(26) 802.11a Band Pass Filter (SCI-402 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.1 mm (wirebond) 1.5 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-402F (Flip Chip) SCI-402W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-402W/F is a band pass filter (BPF) for 802.11a band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. MHz 5115 dB Typical 5825 1.0 Return Loss dB 15 Attenuation, 2450 MHz dB 40 Attenuation, 1100 MHz dB Size mm Max. 40 1.4 x 1.1 (WB) 1.5 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. 0 0 -10 -10 Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS -20 -30 -40 -20 -30 -40 -50 -50 0 2 4 6 8 10 12 0 14 2 4 6 8 10 12 14 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-402W (Wirebond) SCI-402F (Flip Chip) Pad SCI-402W Signal SCI-402F Signal 1 Input Ground 2 Ground Output 3 Output Ground 4 Ground Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 54 All rights reserved. Rev 02/2009