SKY66104_11_202908C.pdf

DATA SHEET
 Unified communications systems
SW_SELANT
SW_EN
OMN_SW
 Cordless phone base station/handsets
PA_OUT
EN_PA
 Cordless phone wireless headsets
NTP
Applications
SW_SELTX
SKY66104-11: 1787 to 1930 MHz High-Power RF
Front-End Module
Logic
Control
TX
Features
PA
 Integrated PA with up to +25 dBm output power
 Single-ended, 50 Ω transmit/receive RF interfaces
 Fast turn-on/turn-off time: < 5 μs
 Supply operation: 3.0 V to 4.5 V
ANT1
RX
ANT2
S3532
Figure 1. SKY66104-11 FEM Block Diagram
 Sleep mode current: < 5 μA
 Small footprint MCM (24-pin, 4 x 4 mm) package
(MSL3, 260 C per JEDEC J-STD-020)
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
A Normal Transmit Power (NTP) input is used to control power
between –10 dBm and +25 dBm. NTP is a voltage-operated
control with a very high input impedance (>100 kΩ) and a range
of 0 V to 1.8 V.
The RF blocks operate over a wide supply voltage range from
3.0 V to 4.5 V, which allows the SKY66104-11 to be used in
battery powered applications over a wide spectrum of the battery
discharge curve.
The SKY66104-11 is packaged in a 24-pin, 4 x 4 mm Multi-Chip
Module (MCM), which allows for a highly manufacturable low-cost
solution.
Description
The SKY66104-11 is a high performance, highly integrated RF
Front-End Module (FEM) designed for Digitally Enhanced Cordless
Telecommunication (DECT) applications operating in the
1880 MHz to 1930 MHz frequency band, and extended
applications for the 1787 MHz to 1792 MHz band.
A functional block diagram of the SKY66104-11 is shown in
Figure 1. The 24-pin MCM package and pinout are shown in
Figure 2. Signal pin assignments and functional pin descriptions
are provided in Table 1.
The SKY66104-11 is designed for ease of use and maximum
flexibility, with fully matched 50 Ω inputs and outputs, and digital
controls compatible with 1.4 V to 3 V CMOS levels. An external
Output Matching Network (OMN) between the PA output and the
antenna switch provides ultimate flexibility in DECT applications.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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GND
PA_OUT
GND
GND
VCC1
GND
DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
24
23
22
21
20
19
17
SW_EN
GND
3
16
SW_SELTX
GND
4
15
SW_SELANT
ANT1
5
14
EN_PA
GND
6
13
RX
7
8
9
10
11
12
NTP
2
GND
OMN_SW
VCC2
TX
GND
18
VDD
1
ANT2
GND
S3561
Figure 2. SKY66104-11 Pinout – 24-Pin MCM
(Top View)
Table 1. SKY66104-11 Signal Descriptions
Pin
Name
Description
Pin
13
Name
RX
Description
1
GND
Ground
Receive output port (from switch)
2
OMN_SW
Transmit post-OMN input to switch
14
EN_PA
PA enable
3
GND
Ground
15
SW_SELANT
Switch logic control, ANT1/ANT2 select
4
GND
Ground
16
SW_SELTX
Switch logic control, TX/RX select
5
ANT1
Antenna 1 port
17
SW_EN
Switch logic control, switch enable
6
GND
Ground
18
TX
Transmit input port (to PA)
7
ANT2
Antenna 2 port
19
GND
Ground
8
VDD
Supply, switch
20
VCC1
Supply, PA bias
9
GND
Ground
21
GND
Ground
10
VCC2
Supply, PA collector and NTP controller
22
GND
Ground
11
GND
Ground
23
PA_OUT
PA output port (to external OMN)
12
NTP
Normal Transmit Power adjustment
24
GND
Ground
Technical Description
Electrical and Mechanical Specifications
The SKY66104-11 contains all of the needed RF matching and DC
biasing circuits. The PA is a two-stage, HBT InGaP device
optimized for high linearity and power efficiency. The PA output
power is controlled by a silicon device.
The absolute maximum ratings of the SKY66104-11 are provided
in Table 2. The recommended operating conditions are specified
in Table 3, and electrical specifications are provided in Tables 4
through 7.
These features make the device suitable for wideband digital
applications where PA linearity and power consumption are of
critical importance.
The state of the SKY66104-11 is determined by the logic provided
in Table 8. Mode control configurations are noted in Table 9.
A plot of output power versus NTP is shown in Figure 3.
The device is designed for standard DECT applications. Under
these stringent test conditions, the device exhibits excellent
spectral purity and power efficiency.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Table 2. SKY66104-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
V
Supply voltage (VCC1, VCC2, VDD)
VPS
–0.3
+4.8
Logic control voltages
VIH, VIL
–0.3
+3.3
V
Transmit RF input power (at TX port)
PIN_TX
+10
dBm
Receive RF input power (at ANT1 or ANT2 ports)
PIN_RX
+20
dBm
Voltage standing wave ratio
VSWR
6:1
–
Operating case temperature (Note 2)
TC
–40
+85
C
Storage temperature
TSTG
–55
+150
C
Electrostatic discharge:
ESD
250
V
Human Body Model (HBM), Class 1A
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their typical value as provided in Tables 3, 4, and 5. Exceeding any of the limits listed here may result in permanent damage to the device.
Note 2: Nominal junction-to-case thermal resistance is 80C/W.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY66104-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
Operating case temperature (Note 1)
TC
–40
+25
+80
C
RF supply voltage (Note 2)
VCC1, VCC2
3.0
3.6
4.5
V
Switch supply voltage (Note 2)
VDD
3.0
3.6
4.5
V
Note 1: Specified case temperature is measured at the MCM ground pad interface.
Note 2: Power supply pins VCC1, VCC2, and VDD are independent supplies and are not internally tied together.
Table 4. SKY66104-11 DC Electrical Specifications (Note 1)
(VCC1/2 = +3.6 V, VDD = 3.6 V, TC = +25 C, PIN = 0 dBm, as Measured on the SKY66104-11 Evaluation Board (De-Embedded to Device),
Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Total supply current in Transmit Mode
(Note 2)
IPS(TX24)
POUT = +24 dBm
171
mA
IPS(TX15)
POUT = +15 dBm
83
mA
IPS(TX10)
POUT = +10 dBm
58
mA
Total supply current in Receive Mode
(Note 2) (Note 3)
IPS(RX)
60
μA
Total supply current in Sleep Mode
(Note 2) (Note 3)
IPS(OFF)
4.1
μA
NTP input current in Transmit Mode (Note 3)
INTP_IN
9.5
μA
Note 1: Performance is guaranteed only under the conditions listed in this Table. Receive (RX), Transmit (TX), and Sleep Mode configurations are defined in Table 9. Typical performance shown
is for Engineering Sample 2 (ES2).
Note 2: IPS = ICC1 + ICC2 + IDD. These are expected total power supply currents for indicated POUT at ANT1/2 ports.
Note 3: NTP = 0 V.
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Table 5. SKY66104-11 Transmit Mode Electrical Specifications (Note 1) (Note 2)
(VCC1/2 = +3.6 V, VDD = 3.6 V, TC = +25 C, PIN = 0 dBm, as Measured on the SKY66104-11 Evaluation Board (De-Embedded to Device),
All Used and Unused Ports Terminated with 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
MHz
f
Output power at ANT1/2 ports (Note 4)
POUT
NTP ≥ 1.55 V
+24
dBm
NTP ≤ 0.3 V
+0
dBm
Output power variation over temperature
(Note 4) (Note 5)
POUT_TV
TC = –40 C to +85 C,
relative to the value at
25 C
NTP input voltage (Note 4)
Small signal gain
NTP
S21
1880
1930
Frequency range (Note 3)
–2
–0.9/+0.8
+2
dB
POUT = +15 dB
0.7
V
POUT = +10 dB
0.5
V
PIN = –25 dBm,
NTP = 1.8 V
+27
dB
5
dB
TX-RX port isolation
S21TX-RX
Pin 13 relative to pin 18
Ant–RX port isolation
S21ANT-RX
Pin 13 relative to pin 5 or 7
29
Input return loss
S11
@ TX port
–12
–7
dB
Output return loss
S22
–12
–8
dB
dB
1 dB output compression point (Note 6)
OP1dB
NTP = 1.8 V
+24
2nd and 3rd harmonics
2fo, 3fo
NTP = 1.8 V, CW
–50
–30
dBc
Higher harmonics (Note 5)
4fo to 10 fo
NTP = 1.8 V, CW
–50
–40
dBc
Turn-on time (Note 5)
tON
From 50% of rising logic
control to 90% of final RF
output power
1.6
5
μs
From 50% of falling logic
control to 10% of final RF
output power
0.3
5
μs
Turn-off time (Note 5)
Stability (Note 5)
tOFF
Stab
Ruggedness (Note 5)
RU
NTP = 1.8 V, CW
f = 0.1 GHz to 20 GHz,
load VSWR = 6:1
NTP = 1.8 V, CW
load VSWR = 6:1
dBm
All non-harmonically related outputs < –40 dBm
No permanent damage
Note 1: Performance is guaranteed only under the conditions listed in this Table. Production testing is performed at 1905 MHz. Transmit (TX) Mode configuration is defined in Table 9. Typical
performance shown is for Engineering Sample 2 (ES2).
Note 2: With specified matching network between pins PA_OUT and OMN_SW. POUT measured at ANT1/ANT2 ports.
Note 3: f = 1787 MHz to 1880 MHz at reduced performance with POUT = +20 dBm.
Note 4: NTP is an analog input control. See Figure 3 for typical characteristics.
Note 5: Not tested in production. Fully characterized and guaranteed by design.
Note 6: Starting point for test is PIN = –13 dBm.
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Table 6. SKY66104-11 Receive Mode Electrical Specifications (Note 1)
(VCC1/2 = +3.6 V, VDD = 3.6 V, TC = +25 C, ANT1 and ANT2 Ports, as Measured on the SKY66104-11 Evaluation Board (De-Embedded to
Device), All Used and Unused Ports Terminated with 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
MHz
f
Receive loss
RX_LOSS
ANT1/2 port input return loss
S11ANT1/2
–12
–8
dB
RX port output return loss
S22RX
–12
–8
dB
Turn-on time (Note 3)
tON
From 50% of falling logic
control to 90% of final RF
output power
1.6
5
μs
From 50% of rising logic
control to 10% of final RF
output power
0.3
5
μs
Turn-off time (Note 3)
1880
1930
Frequency range (Note 2)
tOFF
0.8
dB
Note 1: Performance is guaranteed only under the conditions listed in this table. Production testing is performed at 1905 MHz. Receive (RX) Mode configuration is defined in Table 9.
Note 2: f = 1787 MHz to 1792 MHz at reduced performance.
Note 3: Not tested in production. Fully characterized and guaranteed by design.
Table 7. SKY66104-11 Diversity Antenna Electrical Specifications (Note 1)
(VCC1/2 = +3.6 V, VDD = 3.6 V, TC = +25 C, as Measured on the SKY66104-11 Evaluation Board (De-Embedded to Device), All Unused
Ports Terminated with 50 Ω, Unless Otherwise Noted)
Parameter
Isolation, ANT1 to ANT2
Symbol
ISOLANTSW
Test Condition
Min
Typical
Max
Units
Transmit (TX) Mode
29
dB
29
dB
Isolation, ANT(x) to RX
ISOLANT-RX
Transmit (TX) Mode
ANT1 to ANT2 switching time in Transmit
Mode (Note 2)
tANT1_ANT2(TX)
Transmit (TX) Mode
ANT1 to ANT2 switching time in Receive
Mode (Note 2)
tANT1_ANT2(RX)
Receive (RX) Mode
1.6
5
μs
0.3
5
μs
Note 1: Performance is guaranteed only under the conditions listed in this Table. Receive (RX) Mode and Transmit (TX) Mode configurations are defined in Table 9.
Note 2: Not tested in production. Fully characterized and guaranteed by design.
Table 8. SKY66104-11 Electrical Specifications: Control Logic Characteristics (Note 1)
(TC = +25 C, as Measured on the SKY66104-11 Evaluation Board (De-Embedded to Device), Unless Otherwise Noted)
Parameter
Symbol
Control voltage:
High
Low
VIH
VIL
Input current:
High (Note 2)
Low (Note 3)
IIH
IIL
Test Condition
Min
Typical
Max
Units
1.4
0
1.7
3.3
0.3
V
V
24
0
μA
μA
Note 1: Performance is guaranteed only under the conditions listed in this table. Control logic input signals are: SW_EN, SW_SELTX, and SW_SELANT.
Note 2: With required internal pull-down of 72 kΩ, typical IIH condition is VIH = 1.7 V.
Note 3: Typical IIL condition is VIL = 0 V.
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Table 9. SKY66104-11 Mode Control Logic (Note 1)
EN_PA (Note 2)
(Pin 14)
SW_SELANT
(Pin 15)
SW_SELTX
(Pin 16)
SW_EN
(Pin 17)
Total Current
TX → ANT1
1
1
1
1
72 mA
TX → ANT2
1
0
1
1
72 mA
RX → ANT1 (Note 3)
0
1
0
1
60 μA
RX → ANT2 (Note 3)
0
0
0
1
60 μA
Sleep (Note 3) (Note 4)
0
0
0
0
4.1 μA
Mode
Note 1: Logic levels “0” and “1” are compliant with VIL and VIH, respectively, as specified in Table 8.
Note 2: EN_PA is exclusively used to power up/down the PA. This signal is not involved with configuring the switches. The EN_PA states shown in this table are
what is needed to achieve the desired receive and transmit functionality and performance.
Note 3: The transmit PA is turned off in this mode for minimum power consumption.
+40
225
+30
200
+20
175
+10
150
0
125
–10
100
–20
75
POUT @ 55 °C (dBm)
POUT @ 25 °C (dBm)
POUT @ 0 °C (dBm)
IPS @ 55 °C (mA)
IPS @ 25 °C (mA)
IPS @ 0 °C (mA)
–30
–40
–50
0
0.5
1.0
1.5
50
25
Total Supply Current, IPS (mA)
Output Power at OMN_SW, POUT (dBm)
Note 4: NTP at 0 V.
0
NTP (V)
Figure 3. SKY66104-11 NTP Control vs Output Power
(TX Mode, VPS = 3.6 V, f = 1905 MHz, PIN = 0 dBm)
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Evaluation Board Description
Package and Handling Information
The SKY66104-11 Evaluation Board is used to test the
performance of the SKY66104-11 FEM. A typical application
schematic diagram is provided in Figure 4. An assembly drawing
for the Evaluation Board is shown in Figure 5. An Evaluation Board
schematic is shown in Figure 6, and the layer detail is provided in
Figure 7.
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
Package Dimensions
The SKY66104-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Typical part markings are shown in Figure 8. The PCB layout
footprint for the SKY66104-11 is provided in Figure 9. Figure 10
shows the package dimensions for the 24-pin MCM, and
Figure 11 provides the tape and reel dimensions.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
PA Bias Supply
C1
2.2 pF
C14
15 pF
4
5
Antenna 1
6
VCC1
GND
19
TX
18
17
OMN_SW
SW_EN
GND
SW_SELTX
GND
SW_SELANT
ANT1
EN_PA
RX
GND
7
VDD
ANT2
C6
10 pF
C16
10 μF
C4
10 pF
8
9
10
11
Switch Enable
16
TX/RX Select
15
ANT1/ANT2 Select
14
PA Enable
13
Receive Output
NTP
3
GND
20
GND
2
21
VCC2
1
22
GND
23
GND
24
PA_OUT
C3
6.8 pF
C15
1000 pF
Transmit Input
GND
Note: Place C1 and C2 near pin 23.
Place C3 near pin 2. Make loop short.
GND
C2
1.1 pF
C5
10 pF
12
Antenna 2
C7
10 pF
Switch Supply
C19
15 pF
C18
1000 pF
L3
22 nH
PA Collector,
NTP Controller Supply
C12
10 μF
C28
15 pF
C29
1000 pF
C12
1000 pF
C13
15 pF
NTP Adjust
C8
1200 pF
S3562
Figure 4. SKY66104-11 Typical Application Schematic
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
S3570
Figure 5. SKY66104-11 Evaluation Board Assembly Drawing
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
9 10 11 12 13 14
TX_EN
8
SW1
SW2
7
SW0
6
VCC1
4
VCC1_SENSE
5
VCC2
NTP
3
VCC2_SENSE
2
VDD
P1
1
VCC1_Sense
VCC1
C14
15 pF
C2
1.1 pF
C15
1000 pF
C16
10 μF
C17
DNI
C1
2.2 pF
J1
Transmit Input
J4
5
Antenna 1
6
L4
DNI
GND
VCC1
GND
GND
GND
19
TX
C4
10 pF
L5
DNI
18
17
OMN_SW
SW_EN
GND
SW_SELTX
GND
SW_SELANT
ANT1
EN_PA
RX
GND
J3
7
VDD
ANT2
C6
10 pF
20
8
9
10
11
SW0
16
SW1
15
SW2
14
TX_EN
13
J2
Receive Output
NTP
4
21
GND
3
GND
22
VCC2
2
23
GND
C3
6.8 pF
1
24
PA_OUT
Note: Place C1 and C2 opposite each
other and near pin 23. Place C3 near
pin 2.
C5
10 pF
12
Antenna 2
C7
10 pF
Switch Supply
C19
15 pF
C18
1000 pF
VCC2_Sense
L3
22 nH
C30
1000 pF
C31
15 pF
L2
0Ω
VCC2
C13
DNI
C12
10 μF
C11
DNI
C10
DNI
C29
1000 pF
C8
1200 pF
C28
15 pF
C9
DNI
R1
0Ω
NTP
SW1
SW0
C25
DNI
C24
DNI
C27
DNI
C26
DNI
TX_EN
SW2
C21
DNI
C20
DNI
C23
DNI
C22
DNI
Note: Some component labels may be different than the
corresponding component symbol shown here.
Component values, however, are accurate as of the
date of this Data Sheet.
S3572
Figure 6. SKY66104-11 Evaluation Board Schematic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Layer 1: Top Layer
Layer 2: Ground Plane
Layer 3: VCC Layer
Layer 4: Bottom Layer
S3571
Figure 7. Evaluation Board Layer Detail
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DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Pin 1
Indicator
66104-11
XXXXXX
YYWW CC
Skyworks
Part Number
Lot Number
Y1535
Date/Country Code:
YY = Year
WW = Work Week
CC = Country Code
Figure 8. Typical Part Markings
(Top View)
4.4
4.3
2.35
6X 0.15
4.3
9X 0.675
4.4 2.35
Component Outline
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
6X 0.15
Component Outline
9X 0.675
Solder Mask Opening
Top View
Stencil Aperture
Top View
(4.3)
Pin 24
The cross-hatched area represents the
merger of the center ground pad +10
individual I/O ground pads. All I/O ground
pads should have at least one via connected
to internal ground planes for optimum
electrical performance.
0.25 Typ.
Component Outline
Pin 1
0.35
0.25
0.05
0
4X 0.25
4X 0.75
4X 1.25
(4.3)
(0.9)
0.15
0.05
0.6 0.7
4X 1.85
4X 1.85
(0.9)
0
4X 0.25
4X 0.75
4X 1.25
Thermal Via Array.
ø0.3 mm on 0.6 mm pitch.
Additional vias in common ground
pad will improve thermal and electric
performance.
NOTE: thermal vias should be resin-filled
and capped according to IPC-4761, Type VII vias.
30-35 μm Cu plating recommended.
Stencil and
Metallization
Component Outline
Solder Mask Opening
Metallization
Top View
SMT Pad Detail
Scale: 2X
6X This Rotation
6X Rotated 180°
6X Rotated 90° CW
6X Rotated 90° CCW
All measurements are in millimeters
S3563
Figure 9. SKY66104-11 PCB Layout Footprint
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202908C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 9, 2014
11
4X 1.25
B
4X 0.25
4
4X 0.75
Pin 1 Indicator
12X 1.9
DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Pin 24
Pin 1 Indicator
0.2 X 0.2
C
12X 1.9
Pin 1
4X 1.25
4X 0.25
4
A
4X 0.75
2X 1.175
0.9 ± 0.1
2X 1.175
A
0.1
0.15 A B C
Top View
Side View
24X SMT Pad
0.1 A B C
Solder Mask Opening
0.2 A B C
Bottom View
0.35 ± 0.1
(0.1)
Solder Mask
Edges
0.35 ± 0.05
0.25 ± 0.05
Metal Pad Edge
Detail A
All measurements are in millimeters
Dimensioning and tolerancing according to ASME Y14.5M-1994
SMT Pad
Scale: 2X
6X This Rotation
6X Rotated 180°
6X Rotated 90° CW
6X Rotated 90° CCW
Figure 10. SKY66104-11 24-Pin MCM Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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December 9, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202908C
S3560
DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Ø1
.50
B’
2.00 ± 0.10
±0
1.75 ± 0.10
4.00 ± 0.10
4.25 ± 0.10 (Bo)
5.50 ± 0.10
.10
.10
5º MAX
Ø1.50 ± 0
A
12.00 ± 0.20
0.25 ± 0.02
Pin 1
A’
B
8.00 ± 0.10
5º MAX
1.25 ± 0.10 (Ko)
Section B-B’
4.25 ± 0.10 (Ao)
Section A-A’
Notes:
1. All measurements are in millimeters.
2. Carrier tape must meet all requirements of Skyworks GP01-D232 procurement Spec for tape and reel shipping.
3. Carrier tape shall be black conductive polycarbonate.
4. Cover tape shall be transparent conductive material.
5. ESD-surface resistivity shall meet GP01-D232.
6. 10 sprocket hole pitch cumulative tolerance: ±0.20 mm.
7. Ao and Bo measured on plane 0.30 mm above the bottom of the procket.
8. Part No. : KS-1208-440-PC. (Please indicate on purchase order)
ts269
Figure 11. SKY66104-11 Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202908C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 9, 2014
13
DATA SHEET • SKY66104-11: HIGH-POWER RF FEM
Ordering Information
Model Name
SKY66104-11: RF Front-End Module
Manufacturing Part Number
SKY66104-11
Evaluation Board Part Number
SKY66104-11-EK1
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December 9, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202908C