Reliability Report

AOS Semiconductor
Product Reliability Report
AO7413,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AO7413.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AO7413
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AO7413 uses advanced trench technology to provide excellent RDS(ON), low gate charge, and
operation with gate voltages as low as 1.8V, in the small SC70 footprint. It can be used for a wide
variety of applications, including load switching, low current inverters and low current DC-DC
converters. It is ESD protected to 2KV HBM.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AO7413
Standard sub-micron
Low voltage P channel
Package Type
SC70
Lead Frame
Copper
Die Attach
Ag epoxy
Bonding Wire
Au wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO7413
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
HTGB
Temp = 150 °c,
Vgs=100% of
Vgsmax
Standard
-
4 lots
605pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
231pcs
0
3 lots
JESD22A108
0
JESD22A108
220pcs
0
JESD22A110
77pcs / lot
HTRB
Temp = 150 °c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
3 lots
130 +/- 2°°c,
85%RH, 33.3 psi,
Vgs = 100% of
Vgs max
121°°c, 29.7psi,
RH=100%
100 hrs
4 lots
96 hrs
(Note A*)
3 lots
55 pcs / lot
165pcs
0
JESD22A102
-65°°c to 150°°c,
air to air
250 / 500
cycles
(Note A*)
4 lots
55 pcs / lot
220pcs
0
JESD22A104
(Note A*)
55 pcs / lot
231pcs
77pcs / lot
HAST
Pressure Pot
Temperature
Cycle
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 15
MTTF = 7435 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AO7413). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 6.51 x 10 hrs = 7435 years
/ [2x3x2x77x500x258] = 15
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
K = Boltzmann’s constant, 8.617164 X 10-5eV / K