DA2362-AL

Document 563
Flyback Transformer
For Freescale Semiconductor
MC34670 PD Interface
• Designed for 13 W IEEE 802.3af-compliant PoE applications
• Operates with 36 – 80 Volts input
• 1500 Vrms isolation between the primary and the secondary
Core material Ferrite
Terminations RoHS tin-silver over tin over nickel over phos
bronze. Other terminations available at additional cost.
Weight 6.3 g
Ambient temperature –40°C to +85°C
Storage temperature Component: –40°C to +85°C.
Packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
Packaging 175 per 13″ reel Plastic tape: 32 mm wide,
0.5 mm thick, 28 mm pocket spacing, 12.93 mm pocket depth
PCB washing Only pure water or alcohol recommended
Inductance Inductance
DCR max (Ohms)4
Part
Power
at 0 A2
at Ipk3
1
number
(W)
±10% (µH)
min (µH)
pri
bias sec
DA2362-AL_
13
127
114.3
0.222 0.405 0.039
Leakage
Turns ratio6
inductance5
max (µH) pri : sec pri : bias
0.950
1 : 0.250 1 : 0.594
Ipk3
(A)
1.0
Output7
5 V, 2.6 A
1. When ordering, please specify packaging code:
DA2362-ALD
Packaging: D = 13″ machine-ready reel. EIA-481 embossed plastic tape (175 parts
per full reel).
B = Less than full reel. In tape, but not machine ready. To have a leader
and trailer added ($25 charge), use code letter D instead.
2. Inductance is for the primary, measured at 250 kHz, 0.2 Vrms, 0 Adc.
3. Peak primary current drawn at minimum input voltage.
4. DCR for the secondary is per winding.
5. Leakage inductance measured between pins 3 and 4 with secondary pins shorted.
6. Turns ratio is with the secondary windings connected in parallel.
7. Output of the secondary is with the windings connected in parallel. Bias winding output
is 12 V, 20 mA.
8. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
3
Pri
4
2
8
7
Sec
0.080
2,03
0.590
14,99
Secondary windings to be
connected in parallel on
PC board
0.500 max
12,70
0.699 max
17,75
0.050
1,27
0.512
13,00
9
10
Recommended
Land Pattern
10
1
0.098
2,50
Dimensions are in
0.028
0,70
0.530 max
13,46
5
6
0.098
2,50
inches
mm
Specifications subject to change without notice.
Please check our website for latest information.
© Coilcraft, Inc. 2009
0.004 /0,10
0.039
1,00
1
Bias
1
Dot above pin1
Document 563
Revised 10/29/08
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