SCI-501

(27) GSM-DCS Diplexer (SCI-501 W/F)
FEATURES
• Passive integration on silicon substrate
• Low insertion loss in pass band
• Small size: 2.1 mm x 1.0 mm (wirebond)
2.0 mm x 1.3 mm (flip chip)
• Pb-free solder bump
• Low profile: 0.25 mm height (wirebond)
0.40 mm height (flip chip)
• Directly attachable on PCB or flipped on PCB
• Operating temperature: -40℃ to +85℃
• Storage temperature: -40℃ to +85℃
SCI-501F (Flip Chip)
SCI-501W (Wirebond)
DESCRIPTION
STATS ChipPAC’s SCI-501W/F is a diplexer for
GSM/DCS band applications. The diplexer has low
pass–band insertion loss and small size. It is
composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a
silicon substrate using STATS ChipPAC’s IPD
(Integrated Passive Device) process. The pad or bump
size and pitch of the diplexer are selected so that the
device can be mounted directly on a PCB or laminate
substrate using conventional wirebonding or surface
mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP
applications.
ELECTRICAL SPECIFICATIONS
Specification
Unit
Min.
Typical
Max.
Pass Band 1
MHz
824
915
Pass Band 2
MHz
1710
1980
Insertion Loss, Band 1
dB
0.5
Insertion Loss, Band 2
dB
0.8
Return Loss, Band 1
dB
20
Return Loss, Band 2
dB
15
Isolation, Band 1 at Band 2
dB
20
Isolation, Band 2 at Band 1
dB
Size
mm
25
2.1 x 1.0 (WB)
2.0 x 1.3 (FC)
DIMENSIONS
STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no
circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the
information at any time and without notice.
TYPICAL CHARACTERISTICS
0
Return Loss (dB)
Insertion Loss (dB)
0
-10
-20
-30
-10
-20
-30
-40
-40
0
1
2
3
4
5
0
6
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
ASSEMBLY DRAWING / MECHANICAL OUTLINE
SCI-501W (Wirebond)
SCI-501F (Flip Chip)
Pad
SCI-501W Signal
SCI-501F Signal
1
Output-1 (Pass Band 1)
Ground
2
Ground
Input
3
Input
Ground
4
Ground
Output-1 (Pass Band 1)
5
Output-2 (Pass Band 2)
Output-2
6
-
Output-2 (Pass Band 2)
NOTES
All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room
temperature. For best results, ground plane directly beneath the device should be in the top metal layer.
Refer to “Appendix A” for:
• Pad sizes and typical wirebond length used in the wirebonded IPD products.
• Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD
products.
www.statschippac.com
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All rights reserved. Rev 02/2009