(3) WLAN 802.11b/g Band Balun (SCI-103 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 0.8 mm x 1.0 mm (wirebond) 1.2 mm x 1.1 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-103W/F is a balun for WLAN 802.11b/g band applications. The balun has low pass– band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-103W (Wirebond) SCI-103F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Pass Band Unit Min. MHz 2400 Insertion Loss dB Return Loss dB Typical 2500 0.5 15 20 Ohm 100 Amplitude Imbalance dB 0.5 Phase Imbalance deg 5.0 Size mm Differential Impedance Max. 0.8 x 1.0 (WB) 1.2 x 1.1 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 1 Amplitude Imbalance (dB) Insertion Loss (dB) 0 -10 -20 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 -1 2.3 4.0 2.4 0 2.6 190 Phase Imbalance (deg) Return Loss (dB) 2.5 Frequency (GHz) Frequency (GHz) -10 -20 -30 180 170 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2.3 2.4 Frequency (GHz) 2.5 2.6 Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-103W (Wirebond) SCI-103F (Flip Chip) Pad SCI-103W Signal 1 Ground SCI-103F Signal Bias 2 Unbalanced Unbalanced 3 Bias Ground 4 Balanced (-) Balanced (+) 5 Balanced (+) Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 8 All rights reserved. Rev 02/2009