TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA3.3 Series SRDA3.3 Series 8pF 35A Diode Array RoHS Pb GREEN The SRDA3.3 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect I/O pins against ESD and lightning induced surge events. This device can safely absorb up to 35A per IEC61000-4-5 (tp=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard. Its low loading capacitance makes it ideal for high-speed interfaceprotection. Pinout Features I/O 1 1 8 Ref 2 Ref 1 2 7 I/O 4 • Low clamping voltage • Lightning protection, IEC61000-4-5, 35A (8/20μs) Ref 1 3 6 I/O 3 • EFT, IEC61000-4-4, 50A (5/50ns) I/O 2 4 5 Ref 2 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Low leakage current • SOIC-8 surface mount package (JEDEC MS-012) SOIC-8 (Top View) Note: Pinout diagrams above shown as device footprint on circuit board. Functional Block Diagram I/O 1 Ref 1 Applications • Video Line Protection • Tertiary (IC Side) Protection: I/O 2 • Security Cameras - T1/E1/T3/E3 • Storage DVRs - HDSL/SDSL • Network Equipment - Ethernet • Instrumentation, Medical Equipment • RS232, RS485 Application Example I/O 4 Ref 2 I/O 3 R Tip R Ring 8 T1/E1/ T 3 / E 3 Transceiver 5 SRDA3.3-4 1 4 T Tip Life Support Note: T Ring Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. T1/E1/T3/E3 Interface Protection 1 Revision: June 14, 2013 SRDA3.3 Series SRDA3.3 Description TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA3.3 Series Symbol Ppk Parameter Ipp Peak Pulse Current (8/20μs) Top Operating Temperature TSTOR Storage Temperature Parameter Rating Units 170 °C/W A Operating Temperature Range -40 to 125 °C °C Storage Temperature Range -55 to 150 °C °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 °C Value Units 600 W SOIC Package 35 -40 to 125 Peak Pulse Power (8/20μs) -55 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VRWM IT≤1μA - - 3.3 V Reverse Breakdown Voltage VBR IT =2uA 3.5 - - V Snap Back Voltage VSB IT=50mA 2.9 - - V IR VR= 3.3V - - 1 μA Clamping Voltage, Line-Ground1 VC IPP= 1A, tp=8/20 μs - 5.7 - V 1 VC IPP= 10A, tp=8/20 μs - 10.1 - V VC IPP= 30A, tp=8/20 μs - 17.7 - V Reverse Stand-Off Voltage Reverse Leakage Current Clamping Voltage, Line-Ground 1 Clamping Voltage, Line-Ground RDYN ( VC2-VC1)/(IPP2-IPP1) - 0.5 - Ω VESD IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) ±30 ±30 - - kV kV CI/O-I/O Reverse Bias=0V - 4.0 - pF CI/O-GND Reverse Bias=0V - 8.0 - pF 1 Dynamic Resistance, Line-Ground ESD Withstand Voltage1 Diode Capacitance1 1 Parameter is guaranteed by design and/or device characterization. Normalized Capacitance vs. Bias Voltage Non-Repetitive Peak Pulse Power vs. Pulse Time 10 2.0 Peak Pulse Power-Ppk (kW) Normalized Capacitance (pF) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 1 0.1 0.2 0.01 0.0 0.0 0.3 0.6 0.9 1.2 1.5 1.8 0.1 2.1 2.4 2.7 3.0 3.3 Bias Voltage (V) SRDA3.3 Series 1 10 100 1000 Pulse Duration-tp(μS) 2 Revision: June 14, 2013 ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SP4040 Thermal Information Absolute Maximum Ratings TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA3.3 Series Power Derating Curve 20 18 16 14 12 10 8 6 4 2 0 110 100 90 80 70 60 50 SRDA3.3 % of Rated Power or IPP Clamp Voltage V C (V) Clamping Voltage vs. IPP 40 30 20 10 0 1 10 5 20 15 25 30 0 35 25 50 Peak Pulse Current- I PP (A) 75 100 Ambient Temperature-TA Pulse Waveform 125 150 (oC) Product Characteristics 110% Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% Notes : 10% 1. All dimensions are in millimeters 2. Dimensions include solder plating. 0% 0.0 5.0 10.0 15.0 20.0 25.0 3. Dimensions are exclusive of mold flash & metal burr. 30.0 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Time (μs) 5. Package surface matte finish VDI 11-13. Soldering Parameters Reflow Condition Pb – Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Temperature TP time to peak temperature 3 Revision: June 14, 2013 Time SRDA3.3 Series TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA3.3 Series Part Numbering System Part Marking System SRDA 3.3 4 B T G G= Green TVS Diode Arrays (SPA® Diodes) T= Tape & Reel LF SRDA-3.3 Package B = SOIC-8 Channel 4= 4 Channels Voltage Marking Date code CYYWW Ordering Information Pin1 Part Number Package Marking Min. Order Qty. SRDA3.3-4BTG SOIC-8 SRDA3.3 2500 Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC Pins 8 JEDEC MS-012 Millimetres LF o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e L 1.27 BSC 0.050 BSC 1.27 0.40 0.050 0.016 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres User Feeding Direction E Pin 1 Location Max 1.65 1.85 0.065 0.073 5.4 5.6 0.213 0.22 1.95 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 P0 1.50 Min 3.9 4.1 40.0 +/- 0.20 0.059 Min 0.154 0.161 1.574 +/- 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t 4 Min F 10P0 Revision: June 14, 2013 Max P2 D1 SRDA3.3 Series Inches Min 0.30 +/- 0.05 0.012 +/- 0.002 ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.