Reliability Report

AOS Semiconductor
Product Reliability Report
AOI444,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOI444. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOI444 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOI444 combine advanced trench MOSFET technology with a low resistance package to
provide extremely low RDS(ON). Those devices are suitable for use in PWM, load switching and
general purpose applications.
- RoHS Compliant
- Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Flammability Rating
Backside Metallization
MSL (moisture sensitive level)
AOI444
Standard sub-micron
Low voltage N channel process
3 leads TO251A
Bare Cu
Soft solder
Au & Al wire
Epoxy resin with silica filler
UL-94 V-0
Ti / Ni / Ag
Level 1 based on J-STD-020
Note * based on info provided by assembler and mold compound supplier
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III. Result of Reliability Stress for AOI444
Test Item
Test Condition
Time
Point
MSL
precondition
168hr 85°°c
/85%RH +3 cycle
[email protected]°°c
Temp = 150°°c ,
Vgs=100% of
Vgsmax
Temp = 150°°c ,
Vds=80% of Vdsmax
168hrs
500 hrs
1000 hrs
HTGB
Lot
Attribution
Total
Sample
size
-
3 lots
495pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
231pcs
0
3 lots
JESD22A108
0
JESD22A108
165pcs
0
JESD22A110
(Note A*)
HTRB
Number
of
Failures
77 pcs / lot
231pcs
3 lots
(Note A*)
Standard
77 pcs / lot
HAST
130 +/- 2°°c , 85%RH,
33.3 psi, Vgs = 80%
of Vgs max
100 hrs
3 lots
Pressure Pot
121°°c , 29.7psi,
RH=100%
96 hrs
(Note A*)
3 lots
55 pcs / lot
165pcs
0
JESD22A102
Temperature
Cycle
-65°°c to 150°°c ,
air to air
250 / 500
cycles
(Note A*)
3 lots
55 pcs / lot
165pcs
0
JESD22A104
(Note A*)
55 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 15
MTTF = 7435 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOI444). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
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9
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Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 6.51 x 10 hrs = 7435 years
/ [2 x2x3x77x500x258] = 15
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
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Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
K = Boltzmann’s constant, 8.617164 X 10-5eV / K
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