CML Package Styles

Integrated Circuits
Package Information
Tape and Reel Information
A separate 'Tape and Reel' document is also available from the CML website
Publication No: //Dastardly/publications/PACKAGES/Packs.indd
- Issue 18 - April2016
1
CML Microcircuits Package Information
2
CML CERAMIC PACKAGE STYLES
ENG
16-pin Ceramic DIL.0.3" pitch
(CER1)
(CML)
16-pin Ceramic DIL.0.6" pitch
(CER2)
(CML)
24-pin Ceramic DIL.0.6" pitch
(CER3)
(CML)
44-Lead LCC Package
(LCC1)
(CML)
28-pin Ceramic DIL.0.6" pitch
(CER4)
(CML)
40-pin Ceramic DIL.0.6" pitch
(CER5)
(CML)
68-Lead J Bend Package
(CML)
44-Lead J Bend Package
(CML)
Notes
Past CML / MX-COM Package variations
Old CML
Current CMX
Old MX-COM
Legend
Cerdip - ceramic dual-in-line
CLCC - ceramic leaded chip carrier
DIL - dual-in-line
LQFP - low-profile quad flat pack
PDIP - plastic dual-in-line
PLCC - plastic leaded chip carrier
SSOP - shrunk small-outline package
SOIC - small-outline integrated circuit
TQFP - thin quad flat pack
TSSOP - thin shrunk small-outline package
VQFN - very-thin quad flat pack
Note: For the purposes of this document, the physical IC connection descriptions of 'lead', 'leadless' and 'pin', etc.
are represented by the single term of 'pin'.
3
CML Microcircuits Package Information ......
28-Pin SOIC, DW (D1)
DIM.
A
*
*
B
ALTERNATIVE
PIN
LOCATION
MARKING
E
W
L
T
PIN 1
X
Y
C
K1
H
K
P
J
A
B
C
E
F
H
J
K
K1
L
P
T
W
X
Y
TYP.
MIN.
MAX.
0.697 (17.70)
0.711 (18.06)
0.286 (7.26)
0.299 (7.59)
0.088 (2.24)
0.105 (2.67)
0.390 (9.90)
0.419 (10.64)
0.650 (16.51)
0.003 (0.08)
0.020 (0.51)
0.018 (0.46)
0.013 (0.33)
0.041 (1.04)
0.041 (1.04)
0.050 (1.27)
0.016 (0.41)
0.050 (1.27)
0.0125 (0.32)
0.009 (0.23)
45°
0°
10°
7°
NOTE :
F
*
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
Co-Planarity of leads within 0.004” (0.1mm)
24-Pin SOIC, DW
(D2)
DIM.
A
*
*
B
ALTERNATIVE
PIN
LOCATION
MARKING
E
W
L
T
PIN 1
X
Y
C K
K1
H
P
J
F
A
B
C
E
F
H
J
K
K1
L
P
T
W
X
Y
TYP.
MIN.
MAX.
0.613 (15.57)
0.597 (15.16)
0.286 (7.26)
0.299 (7.59)
0.093 (2.36)
0.105 (2.67)
0.390 (9.90)
0.419 (10.64)
0.550 (14.1)
0.003 (0.08)
0.020 (0.51)
0.020 (0.51)
0.013 (0.33)
0.041 (1.04)
0.041 (1.04)
0.050 (1.27)
0.016 (0.41)
0.050 (1.27)
0.0125 (0.32)
0.009 (0.23)
45°
10°
0°
7°
NOTE :
*
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
Co-Planarity of leads within 0.004” (0.1mm)
4
CML Microcircuits Package Information ......
20-Pin SOIC, DW (D3)
DIM.
A
*
*
B
ALTERNATIVE
PIN
LOCATION
MARKING
E
W
L
T
PIN 1
X
Y
K
C
K1
P
J
H
F
A
B
C
E
F
H
J
K
K1
L
P
T
W
X
Y
TYP.
MIN.
MAX.
0.495 (12.57)
0.510 (12.95)
0.286 (7.26)
0.299 (7.59)
0.088 (2.24)
0.105 (2.67)
0.390 (9.90)
0.419 (10.64)
0.450 (11.43)
0.003 (0.08)
0.020 (0.51)
0.020 (0.51)
0.013 (0.33)
0.041 (1.04)
0.041 (1.04)
0.050 (1.27)
0.016 (0.41)
0.050 (1.27)
0.0125 (0.32)
0.009 (0.23)
45°
10°
0°
7°
NOTE :
*
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
Co-Planarity of leads within 0.004” (0.1mm)
16-Pin SOIC, DW (D4)
DIM.
MIN.
TYP.
MAX.
A
*
*
ALTERNATIVE
PIN
LOCATION
MARKING
B
E
W
L
T
PIN 1
X
Y
C
K1
H
K
P
J
F
A
B
C
E
F
H
J
K
K1
L
P
T
W
X
Y
0.395 (10.03)
0.413 (10.49)
0.286 (7.26)
0.299 (7.59)
0.088 (2.24)
0.105 (2.67)
0.390 (9.90)
0.419 (10.64)
0.350 (8.89)
0.003 (0.08)
0.020 (0.51)
0.020 (0.51)
0.013 (0.33)
0.041 (1.04)
0.041 (1.04)
0.050 (1.27)
0.016 (0.41)
0.050 (1.27)
0.0125 (0.32)
0.009 (0.23)
45°
10°
0°
7°
NOTE :
*
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
Co-Planarity of leads within 0.004” (0.1mm)
5
CML Microcircuits Package Information ......
24-Pin SSOP
(D5)
A
Z
*
*
E
B
L
T
PIN 1
X
Y
H
P
J
DIM.
MIN.
A
B
C
E
F
H
J
L
P
T
X
Y
Z
7.90
5.00
1.67
7.40
TYP.
MAX.
8.50
5.60
2.00
8.20
7.15
0.21
0.38
0.05
0.22
0.55
0.95
0.65
0.25
8°
0.09
0°
7°
9°
4°
12°
NOTE :
C
*
F
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
Co-Planarity of leads within 0.1mm
28-Pin SSOP
(D6)
A
Z
E
B
ALTERNATIVE
PIN
LOCATION
MARKING
*
*
L
T
PIN 1
X
Y
H
P
J
DIM.
MIN.
A
B
C
E
F
H
J
L
P
T
X
Y
Z
9.90
5.00
1.67
7.40
TYP.
MAX.
10.50
5.60
2.00
8.20
8.45
0.05
0.22
0.55
0.21
0.38
0.95
0.65
0.09
0°
0.25
8°
7°
9°
4°
12°
NOTE :
C
*
F
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
Co-Planarity of leads within 0.1mm
6
CML Microcircuits Package Information ......
28-Pin TSSOP
(E1)
A
*
*
E
B
L
T
PIN 1
X
Y
C
J
H
F
MIN.
A
B
C
E
F
H
J
L
P
T
X
Y
9.60
4.30
-------6.20
TYP.
MAX.
9.80
4.50
1.20
6.60
8.45
0.05
0.17
0.45
0.15
0.30
0.75
0.65
0.08
0°
0.20
8°
12°
NOTE :
*
P
A & B are reference data and do not
include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
24-Pin TSSOP
(E2)
A
*
*
E
B
L
T
PIN 1
X
Y
C
H
DIM.
J
F
DIM.
MIN.
A
B
C
E
F
H
J
L
P
T
X
Y
7.70
4.30
-------6.20
TYP.
MAX.
7.90
4.50
1.20
6.60
7.15
0.15
0.30
0.75
0.05
0.17
0.45
0.65
0.20
8°
0.08
0°
12°
NOTE :
*
P
A & B are reference data and do not
include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
7
CML Microcircuits Package Information ......
20-Pin TSSOP
(E3)
DIM.
A
*
*
E
B
L
T
PIN 1
X
Y
C
J
H
F
TYP.
MAX.
6.60
4.50
1.20
6.60
6.40
4.30
-------6.20
5.85
0.15
0.30
0.75
0.05
0.17
0.45
0.65
0.20
8°
0.08
0°
12°
NOTE :
*
P
A & B are reference data and do not
include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
16-Pin TSSOP
(E4)
A
*
*
E
B
L
T
PIN 1
X
Y
C
H
A
B
C
E
F
H
J
L
P
T
X
Y
MIN.
J
F
DIM.
MIN.
A
B
C
E
F
H
J
L
P
T
X
Y
4.90
4.30
-------6.20
TYP.
MAX.
5.10
4.50
1.20
6.60
4.55
0.15
0.30
0.75
0.05
0.17
0.45
0.65
0.20
8°
0.08
0°
12°
NOTE :
*
P
A & B are reference data and do not
include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
8
CML Microcircuits Package Information ......
24-Pin PLCC; LG
(L1)
D
A
C
P
B
J
ID EN T
K
L
X
W
E1
G E
F
(PIN 1)
D IM .
M IN . TYP. M AX.
0.390 (9.91)
0.404 (10.26)
A
* B 0.390 (9.91)
0.404 (10.26)
* C
0.098 (2.49)
0.616 (15.65)
D
0.616 (15.65)
E
0.524 (13.31)
E1
0.250 (6.35)
F
0.250 (6.35)
G
0.004 (0.10)
H
0.022 (0.56)
0.018 (0.46)
J
0.055 (1.40)
0.045 (1.14)
K
0.033 (0.84)
K1
0.031 (0.80)
0.039 (1.00)
L
0.049 (1.24)
0.051 (1.30)
P
0.006 (0.15)
0.009 (0.23)
T
45°
W
6°
X
6°
Z
T
K1
H
*
Z
N O TE :
A & B are reference datum 's and do
notinclude m old deflash orprotrusions.
Alldim ensions in inches (m m .)
Angles are in degrees
24-Pin PLCC; LS
(L2)
C
E
B
K
Y
DA
J E1
W
W
H
T
PIN 1
K1
P
G
F
DIM.
* BA
* C
D
E
E1
F
G
H
J
K
K1
P
T
W
Y
*
MIN.
TYP.
MAX.
0.409 (10.40)
0.382 (9.70)
0.409 (10.40)
0.382 (9.70)
0.128 (3.25)
0.146 (3.70)
0.435 (11.05)
0.417 (10.59)
0.417 (10.59)
0.435 (11.05)
0.366 (9.30)
0.250 (6.35)
0.250 (6.35)
0.023 (0.58)
0.018 (0.46)
0.022 (0.56)
0.048 (1.22)
0.059 (1.50)
0.049 (1.24)
0.051 (1.30)
0.006 (0.15)
0.009 (0.23)
60°
30°
6°
NOTE :
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
9
48-Pin LQFP
(L4)
D
IDENT
C
A
(PIN 1)
DIM.
*
*
P
B
E
J
MAX.
7.11
7.11
1.60
9.25
9.25
0.15
0.28
0.76
6.91
A
B
C
D
E
H
J
L
P
T
X
Y
6.91
1.40
8.74
8.74
0.05
0.10
0.35
0.50
0.13
0°
11°
7°
13°
NOTE :
Y
*
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
Co-Planarity of leads within 0.1mm
T
H
X
TYP.
MIN.
L
CML Microcircuits Package Information ......
44-Pin PLCC; LH
(L6)
C
D
K
A
N
Y
J
IDENT
*
*
B E
J1
W
PIN 1
H
T
M
P
G
TYP.
DIM.
MIN.
A
B
C
D
E
F
G
H
J
J1
K
M
N
P
T
W
Y
0.650 (16.51)
0.650 (16.51)
MAX.
0.656 (16.66)
0.656 (16.66)
0.180 (4.57)
0.695 (17.65)
0.695 (17.65)
0.685 (17.40)
0.685 (17.40)
0.500 (12.7)
0.500 (12.7)
0.020 (0.51)
0.021 (0.53)
0.013 (0.33)
0.029 (0.74)
0.070 (1.78)
0.062 (1.57)
0.062 (1.57)
0.050 (1.27)
0.010 (0.25)
0.30 (7.62) x 45°
7°
NOTE :
*
F
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
10
44-Pin LQFP; L7
D
C
A
MIN.
A
B
C
D
E
H
J
L
P
T
X
Y
9.90
9.90
1.40
11.80
11.80
*
*
P
E
B
DIM.
J
(PIN 1)
IDENT
Y
MAX.
0.04
10.11
10.11
1.60
12.20
12.20
0.16
0.24
0.40
0.45
0.75
0.80
0.20
7°
14°
0.09
0°
10°
NOTE :
*
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles in degrees
T
Co-Planarity of leads within 0.1mm
H
X
TYP.
L
CML Microcircuits Package Information ......
100-Pin LQFP; L8
D
A
75
76
51
50
*
*
B E
100
1
26
25
IDENT
(PIN 1)
DIM.
MIN.
A
B
C
D
E
H
J
L
M
P
T
X
13.8
13.8
1.40
15.8
15.8
0.05
0.17
0.45
TYP.
MAX.
14.2
14.2
1.60
16.2
16.2
0.15
0.27
0.75
1.00
0.50
0.09
0.20
0°
7°
NOTES : All dimensions in mm
M
J
P
C
Angles in degrees
*
Each lead centerline is located
within 0.08 mm of its true position
(T.P.) at maximum material condition
T
X
A & B are reference data and do
not include mold deflash or protrusions.
H
Co-Planarity of leads within 0.1mm
L
11
64-Pin LQFP; L9
D
C
A
DIM.
*
*
P
B
E
J
(PIN 1)
TYP.
9.80
MAX.
10.20
10.20
1.60
12.20
12.20
0.15
0.27
0.75
9.80
1.40
11.80
11.80
0.05
0.17
0.45
0.50
0.09
0°
11°
0.20
7°
13°
NOTE :
Y
*
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
Co-Planarity of leads within 0.1mm
T
X
A
B
C
D
E
H
J
L
P
T
X
Y
MIN.
H
L
CML Microcircuits Package Information ......
8-Pin PDIP; P
(P1)
A
B
PIN 1
J1
Z
E
Y
T
M
K
H
L
E1
K1 C
P
J
D IM .
M IN . TYP. M AX.
0.346 (8.790)
0.400 (10.16)
A
* B 0.240 (6.10)
0.260 (6.60)
* C 0.145 (3.68)
0.200 (5.08)
0.390 (9.91).
E 0.300 (7.62)
0.325 (8.25)
E1 0.290 (7.37)
0.30 (7.62)
F
0.030 (0.76)
H
0.023 (0.58)
J 0.015 (0.38)
0.065 (1.65)
J1 0.045 (1.14)
0.062 (1.58)
K
0.062 (1.58)
K1
0.150 (3.81)
L 0.121 (3.07)
0.029 (0.74)
M
0.100 (2.54)
P
T 0.008 (0.20)
0.015 (0.38)
7°
Y
Z
5°
N O TE :
F
e reference datum 's and do
* Anot& iBnclarude
m old deflash orprotrusions.
Alldim ensions in inches (m m .)
Angles are in degrees
12
CML Microcircuits Package Information ......
16-Pin PDIP; P
(P3)
DIM.
A
* AB
*C
Z
B
E1
E
E
E1
F
H
J
J1
K
K1
L
M
P
T
Y
Z
Y
T
M
PIN 1
K
K1
H
L
J
J1
C
P
F
MIN.
TYP.
MAX.
0.740 (18.80)
0.810 (20.57)
0.240 (6.10)
0.262 (6.65)
0.127 (3.23)
0.200 (5.08)
0.300 (7.62)
0.390 (9.91).
0.290 (7.37)
0.325 (8.26)
0.70 (17.78)
0.015 (0.38)
0.015 (0.38)
0.040 (1.02)
0.040 (1.02)
0.023 (0.58)
0.065 (1.65)
0.056 (1.42)
0.064 (1.63)
0.056 (1.42)
0.064 (1.63)
0.121 (3.07)
0.150 (3.81)
0.028 (0.71)
0.100 (2.54)
0.008 (0.20)
0.015 (0.38)
7°
5°
NOTE :
*
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
24-Pin PDIP; P
(P4)
A
DIM.
Z
B
E
E1
*A
* BC
E
E1
F
H
J
J1
K
K1
L
M
P
T
Y
Z
Y
PIN1
T
M
K
H
L
K1 C
J
J1
P
F
MIN.
TYP.
MAX.
1.200 (30.48)
1.270 (32.26)
0.500 (12.70)
0.555 (14.10)
0.142(3.61)
0.220 (5.59)
0.600 (15.24)
0.670 (17.02)
0.590 (14.99)
0.625 (15.88)
1.10 (27.94)
0.015 (0.38)
0.045 (1.14)
0.015 (0.38)
0.023 (0.58)
0.040 (1.02)
0.065 (1.65)
0.066 (1.68)
0.074 (1.88)
0.060 (1.52)
0.074 (1.88)
0.121 (3.07)
0.160 (4.06)
0.180 (4.58)
0.100 (2.54)
0.008 (0.20)
0.015 (0.38)
7°
4°
NOTE :
*
A & B are reference datum's and do
not include mold deflash or protrusions.
All dimensions in inches (mm.)
Angles are in degrees
13
CML Microcircuits Package Information ......
64-Pin VQFN
(Q1)
A
Index Area 1
DIM.
C
*
*
P
B
J
Top View
J
0.80
7.00
7.00
0.00
0.18
0.20
0.30
0
9.00 BSC
0.90
1.00
7.80
7.80
0.05
0.30
0.25
0.50
0.15
0.40
0.50
0.20
NOTE :
A & B are reference data and do
not include mold deflash or protrusions.
*
K
All dimensions in mm
Angles are in degrees
Exposed
G
Metal Pad
H
MAX.
9.00 BSC
A
B
C
F
G
H
J
K
L
L1
P
T
F
C
TYP.
MIN.
Index Area 1
T
Index Area 2
L L1
Pin1
Dot
Dot
Index Area 2
Bottom View
Chamfer
Index Area 1 is located directly above Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
56-Pin VQFN
(Q2)
Index Area 1
A
DIM.
C
*
*
P
B
J
Top View
J
K
*
H
Exposed G
Metal Pad
T
0.80
4.25
4.25
0.00
0.18
0.20
0.30
0
MAX.
8.00 BSC
0.90
0.25
1.00
6.25
6.25
0.05
0.30
0.50
0.15
0.40
0.50
0.20
NOTE :
A & B are reference data and do
not include mold deflash or protrusions.
Index Area 1
L
Pin1
TYP.
8.00 BSC
All dimensions in mm
Angles are in degrees
F
C
MIN.
A
B
C
F
G
H
J
K
L
L1
P
T
Index Area 2
L1
Dot
Dot
Chamfer
Bottom View
Index Area 1 is located directly above Index Area 2
Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
14
CML Microcircuits Package Information ......
48-Pin VQFN
(Q3)
Index Area 1
A
DIM.
C
*
*
P
B
J
Top View
0.80
4.60
4.60
0.00
0.18
0.20
0.30
0
7.00 BSC
0.90
1.00
5.65
5.65
0.05
0.30
0.25
0.50
0.15
0.40
0.50
0.20
NOTE :
K
A & B are reference data and do
not include mold deflash or protrusions.
*
F
All dimensions in mm
Angles are in degrees
Exposed
Metal Pad G
H
MAX.
7.00 BSC
A
B
C
F
G
H
J
K
L
L1
P
T
J
C
TYP.
MIN.
Index Area 1
T
Index Area 2
L L1
Pin1
Dot
Dot
Chamfer
Bottom View
Index Area 1 is located directly above Index Area 2
Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
40-Pin VQFN
(Q4)
Index Area 1
A
C
*
*
P
B
J
Top View
J
H
MIN.
A
B
C
F
G
H
J
K
L
L1
P
T
0.80
2.75
2.75
0.00
0.18
0.20
0.30
0
TYP.
MAX.
6.00 BSC
6.00 BSC
0.90
0.25
1.00
4.30
4.30
0.05
0.30
0.50
0.15
0.40
0.50
0.20
NOTE :
K
F
C
DIM.
Index Area 1
L
Pin1
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
Exposed
Metal Pad G
T
*
L1
Dot
Index Area 2 Bottom View
Index Area 2
Dot
Chamfer
Index Area 1 is located directly above Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
15
CML Microcircuits Package Information ......
32-Pin VQFN
(Q5)
A
Index Area 1
C
*
*
P
B
J
Top View
DIM.
MIN.
A
B
C
F
G
H
J
K
L
L1
P
T
0.80
3.00
3.00
0.00
0.18
0.20
0.30
0
TYP.
MAX.
5.00 BSC
5.00 BSC
0.90
1.00
3.80
3.80
0.05
0.30
0.25
0.55
0.15
0.50
0.20
J
K
NOTE :
*
F
Exposed
Metal Pad G
C
H
TPin1
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
L
Index Area 1
Index Area 2
L1
Index Area 2
Dot
Dot
Bottom View
Chamfer
Index Area 1 is located directly above Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
24-Pin VQFN
(Q6)
C
A
Index Area 1
DIM.
*
*
P
B
J
Top View
A
B
C
F
G
H
J
K
L
L1
P
T
MIN.
TYP.
MAX.
4.00 BSC
0.80
2.55
2.55
0.00
0.18
0.20
0.25
0
4.00 BSC
0.90
0.25
1.00
2.80
2.80
0.05
0.30
0.50
0.15
0.50
0.20
J
K
C
NOTE :
*
F
H
T
Exposed
Metal Pad G
Pin1
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
L
L1
Index Area 1
Index Area 2
Dot
Chamfer
Dot
Bottom View
Index Area 2
Index Area 1 is located directly above Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
16
CML Microcircuits Package Information ......
16-Pin VQFN
(Q7)
DIM.
*
*
MIN.
A
B
C
F
G
H
J
K
L
L1
P
T
TYP.
MAX.
4.00 BSC
0.80
2.55
2.55
0.00
0.25
0.20
4.00 BSC
0.90
1.00
2.80
2.80
0.05
0.35
0.30
0.50
0.15
0.30
0
0.65
0.20
NOTE :
A & B are reference data and do
not include mold deflash or protrusions.
E xposed
Metal P ad
Al l dimensions in m m
Angl es ar e in degr ees
In de x Area 1
Dot
Index Area 2
Dot
Chamfer
Index A rea 1 i s located directly above Ind ex Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
\\Dastardly\Publications\PACKAGES\packs.indd
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