The following document contains information on Cypress products. MB39C604 ASSP PSR LED Driver IC for LED Lighting Data Sheet (Full Production) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur. Publication Number MB39C604-DS405-00016 CONFIDENTIAL Revision 1.0 Issue Date March 6, 2014 D a t a S h e e t Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office. 2 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 MB39C604 ASSP PSR LED Driver IC for LED Lighting Data Sheet (Full Production) 1. Description MB39C604 is a PSR (Primary Side Regulation) LED driver IC for LED lighting. Using the information of the primary peak current and the transformer-energy-zero time, it is able to deliver a well regulated current to the secondary side without using an opto-coupler in an isolated flyback topology. Using critical conduction mode, it is able to allow the use of small transformer. In addition, MB39C604 has a dimmable circuit built-in and can constitute the lighting system corresponding to the PWM dimming. It is most suitable for the general lighting applications, for example replacement of commercial and residential incandescent lamp and so on. 2. Features PSR topology in an isolated flyback circuit High power factor (>0.9 : Not dimming) in Single Conversion High efficiency (>85% : Not dimming) and low EMI by detecting transformer zero energy PWM Dimmable LED lighting High-reliable protective function − Under voltage lock out (UVLO) − Output over voltage protection (OVP) − Transformer over current protection (OCP) − Output short circuit protection (SCP) − Over temperature protection (OTP) Switching frequency setting : 30kHz to 133kHz Input voltage range VDD : 9V to 20V Input voltage range for LED lighting applications : AC110VRMS, AC230VRMS Output power range for LED lighting applications : 5W to 50W Small Package : SOP-8 (3.9mm × 5.05mm × 1.75mm[Max]) 3. Applications LED lighting PWM dimmable LED lighting Online Design Simulation Easy DesignSim This product supports the web-based design simulation tool. It can easily select external components and can display useful information. Please access from the following URL. http://www.spansion.com/easydesignsim/ Publication Number MB39C604-DS405-00016 Revision 1.0 Issue Date March 6, 2014 This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur. CONFIDENTIAL D a t a S h e e t Table of Contents 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. Description ................................................................................................................................................ 3 Features .................................................................................................................................................... 3 Applications ............................................................................................................................................... 3 Pin Assignment ......................................................................................................................................... 6 Pin Descriptions ........................................................................................................................................ 6 Block Diagram ........................................................................................................................................... 7 Absolute Maximum Ratings ...................................................................................................................... 8 Recommended Operating Conditions ....................................................................................................... 9 Electrical Characteristics......................................................................................................................... 10 Standard Characteristics......................................................................................................................... 12 Function Explanations............................................................................................................................. 13 11.1 LED Current Control by PSR (Primary Side Regulation) ............................................................... 13 11.2 PFC (Power Factor Correction) Function ....................................................................................... 14 11.3 Dimming Function........................................................................................................................... 14 11.4 Power-On Sequence ...................................................................................................................... 15 11.5 Power-Off Sequence ...................................................................................................................... 16 11.6 IP_PEAK Detection Function .............................................................................................................. 16 11.7 Zero Voltage Switching Function .................................................................................................... 16 11.8 Various Protection Functions ......................................................................................................... 17 12. I/O Pin Equivalent Circuit Diagram ......................................................................................................... 18 13. Application Examples.............................................................................................................................. 20 13.1 50W Isolated and PWM Dimming Application ................................................................................ 20 13.2 5W Non-isolated and Non-Dimming Application ............................................................................ 26 14. Usage Precautions.................................................................................................................................. 31 15. Ordering Information ............................................................................................................................... 32 16. Marking Format ....................................................................................................................................... 33 17. Labeling Sample ..................................................................................................................................... 34 18. Recommended Conditions of Moisture Sensitivity Level ........................................................................ 35 18.1 Recommended Reflow Condition ................................................................................................... 35 18.2 Reflow Profile ................................................................................................................................. 35 18.3 JEDEC Condition............................................................................................................................ 36 18.4 Recommended manual soldering (partial heating method) ........................................................... 36 19. Package Dimensions .............................................................................................................................. 37 20. Major Changes ........................................................................................................................................ 38 Figures Figure 4-1 Pin Assignment .............................................................................................................................. 6 Figure 6-1 Block Diagram (Isolated Flyback application) ................................................................................ 7 Figure 7-1 Power Dissipation .......................................................................................................................... 8 Figure 10-1 Standard Characteristics ........................................................................................................... 12 Figure 11-1 LED Current Control Waveform ................................................................................................. 13 Figure 11-2 Dimming Curve .......................................................................................................................... 14 Figure 11-3 DIM Pin Input Circuit .................................................................................................................. 14 Figure 11-4 VDD Supply Path at Power-On .................................................................................................. 15 Figure 11-5 Power-On Waveform .................................................................................................................. 15 Figure 11-6 Power-Off Waveform .................................................................................................................. 16 Figure 12-1 I/O Pin Equivalent Circuit Diagram ............................................................................................ 18 Figure 13-1 50W EVB Schematic.................................................................................................................. 20 Figure 13-2 50W Reference Data ................................................................................................................. 22 Figure 13-3 5W EVB Schematic.................................................................................................................... 26 Figure 13-4 5W Reference Data ................................................................................................................... 28 4 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t Figure 16-1 Marking Format .......................................................................................................................... 33 Figure 17-1 Labeling Sample ........................................................................................................................ 34 Figure 18-1 Reflow Profile ............................................................................................................................. 35 Figure 19-1 Package Dimensions ................................................................................................................. 37 Tables Table 5-1 Pin Descriptions............................................................................................................................... 6 Table 7-1 Absolute Maximum Rating ............................................................................................................... 8 Table 8-1 Recommended Operating Conditions ............................................................................................. 9 Table 9-1 Electrical Characteristics ............................................................................................................... 10 Table 11-1 Various Protection Functions Table ............................................................................................. 17 Table 13-1 50W BOM List ............................................................................................................................. 21 Table 13-2 5W BOM List ............................................................................................................................... 27 Table 15-1 Ordering Information.................................................................................................................... 32 Table 18-1 Recommended Reflow Condition ................................................................................................ 35 Table 18-2 Recommended manual soldering ................................................................................................ 36 March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 5 D a t a S h e e t 4. Pin Assignment Figure 4-1 Pin Assignment (TOP VIEW) VDD 1 8 DRV TZE 2 7 GND 6 CS COMP 3 5 ADJ DIM 4 (FPT-8P-M02) 5. Pin Descriptions Table 5-1 Pin Descriptions Pin No. Pin Name I/O 1 VDD - Power supply pin. Description 2 TZE I Transformer Zero Energy detecting pin. 3 COMP O External Capacitor connection pin for the compensation. 4 DIM I Dimming control pin. 5 ADJ O Pin for adjusting the switch-on timing. 6 CS I Pin for detecting peak current of transformer primary winding. 7 GND - Ground pin. 8 DRV O External MOSFET gate connection pin. 6 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 6. Block Diagram Figure 6-1 Block Diagram (Isolated Flyback application) March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 7 D a t a S h e e t 7. Absolute Maximum Ratings Table 7-1 Absolute Maximum Rating Rating Parameter Power Supply Voltage Input Voltage Output Voltage Symbol Condition Unit Min Max VVDD VDD pin -0.3 +25 V VCS CS pin -0.3 +6.0 V VTZE TZE pin -0.3 +6.0 V VDIM DIM pin -0.3 +6.0 V VDRV DRV pin -0.3 +25 V IADJ ADJ pin -1 - mA IDRV DRV pin -50 +50 mA PD Ta≤+25°C - 800 (*1) mW -55 +125 °C Output Current Power Dissipation DC level Storage temperature TSTG - ESD Voltage 1 VESDH Human Body Model -2000 +2000 V ESD Voltage 2 VESDM Machine Model -200 +180 V ESD Voltage 3 VESDC Charged Device Model -1000 +1000 V *1: The value when using two layers PCB. Reference: θja (wind speed 0m/s): 125°C/W Figure 7-1 Power Dissipation 1000 Power Dissipation [mW] 900 800 700 600 500 400 300 200 100 0 -50 -25 0 25 50 75 100 125 150 Ta [°C] WARNING: 1. Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. 8 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 8. Recommended Operating Conditions Table 8-1 Recommended Operating Conditions Value Parameter Symbol Condition Unit Min Typ Max 9 - 20 V VDD pin Input Voltage VDD VDD pin DIM pin Input Voltage VDIM DIM pin After UVLO release 0 - 5 V DIM pin Input Current IDIM DIM pin Before UVLO release 0 - 2.5 µA TZE pin Resistance RTZE TZE pin 50 - 200 kΩ ADJ pin Resistance RADJ ADJ pin 9.3 - 185.5 kΩ COMP pin - 4.7 - µF Set between VDD pin and GND pin - 100 - µF -40 - +125 °C COMP pin Capacitance VDD pin Capacitance CCOMP CBP Operating Junction Temperature Tj - WARNING: 1. The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. 2. Any use of semiconductor devices will be under their recommended operating condition. 3. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. 4. No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand. March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 9 D a t a S h e e t 9. Electrical Characteristics Table 9-1 Electrical Characteristics (Ta = +25°C, VVDD = 12V) Parameter Condition VTH VDD VTL VDD ISTART VDD VTZETL Value Unit Typ Max - 12.25 13 13.75 V - 7.55 7.9 8.5 V VVDD =7V - 65 160 µA TZE TZE="H" to "L" - 20 - mV VTZETH TZE TZE="L" to "H" 0.6 0.7 0.8 V VTZECLAMP TZE ITZE=-10µA -200 -160 -100 mV OVP threshold voltage VTZEOVP TZE - 4.15 4.3 4.45 V OVP blanking time tOVPBLANK TZE - 0.6 1 1.7 µs TZE input current ITZE TZE -1 - +1 µA Source current ISO COMP - 27 - µA Trans conductance gm COMP - 96 - µA/V ADJ voltage VADJ ADJ 1.81 1.85 1.89 V ADJ source current IADJ ADJ VADJ=0V 250 450 650 µA ADJ time TADJ TZE TADJ(RADJ=51kΩ) DRV TADJ(RADJ=9.1kΩ) 490 550 610 ns - 6.75 7.5 8.25 µs threshold voltage UVLO Turn-off threshold voltage Startup current Zero energy threshold voltage Zero energy threshold voltage TRANSFORMER Pin Min UVLO Turn-on UVLO Symbol TZE clamp voltage ZERO ENERGY DETECTION COMPENSATION ADJUSTMENT Minimum switching period CURRENT SENSE 10 CONFIDENTIAL TSW VTZE =5V VCOMP=2V, VCS=0V VDIM=1.85V VCOMP=2.5V, VCS=1V - TZE DRV OCP threshold voltage VOCPTH CS - 1.9 2 2.1 V OCP delay time tOCPDLY CS - - 400 500 ns CS input current ICS CS -1 - +1 µA VCS=5V MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t (Ta = +25°C, VVDD = 12V) Parameter Symbol Pin DRV high voltage VDRVH DRV DRV low voltage VDRVL Rise time Fall time Condition Value Unit Min Typ Max VDD=18V, IDRV=-30mA 7.6 9.4 - V DRV VDD=18V, IDRV=30mA - 130 260 mV tRISE DRV VDD=18V, CLOAD=1nF - 94 - ns tFALL DRV VDD=18V, CLOAD=1nF - 16 - ns Minimum on time tONMIN DRV TZE trigger 300 500 700 ns Maximum on time tONMAX DRV - 27 44 60 µs Minimum off time tOFFMIN DRV - 1 1.5 1.93 µs Maximum off time tOFFMAX DRV 270 320 370 µs OTP threshold TOTP - - 150 - °C OTP hysteresis TOTPHYS - - 25 - °C IDIM DIM -0.1 - +0.1 µA VDIMCMPVTH DIM - 135 150 165 mV VDIMCMPHYS DIM - - 70 - mV IVDD(STATIC) VDD - 3 3.6 mA IVDD(OPERATING) VDD - 5.6 - mA DRV OTP DIM input current DIMMING DIMCMP threshold voltage DIMCMP hysteresis POWER SUPPLY CURRENT Power supply current March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL TZE=GND Tj, temperature rising Tj, temperature falling, degrees below TOTP VDIM=5V VVDD=20V, VTZE=1V VVDD=20V, Qg=20nC, fSW=133kHz 11 D a t a S h e e t 10. Standard Characteristics Figure 10-1 Standard Characteristics 12 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 11. Function Explanations 11.1 LED Current Control by PSR (Primary Side Regulation) MB39C604 regulates the average LED current (ILED) by feeding back the information based on Primary Winding peak current (IP_PEAK) and Secondary Winding energy discharge time (TDIS) and switching period. Figure 11-1 shows the operating waveform in a steady state. IP is Primary Winding current and IS is Secondary Winding current. ILED as an average current of the Secondary Winding is expressed by the following calculation. ILED = TDIS 1 × IS_PEAK × 2 TSW Using Primary Winding peak current (IP_PEAK) and the turns ratio (NP/NS) with Primary Winding turns (NP) and Secondary Winding turns (NS), Secondary Winding peak current (IS_PEAK) is expressed by the following calculation. IS_PEAK = NP × IP_PEAK NS Therefore, ILED is expressed by the following calculation. ILED= TDIS 1 NP × ×IP_PEAK× 2 NS TSW MB39C604 regulates ILED, by detecting TDIS and TSW by TZE pin and detecting IP_PEAK by CS pin. In addition, using Primary Winding inductance of transformer (LP) and switching on time (TON), IP_PEAK is expressed by the following calculation. IP_PEAK= VBULK × TON LP Namely, MB39C604 regulates IP_PEAK by controlling TON based on a detection result, and so regulates ILED. Figure 11-1 LED Current Control Waveform March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 13 D a t a S h e e t 11.2 PFC (Power Factor Correction) Function TON in a steady state is generated by comparing the voltage of COMP pin with internal sawtooth waveform. (refer to Figure 6-1) The voltage of COMP pin is generated by the information of TDIS and TSW and IP_PEAK. TON almost becomes the constant value, because the voltage of COMP pin gradually changes by capacitor connected to COMP pin between GND pin. Therefore, IP_PEAK almost is proportional to the voltage of AC Line (VBULK). (reference 11.1) Therefore, it can bring the phase differences between the input voltage and the input current close to zero, and so high Power Factor can be realized. Please usually connect the capacitor of 4.7µF to COMP pin. 11.3 Dimming Function MB39C604 has the dimmable circuit built-in and controls ILED by changing a reference of ERRAMP of the PSR block based on the input voltage level of DIM pin and realized dimming. Figure 11-2 shows ILED dimming ratio based on the input voltage level of DIM pin. Figure 11-3 shows the input configuration of DIM pin in PWM dimming. It is possible to configurate PWM dimmable system by inputting the voltage that smoothed PWM signal into DIM pin. Figure 11-2 Dimming Curve Figure 11-3 DIM Pin Input Circuit 110% 100% 90% 80% ILED ratio 70% 60% 50% 40% 30% 20% 10% 0% 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VDIM [V] 14 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 11.4 Power-On Sequence When the AC line voltage is supplied, the voltage is supplyed to VBULK through a diode bridge and supplies the current to VDD pin through source-follower of external BiasMOS. When VDD pin is charged and the voltage of VDD pin becomes more than the UVLO threshold voltage, the internal Bias circuit starts operating, and starts the dimming control. The hi-charging starts after UVLO release, and switching starts. In addition, MB39C604 becomes the forced switching mode at that time. (TON=1.5µs, TOFF=78µs to 320µs) When the voltage of TZE pin becomes more than the threshold voltage (VTZETH=0.7V) , MB39C604 becomes the normal operation mode. After the switching begins, the voltage of VDD pin is supplied through the external diode from Auxiliary Winding. In addition, the voltage of Auxiliary Winding is decided by the turns ratio with Auxiliary Winding turns and Secondary Winding turns, and the voltage of Secondary Winding. Therefore, the voltage of VDD pin is not supplied from Auxiliary Winding, until the voltage of Auxiliary Winding becomes more than the voltage of VDD pin. In addition, the voltage of VDD pin is not supplied through BiasMOS, because VBULK is low at the zero cross point of the AC line voltage. In this period, it is necessary to set the capacitor of the VDD pin to prevent the voltage of the VDD pin from falling below the threshold voltage of UVLO. The external diode between BiasMOS and VDD pin is used to prevent discharge from VDD pin to VBULK at zero cross point of the AC line voltage. Figure 11-4 VDD Supply Path at Power-On Figure 11-5 Power-On Waveform VBULK UVLO Vth = 13V VDD Force switching (TON=1.5us/TOFF=78us～320us) Normal switching Switching start DRV VLED VTZETH = 0.7V TZE March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 15 D a t a S h e e t 11.5 Power-Off Sequence When the AC line voltage is released, VBULK is discharged by switching operation. At that time, ILED is supplied from the output capacitor only and decreases gradually, because the current is not supplied to Secondary Winding. The voltage of VDD pin decreases, because the current supply to VDD pin becomes without Auxiliary Winding, both source-follower. When the voltage of VDD pin becomes less than the UVLO threshold voltage, MB39C604 becomes shutdown. Figure 11-6 Power-Off Waveform VAC release VBULK UVLO Vth = 7.9V VDD Shutdown DRV VLED 11.6 IP_PEAK Detection Function This function detects Primary Winding peak current (IP_PEAK) of Transformer. ILED is set by connecting resistance (Rcs) to CS pin between GND pin. Maximum IP_PEAK (IP_PEAKMAX) at the time of the Over Current Protection (OCP) is set at the same time, too. Using the turns ratio (NP/NS) with Primary Winding turns (NP) and Secondary Winding turns (NS), and ILED, RCS is expressed by the following calculation. RCS= NP 0.14 × NS ILED In addition, using the OCP threshold voltage (VOCPTH) and the sense resistance (RCS), IP_PEAKMAX is expressed by the following calculation. IP_PEAKMAX = VOCPTH RCS 11.7 Zero Voltage Switching Function MB39C604 has zero voltage switching function built-in to minimize a switching loss of the external switching MOSFET. The following functions are necessary to realize zero voltage switching. (1) Detect that the energy of the transformer becomes zero (2) Let a driver turn on at the lowest point of the energy ringing of transformer (1) is possible to detect by TZE pin through resistance connected Auxiliary Winding of transformer. (2) is possible to realize by adjustment on on-timing of switching MOSFET and adjustment on detection of the Secondary side current-releasing time. Adjustment time (tADJ) is set by connecting resistance (RADJ) to ADJ pin between GND pin. Using Primary Winding inductance (LP), and the parasitic capacitor of switching MOSFET drain (CD), tADJ is expressed by the following calculation. tADJ = π LP × CD 2 Using tADJ, RADJ is expressed by the following calculation. RDLY [kΩ] = 0.092 × tADJ [ns] - 3.85 16 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 11.8 Various Protection Functions Under Voltage Lockout Protection (UVLO) The under voltage lockout protection (UVLO) protects IC from malfunction and protects the system from destruction/deterioration during the transient state and momentary drop due to start up for the power supply pin voltage (VDD). The voltage decrease of the VDD pin is detected with comparator, and the voltage of DRV pin is turned to “L”, and the switching is stopped. The system automatically returns to the normal operation mode when the voltage of VDD pin becomes more than the UVLO threshold voltage. Over Voltage Protection (OVP) The over voltage protection (OVP) protects parts of Secondary side from an excessive stress voltage by the rising of the output voltage, when the LED dropout. The output overvoltage is detected by TZE pin. When current of Secondary side is supplied, output voltage appears to TZE pin that is the voltage division of Auxiliary Winding. When the voltage of TZE pin rise more than the threshold of the over voltage detecting circuit and the period passes more than three switching cycles, the voltage of DRV pin is turned to “L”, and the switching is stopped (latch off). A latch is removed, when the voltage of VDD pin becomes less than the UVLO threshold voltage. Over Current Protection (OCP) The over current protection (OCP) protects IC from the saturation of the inductor and the transformer. The drain current of the external switching MOSFET is limited by using OCP. When the voltage of CS pin becomes more than the OCP threshold voltage, the voltage of DRV pin is turned to “L”, and the switching is stopped. When TZE pin detects Zero energy again, DRV pin is turned to “H” and the next switching cycle begin. Short Circuit Protection (SCP) The short circuit protection (SCP) protects the transformer and the diode of Secondary side from an excessive current stress. When the Output voltage decreases by a short circuit of the LED and the voltage of TZE pin does not become more than the SCP threshold voltage, the voltage of COMP pin is discharged to 1.5V and the switching cycle shifts to a low frequency mode.(TON=1.5µs /TOFF=78µs to 320µs) Over Temperature Protection (OTP) The over temperature protection (OTP) protects IC from the thermal destruction. When the junction temperature reaches +150°C, DRV pin voltage is turned to “L”, and the switching is stopped. It automatically returns to the normal operation mode when the junction temperature becomes below +125°C. Table 11-1 Various Protection Functions Table Function Normal Operation Under Voltage Lockout Protection (UVLO) - - - L VDD < 7.9V VDD > 13V Auto Restart Active TZE > 4.2V Active CS > 2V Cycle by cycle Auto Restart Active TZE (peak) < 0.7V TZE (peak) > 0.7V Auto Restart Active Tj > +150°C Tj < +125°C Auto Restart Active Active L L Over Current Protection (OCP) L Short Circuit Protection (SCP) Active L March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL Active ADJ L (OTP) Return Condition COMP Over Voltage Protection (OVP) Over Temperature Protection Detection Condition at Protected Operation DRV 1.5V fixation Active 1.5V fixation 1.5V fixation VDD < 7.9V → VDD > 13V Remarks Latch off 17 D a t a S h e e t 12. I/O Pin Equivalent Circuit Diagram Figure 12-1 I/O Pin Equivalent Circuit Diagram Pin No. Pin Name 2 TZE 3 COMP 4 DIM 5 ADJ 18 CONFIDENTIAL Equivalent Circuit Diagram MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t Pin No. Pin Name 6 CS 8 DRV March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL Equivalent Circuit Diagram 19 D a t a S h e e t 13. Application Examples 13.1 50W Isolated and PWM Dimming Application Input: AC85VRMS to 265VRMS, Output: 1.5A/27V to 36V Figure 13-1 50W EVB Schematic 20 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t Table 13-1 50W BOM List No COMPONENT DESCRIPTION PART No. VENDOR MB39C604 Spansion MOSFET, N-channel, 800V, 5.5A, TO-220F FQPF8N80C Fairchild MOSFET, N-channel, 600V, 2.8A, TO-251 FQU5N60C Fairchild 1 M1 Driver IC for LED Lighting, SO-8 2 Q1 3 Q2 4 BR1 Bridge rectifier, 3A, 600V, GBU-4L 5 D2 Diode, ultra fast rectifier, 10A, 200V, TO-220F 6 D3 Diode, fast rectifier, 1A, 800V, DO-41 7 D5 Diode, 200mA, 200V, SOT-23 MMBD1404 Fairchild 8 ZD1 Diode, Zener, 20V, 500mW, SOD-123 MMSZ20T1G ON Semiconductor 9 ZD2 Diode, Zener, 18V, 500mW, SOD-123 MMSZ18T1G ON Semiconductor 10 T1 Transformer, 200μH, Np/Ns=3.5/1 Np/Na=7/1 11 L1 Common mode choke, 47.0mH 12 L3 Inductor, 1.0mH, 0.65A, 0.9Ω, 12.5ϕ × 16.0 RCH1216BNP-102K Sumida 13 C1 Capacitor, X2, 305VAC, 0.1μF B32921C3104M EPCOS 14 C2 Capacitor, polyester film, 220nF, 400V, 18.5 × 5.9 ECQ-E4224KF Panasonic 15 C3,C4 Capacitor, ceramic, 10μF, 50V, X7S, 1210 C3225X7S1H106K250AB TDK 16 C5,C6,C7 Capacitor, aluminum electrolytic, 470μF 50V, 10.0ϕ × 20 EKMG500ELL471MJ20S NIPPON-CHEMI-CON 17 C8 Capacitor, ceramic, 33nF, 250V, 1206 C3216X7R2E333K160AA TDK 18 C9 Capacitor, ceramic, 2.2nF, X1/Y1 radial DE1E3KX222M muRata 19 C12,C16 Capacitor, ceramic, 0.1μF, 25V, 0603 - - 20 C13 Capacitor, aluminum, 47μF, 25V - - 21 C14 Capacitor, ceramic, 4.7μF, 16V, 0805 - - 22 R1 Resistor, chip, 1.00MΩ, 1/4W, 1206 - - 23 R3,R21 Resistor, 100kΩ, 2W - - 24 R4 Resistor, chip, 68kΩ, 1/10W, 0603 - - 25 R5 Resistor, chip, 1.0MΩ, 1/10W, 0603 - - 26 R7 Resistor, chip, 10Ω, 1/8W, 0805 - - 27 R8 Resistor, chip, 22Ω, 1/10W, 0603 - - 28 R9 Resistor, chip, 91kΩ, 1/10W, 0603 - - 29 R10 Resistor, chip, 24kΩ, 1/10W, 0603 - - 30 R13 Resistor, chip, 27kΩ, 1/10W, 0603 - - 31 R14,R22 Resistor, chip, 0.68Ω, 1/4W, 1206 - - 32 R15 Resistor, chip, 30kΩ, 1/10W, 0603 - - 33 R20 Resistor, chip, 100kΩ, 1/10W, 0603 - - 34 VR1 Varistor, 275VAC, 7mm DISK ERZ-V07D431 Panasonic 35 F1 Fuse, 2A, 300VAC 3691200000 Littelfuse Spansion : Spansion, Inc Fairchild : Fairchild Semiconductor International, lnc On Semiconductor : ON Semiconductor Sumida : SUMIDA CORPORATION EPCOS : EPCOS AG Panasonic : Panasonic Corporation TDK : TDK Corporation NIPPON-CHEMI-CON : Nippon Chemi-Con Corporation muRata : Murata Manufacturing Co., Ltd. Littelfuse : Littelfuse Inc March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL GBU4J Fairchild FFPF10UP20S Fairchild UF4006 Fairchild PQ-2625 - LF2429NP-T473 Sumida 21 D a t a S h e e t Figure 13-2 50W Reference Data Power Factor VDIM=3.3V, LED: OSW4XAHDE1E Efficiency VDIM=3.3V, LED: OSW4XAHDE1E 1.00 95.0% 0.95 90.0% 0.90 85.0% 0.85 Efficiency [%] 100.0% PF 80.0% 75.0% 0.75 70.0% 0.70 50Hz 65.0% 60.0% 0.80 60Hz 80 120 50Hz 0.65 160 200 240 0.60 280 60Hz 80 120 VIN [VRMS] 240 280 34 36 Load Regulation VDIM=3.3V 1700 1700 1650 1650 1600 1600 1550 1550 IOUT [mA] IOUT [mA] 200 VIN [VRMS] Line Regulation VDIM=3.3V, LED: OSW4XAHDE1E 1500 1450 1500 1450 1400 1400 220V/50Hz 50Hz 1350 1300 160 1350 60Hz 80 120 160 200 VIN [VRMS] 22 CONFIDENTIAL 240 280 1300 100V/60H 26 28 30 32 VOUT [V] MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t Output Ripple Waveform Switching Waveform VIN=100VRMS / 60Hz VIN=100VRMS / 60Hz VDIM=3.3V, LED:OSW4XAHDE1E VBULK(BR1+) VDIM=3.3V, LED:OSW4XAHDE1E VSW(Q1 Drain) VOUT IOUT IOUT Turn-On Waveform VIN=100VRMS / 60Hz VDIM=3.3V, LED:OSW4XAHDE1E Turn-Off Waveform VIN=100VRMS / 60Hz VDIM=3.3V, LED:OSW4XAHDE1E VBULK(BR1+) VBULK(BR1+) VDD(M1 VDD) VDD(M1 VDD) VOUT VOUT IOUT March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL IOUT 23 D a t a S h e e t Output Ripple Waveform Switching Waveform VIN=220VRMS / 50Hz VIN=220VRMS / 50Hz VDIM=3.3V, LED:OSW4XAHDE1E VDIM=3.3V, LED:OSW4XAHDE1E VBULK(BR1+) VSW(Q1 Drain) VOUT IOUT IOUT Turn-On Waveform VIN=220VRMS / 50Hz VDIM=3.3V, LED:OSW4XAHDE1E Turn-Off Waveform VIN=220VRMS / 50Hz VDIM=3.3V, LED:OSW4XAHDE1E VBULK(BR1+) VBULK(BR1+) VDD(M1 VDD) VDD(M1 VDD) VOUT VOUT IOUT 24 CONFIDENTIAL IOUT MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t Dimming Curve VIN=100VRMS / 60Hz LED: OSW4XAHDE1E Dimming Curve VIN=220VRMS / 50Hz LED: OSW4XAHDE1E Total Harmonic Distortion (THD) VDIM=3.3V, LED: OSW4XAHDE1E March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 25 D a t a S h e e t 13.2 5W Non-isolated and Non-Dimming Application Input: AC85VRMS to 145VRMS, Output: 70mA/67V to 82V Figure 13-3 5W EVB Schematic 26 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t Table 13-2 5W BOM List No PART No. VENDOR 1 M1 COMPONENT Driver IC for LED Lighting, SO-8 DESCRIPTION MB39C604 Spansion 2 Q1 MOSFET, N-channel, 600V, 2.8A, TO-251 FQU5N60C Fairchild 3 BR1 Bridge rectifier, 1A, 600V, Micro-DIP MDB6S Fairchild 4 D1 Diode, ultra fast rectifier, 1A, 600V, SMA ES1J Fairchild 5 D2 Diode, 200mA, 200V, SOT-23 6 ZD1 Diode, Zener, 18V, 500mW, SOD-123 7 T1 Transformer, Lp= 430µH, Np/Na=5.33/1 8 L1 Inductor 470µH 0.31A ϕ7.2mm × 10.5mm 9 C1 Capacitor, polyester film, 100nF, 630V, 18.5 × 6.3 10 C2 Capacitor, polyester film, 100nF, 250V, 7.9 × 5.9 11 C3 Capacitor, aluminum electrolytic, 100µF 100V, 10.0ϕ × 20 12 C4 13 C5 14 MMBD1404 Fairchild MMSZ18T1G ON Semiconductor EE808 - 22R474C muRata ECQ-E6104KF Panasonic ECQE2104KB Panasonic EKMG101ELL101MJ20S NIPPON-CHEMI-CON Capacitor, ceramic, 0.1µF, 25V, 0603 - - Capacitor, aluminum, 47µF, 25V - - C6 Capacitor, ceramic, 4.7µF, 16V, 0805 - - 15 C7 Capacitor, ceramic, 0.1µF, 25V, 0603 - - 16 R1 Resistor, 510Ω, 1/2W - - 17 R2 Resistor, chip, 10Ω, 1/8W, 0805 - - 18 R3 Resistor, chip, 110kΩ, 1/10W, 0603 - - 19 R4 Resistor, chip, 30kΩ, 1/10W, 0603 - - 20 R5 Resistor, chip, 22kΩ, 1/10W, 0603 - - 21 R6 Resistor, 2Ω, 1W - - 22 R7 Resistor, chip, 100kΩ, 1/10W, 0603 - - 23 R8 Resistor, 47kΩ, 2W - - Spansion : Spansion,Inc Fairchild : Fairchild Semiconductor International, lnc On Semiconductor : ON Semiconductor Panasonic : Panasonic Corporation NIPPON-CHEMI-CON : Nippon Chemi-Con Corporation muRata : Murata Manufacturing Co., Ltd. March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 27 D a t a S h e e t Figure 13-4 5W Reference Data Power Factor LED:27pcs in series Efficiency LED: 27pcs in series 1.00 95.0% 0.95 90.0% 0.90 85.0% 0.85 Efficiency [%] 100.0% PF 80.0% 75.0% 0.75 70.0% 0.70 50Hz 65.0% 60.0% 0.80 60Hz 80 90 100 50Hz 0.65 110 120 130 140 0.60 150 60Hz 80 90 100 VIN [VRMS] 130 140 150 Load Regulation VIN=100VRMS 90 80 85 70 80 60 75 50 IOUT [mA] IOUT [mA] 120 VIN [VRMS] Line Regulation LED: 27pcs in series 70 65 40 30 20 60 50Hz 55 50 110 80 90 100 110 120 VIN [VRMS] 28 CONFIDENTIAL 50Hz 10 60Hz 130 140 150 0 60Hz 65 70 75 80 85 VOUT [V] MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t Output Ripple Waveform Switching Waveform VIN=100VRMS / 50Hz VIN=100VRMS / 50Hz LED:27pcs in series LED:27pcs in series VBULK(BR1+) VSW(Q1 Drain) VOUT IOUT IOUT Turn-On Waveform VIN=100VRMS / 50Hz LED:27pcs in series Turn-Off Waveform VIN=100VRMS / 50Hz LED:27pcs in series VBULK(BR1+) VBULK(BR1+) VDD(M1 VDD) VDD(M1 VDD) VOUT VOUT IOUT March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL IOUT 29 D a t a S h e e t Total Harmonic Distortion (THD) LED: 27pcs in series 20 18 16 14 THD [%] 12 10 8 6 4 50Hz 2 0 60Hz 80 90 100 110 120 130 140 150 VIN [VRMS] 30 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 14. Usage Precautions Do not configure the IC over the maximum ratings. If the IC is used over the maximum ratings, the LSI may be permanently damaged. It is preferable for the device to normally operate within the recommended usage conditions. Usage outside of these conditions can have an adverse effect on the reliability of the LSI. Use the device within the recommended operating conditions. The recommended values guarantee the normal LSI operation under the recommended operating conditions. The electrical ratings are guaranteed when the device is used within the recommended operating conditions and under the conditions stated for each item. Printed circuit board ground lines should be set up with consideration for common impedance. Take appropriate measures against static electricity. Containers for semiconductor materials should have anti-static protection or be made of conductive material. After mounting, printed circuit boards should be stored and shipped in conductive bags or containers. Work platforms, tools, and instruments should be properly grounded. Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in serial between body and ground. Do not apply negative voltages. The use of negative voltages below - 0.3 V may make the parasitic transistor activated to the LSI, and can cause malfunctions. March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 31 D a t a S h e e t 15. Ordering Information Table 15-1 Ordering Information Part Number MB39C604PNF 32 CONFIDENTIAL Package 8-pin plastic SOP (FPT-8P-M02) MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 16. Marking Format Figure 16-1 Marking Format INDEX March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL Lead-free version 33 D a t a S h e e t 17. Labeling Sample Figure 17-1 Labeling Sample Lead-free mark JEITA logo JEDEC logo The part number of a lead-free product has The trailing characters “E1”. 34 CONFIDENTIAL “ASSEMBLED IN CHINA” is printed on the label of a product assembled in China. MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 18. Recommended Conditions of Moisture Sensitivity Level 18.1 Recommended Reflow Condition Table 18-1 Recommended Reflow Condition Item Condition Mounting Method IR (infrared reflow), warm air reflow Mounting times 2 times Before opening Please use it within 2 years after manufacture. From opening to the 2nd reflow Less than 8 days Storage period Please process within 8 days after baking When the storage period after opening was exceeded (125°C±3°C, 24H+2H/-0H). Baking can be performed up to 2 times. Storage conditions 5°C to 30°C, 70% RH or less (the lowest possible humidity) 18.2 Reflow Profile Figure 18-1 Reflow Profile 260°C 255°C 170 °C to 190 °C (b) RT (c) (a) (d) (e) (d') H rank : 260°C Max (a) Temperature Increase gradient : Average 1°C/s to 4°C/s (b) Preliminary Heating : Temperature 170°C to 190°C, 60s to 180s (c) Temperature Increase gradient : Average 1°C/s to 4°C/s (d) Peak Temperature : Temperature 260°C Max. (d’) Main Heating : Temperature Temperature Temperature (e) Cooling : 255°C or more, 10s or less 230°C or more, 40s or less or 225°C or more, 60s or less or 220°C or more, 80s or less Natural cooling or forced cooling Note : Temperature : the top of the package body March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 35 D a t a S h e e t 18.3 JEDEC Condition Moisture Sensitivity Level3 (IPC/JEDEC J-STD-020D) 18.4 Recommended manual soldering (partial heating method) Table 18-2 Recommended manual soldering Item Condition Before opening Storage period Within 2 years after manufacture Within 2 years after manufacture Between opening and mounting (No need to control moisture during the storage period because of the partial heating method.) Storage conditions Mounting conditions 5°C to 30°C, 70%RH or less (the lowest possible humidity) Temperature at the tip of a soldering iron : 400°C Max. Time : 5 seconds or below per pin (*1) *1: Make sure that the tip of a soldering iron does not come in contact with the package body. 36 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t 19. Package Dimensions Figure 19-1 Package Dimensions Please check the latest package dimension at the following URL. http://edevice.fujitsu.com/package/jp-search/ March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 37 D a t a S h e e t 20. Major Changes Page Section Change Results Revision 1.0 - 38 CONFIDENTIAL - Initial release MB39C604-DS405-00016-1v0-E, March 6, 2014 D a t a S h e e t March 6, 2014, MB39C604-DS405-00016-1v0-E CONFIDENTIAL 39 D a t a S h e e t Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2014 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. 40 CONFIDENTIAL MB39C604-DS405-00016-1v0-E, March 6, 2014