimum Machine Model Pin-to-Pin test Level 2, 200V minimum Charged Device Model Level 2, 200V minimum Latch-up Level 3, 100mA minimum NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅴ、Package Reliability Test Result: Test Item Test Condition Sample Size / Failures Result MSL 85/85 168 hours 22 pcs / 0 pcs Level 1 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 5 pcs / 0 pcs Pass IR-reflow 3 cycles Peak Temp.= 260℃ (lead-free) IPC/JEDEC J-STD-020C HTS Precondition NOTE 2 Temp.=150℃ Duration=1000 hours Unbiased, Read at 168/504/1000 hours THT Precondition NOTE 2 Temp.=85℃, R.H.=85% Duration=1000 hours Unbiased, Read at 168/504/1000 hours PCT Precondition NOTE 2 Temp.=121℃, R.H.=100% 15PSIG, Unbiased Duration=168 hours Read at 168 hours TCT Precondition NOTE 2 -65℃ ~ 150℃ 1000 cycles Unbiased, Read at 500/1000 cycles Solderability Temp.=245℃ (leaded) Temp.=260℃ (lead-free) Duration=5sec NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅵ、IR-reflow Test Result: Test Item Test Condition Sample Size / Failures Result IR-reflow See IR reflow Profile 22 pcs / 0 pcs Pass Perform 3 cycles test IR reflow Profile: Profile Feature Average Ramp-Up Rate (Tsmax to Tp) - Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-Down Rate Time 25℃ to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3℃/second max. 3℃/second max. 100℃ 150℃ 60~120 seconds 150℃ 200℃ 60~180 seconds 183℃ 60~150 seconds 217℃ 60~150 seconds 245℃ 260℃ 10~30 seconds 20~40 seconds 6℃/second max. 6 minutes max. 6℃/second max. 8 minutes max.