LITTELFUSE SP3304NUTG

TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3304N Series
SP3304N Series 3.3V 20A Diode Array
RoHS
Pb GREEN
The SP3304N integrates 4 channels of low capacitance
diodes with an additional zener diode to protect sensitive
I/O pins against lightning induced surge events and
ESD. This robust device can safely absorb up to 20A per
IEC61000-4-5 (tP=8/20μs) without performance degradation
and a minimum ±30kV ESD per IEC61000-4-2 international
standard. The low loading capacitance makes the SP4062
ideal for protecting high-speed signal pins.
Pinout
Features
1
3
5
GND
9
SD, IEC61000-4-2,
• E
±30kV contact, ±30kV air
• L
ow capacitance of 3.5pF
(TYP) per I/O
• E
FT, IEC61000-4-4, 40A
(tp=5/50ns)
• L
ow leakage current of
1µA (MAX) at 3.3V
• L
ightning, IEC61000-4-5,
20A (tp=8/20µs)
7
Functional Block Diagram
9
Applications
7
5
• 10/100/1000 Ethernet
Interfaces
• VoIP Phones
• Customer Premise
Equipment (CPE)
• PBX Systems
• Set Top Boxes
Application Example
RJ-45 Connector
*Package is shown as transparent
Ethernet PHY
Tx+
J1
Tx-
1
GND
3
SP3304N
PHY
Rx+
J8
Rx-
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
1
Revision: August 14, 2012
SP3304N
SP3304N
Description
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3304N Series
Absolute Maximum Ratings
Symbol
Thermal Information
Parameter
Value
Parameter
Units
Rating
Units
-65 to 150
°C
Peak Current (tp=8/20μs)
20.0
A
PPK
Peak Pulse Power (tp=8/20µs)
300
W
Maximum Junction Temperature
150
°C
TOP
Operating Temperature
-40 to 85
ºC
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
TSTOR
Storage Temperature
-50 to 150
°C
SP4062
IPP
Storage Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
VRWM
Test Conditions
Min
Max
Units
3.3
V
1.0
µA
IPP=1A, tp=8/20µs, Fwd
6.0
V
IPP=5A, tp=8/20µs, Fwd
7.0
V
IPP=10A, tp=8/20µs, Fwd
8.0
V
IPP=20A, tp=8/20µs, Fwd
11.5
V
Snap Back Voltage
VSB
ISB=50mA
Reverse Leakage Current
ILEAK
VR=2.5V, I/O to GND
Clamp Voltage1
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1
VESD
Typ
2.8
V
0.5
(VC2-VC1)/(IPP2-IPP1)
0.25
Ω
IEC61000-4-2 (Contact)
±30
kV
IEC61000-4-2 (Air)
±30
kV
Diode Capacitance
1
CI/O-GND
Reverse Bias=0V
3.5
Diode Capacitance
1
CI/O-I/O
Reverse Bias=0V
2.0
5.0
pF
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Pulse Waveform
Clamping Voltage vs. IPP
110%
12.0
100%
10.0
90%
8.0
70%
Clamp Voltage (VC)
Percent of IPP
80%
60%
50%
40%
30%
20%
10%
6.0
4.0
2.0
0.0
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
0
Time (μs)
SP3304N Series
5
10
15
20
Peak Pulse Current-IPP (A)
2
Revision: August 14, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3304N Series
Capacitance vs. Bias
Ordering Information
5.0
Part Number
Package
Marking
Min. Order Qty.
SP3304NUTG
µDFN-10
UH4
3000
SP3304N
Capacitance (pF)
4.0
3.0
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Bias Voltage (V)
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
time to peak temperature
Time
Part Numbering System
SP 3304N U T G
G= Green
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Product Characteristics
Lead Plating
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
25
Peak Temperature (TP)
tP
TP
Temperature
Reflow Condition
T= Tape & Reel
Package
U= µDFN-10
Series
Part Marking System
U* 4
Number of
Product Series
Channels
U = SP3304N
Assembly Site
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
3
Revision: August 14, 2012
SP3304N
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3304N Series
Package Dimensions — µDFN-10
Top View
µDFN-10 (2.6x2.6mm)
JEDEC
MO-229
Millimeters
Symbol
A
D
Package
A
B
Max
Min
Nom
Max
0.45
0.50
0.55
0.018
0.020
0.022
0.130 Ref
0.005 Ref
b
0.17
0.22
0.27
0.006
0.008
0.010
D
2.50
2.60
2.70
0.097
0.101
0.105
0.085
D2
2.10
2.15
2.20
0.081
0.083
E
2.50
2.60
2.70
0.097
0.101
0.105
E2
1.21
1.26
1.31
0.046
0.049
0.051
0.45
0.014
0.50 BSC
e
0.35
L
Side View
0.10 C
Nom
A3
E
Inches
Min
0.020 BSC
0.40
0.016
0.018
Recommended Solder Pads µDFN-10L 2.6x2.6mm
A3
A
Seating
Plane
0.05 C
C
b
B
0.10 M C B A
Z
F
G
C
Bottom View
D2
Y
2X
C
X
P
Dimension
Symbol
Millimeters
Inches
B
2.30
0.091
C
2.20
0.087
F
1.41
0.056
G
1.65
0.065
P
0.50
0.020
X
0.37
0.015
Y
0.55
0.022
Z
2.75
0.108
E2
e
Embossed Carrier Tape & Reel Specification — µDFN-10 (2.6x2.6mm)
P0
P2
P1
D0
E
A0
F
T
W
D1
5º MAX
B0
K0
Pin 1 Location
5º MAX
Symbol
Millimeters
A0
2.82 +/- 0.05
B0
2.82 +/- 0.05
D0
Ø1.50 + 0.10
D1
Ø 0.50 + 0.05
E
1.75 +/- 0.10
F
3.50 +/- 0.05
K0
0.76 +/- 0.05
P0
4.00 +/- 0.10
P1
4.00 +/- 0.10
P2
2.00 +/- 0.05
T
0.25 +/- 0.02
W
8.00 + 0.30 /- 0.10
User Feeding Direction
SP3304N Series
4
Revision: August 14, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.