GBJ2508

GBJ25005 THRU GBJ2510
Green Products
Technical Data
Data Sheet N1754, Rev. -
GBJ25005-GBJ2510
Single-Phase 25.0A Glass Passivated Bridge Rectifier
Features:
•
•
•
•
•
•
Glass passivated chip junction
Reliable low cost construction utilizing molded plastic technique
Ideal for printed circuit board
Low forward voltage drop
Low reverse leakage current
High surge current capability
Mechanical Data:
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•
•
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Case: GBJ, Molded plastic
Terminals: Plated leads solderable per MIL-STD-202, Method 208
Polarity: as marked on case
Mounting Position: Any
Weight: 0.23ounce, 6.6gram
Mechanical Dimensions: In Inches/mm
GBJ
MARKING, MOLDING RESIN
st
nd
Marking for Type Number, 1 row SSG YYWWL, 2 row Type Number
Where YY is the manufacture year
WW is the manufacture week code
L is the wafer’s Lot Number
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GBJ25005 THRU GBJ2510
Green Products
Technical Data
Data Sheet N1754, Rev. -
Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless
otherwise specified. Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Ratings:
Symbol
GBJ
25005
GBJ
2501
GBJ
2502
GBJ
2504
GBJ
2506
GBJ
2508
GBJ
2510 Unit
Maximum Recurrent Peak Reverse Voltage
Maximum DC Blocking Voltage
VRRM
VDC
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
V
Type number
Maximum Average Forward Rectified
Current with Heatsink at TC=100℃
Peak Forward Surge Current,8.3ms single
half-sine-wave superimposed on rated load
(JEDEC method)
I(AV)
25
A
IFSM
300
A
Electrical Characteristics:
Type Number
Symbol
GBJ
25005
GBJ
2501
GBJ
2502
GBJ
2504
GBJ
2506
GBJ
2508
GBJ
2510 Unit
Maximum Forward Voltage @IF=12.5A
VF
1.1
V
Maximum Reverse Current @TA=25℃
At Rated DC Blocking Voltage @TA=125℃
IR
10
500
µA
Typical Junction Capacitance (Note 1)
CJ
85
pF
Thermal-Mechanical Specifications:
Type Number
Typical Thermal Resistance (Note 2)
Operating and Storage Temperature Range
Case Style
Symbol
GBJ
25005
GBJ
2501
GBJ
2502
GBJ
2504
GBJ
2506
GBJ
2508
GBJ
2510 Unit
RθJC
0.6
°C/W
TJ, TSTG
-55 to +150
°C
GBJ
Note: 1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance from Junction to Case with Device Mounted on 300mm x 300mm x 1.6mmC u Plate Heatsink.
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GBJ25005 THRU GBJ2510
Technical Data
Data Sheet N1754, Rev. -
Green Products
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GBJ25005 THRU GBJ2510
Technical Data
Data Sheet N1754, Rev. -
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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