AOS Semiconductor Product Reliability Report AOC2411, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AOC2411. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOC2411 passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOC2411 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V while retaining a 12V VGS(MAX) rating. Detailed information refers to datasheet. - II. Die / Package Information: AOC2411 Standard sub-micron Low voltage P channel Package Type WLCSP 1.6x1.6_4 Lead Frame N.A. Die Attach N.A. Bonding Wire Solder ball Mold Material N.A MSL level Level 1 Note * based on information provided by assembler Process III. Result of Reliability Stress for AOC2411 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB HTRB HAST Pressure Pot Temperature Cycle Lot Attribution Total Sample size Number of Failures Standard - 4 lots 550pcs 0 JESD22A113 Temp = 150 °c, Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 2 lots 385pcs 0 JESD22A108 Temp = 150 °c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 77pcs / lot 385pcs 0 JESD22A108 130 +/- 2°°c, 85%RH, 33.3 psi, Vgs = 100% of Vgs max 121°°c, 29.7psi, RH=100% 100 hrs (Note A*) 2 lots 77pcs / lot 110pcs 0 JESD22A110 96 hrs (Note A*) 4 lots 55pcs / lot 220pcs 0 JESD22A102 -65°°c to 150°°c, air to air 250 / 500 cycles (Note A*) 4 lots 55pcs / lot 220pcs 0 JESD22A104 (Note A*) 55pcs / lot 3 lots (Note A*) 2 lots 3 lots Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 7 MTTF = 16536 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOC2411). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (2x2x77x168+6x77x1000) x258] = 7 9 8 MTTF = 10 / FIT =1.45 x 10 hrs = 16536 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K