Reliability Report

AOS Semiconductor
Product Reliability Report
AON7522E,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AON7522E.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AON7522E
passes AOS quality and reliability requirements.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
General Description:
• Latest Trench Power AlphaMOS (αMOS LV) technology
• Very Low RDS(on) at 4.5VGS
• Low Gate Charge
• ESD protection
• RoHS and Halogen-Free Compliant
Application:
• DC/DC Converters
Detailed information refers to datasheet.
II. Die / Package Information:
AON7522E
Standard sub-micron
Low voltage N channel
Package Type
DFN 3x3A
Lead Frame
Cu
Die Attach
Ag epoxy
Bonding
Cu wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AON7522E
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
HTGB
Temp = 150 °c,
Vgs=100% of
Vgsmax
-
11 lots
1815pcs
0
JESD22A113
168hrs
500hrs
1000 hrs
154pcs
0
2 lots
JESD22A108
0
JESD22A108
605pcs
0
JESD22A110
(Note A*)
Standard
77pcs / lot
Temp = 150 °c,
Vds=80% of
Vdsmax
168hrs
500hrs
1000 hrs
HAST
130°°c, 85%RH,
33.3 psi, Vgs =
100% of Vgs max
100 hrs
11 lots
Pressure Pot
121°°c, 29.7psi,
RH=100%
96 hrs
(Note A*)
11 lots
55pcs / lot
605pcs
0
JESD22A102
Temperature
Cycle
-65°°c to 150°°c,
air to air
250 / 500
cycles
(Note A*)
11 lots
55pcs / lot
605pcs
0
JESD22A104
(Note A*)
55pcs / lot
HTRB
154pcs
2 lots
(Note A*)
77pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 23
MTTF = 4957 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON7522E). Failure Rate Determination is
based on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 4.34 x 10 hrs = 4957 years
/ [2x (4x77x500) x258] = 23
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
258
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K
130 deg C
150 deg C
2.59
1