Reliability Report

AOS Semiconductor
Product Reliability Report
AOT292L,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOT292L. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOT292L passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
routine monitored for continuously improving the product quality.
I. Reliability Stress Test Summary and Results
Total
Sample
Size
Number
of
Failures
Reference
Standard
924 pcs
0
JESD22-A108
924 pcs
0
JESD22-A108
96 hours
924 pcs
0
JESD22-A110
1000 hours
924 pcs
0
JESD22-A101
96 hours
924 pcs
0
JESD22-A102
1000 cycles
924 pcs
0
JESD22-A104
Temp = 150°C
1000 hours
924 pcs
0
JESD22-A103
Tj = 100°C
3.5min on/3.5min off 
8572 cycles
924 pcs
0
AEC Q101
Test Item
HTGB
HTRB
HAST
H3TRB
Autoclave
Temperature
Cycle
HTSL
Power Cycling
Test Condition
Time Point
Temp = 150°C ,
Vgs=100% of Vgsmax
Temp = 150°C ,
Vds=80% of Vdsmax
130°C , 85%RH,
33.3 psia,
Vds = 80% of Vdsmax
up to 42V
85°C , 85%RH,
Vds = 80% of Vdsmax
up to 100V
121°C , 29.7psia,
RH=100%
-65°C to 150°C ,
air to air,
168 / 500 /
1000 hours
168 / 500 /
1000 hours
Resistance to
Temp = 260°C
10 seconds
30 pcs
0
JESD22-B106
Solder Heat
Note: The reliability data presents total of available generic data up to the published date.
II. Reliability Evaluation
FIT rate (per billion): 3.43
MTTF = 33270 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
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9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 3.43
9
MTTF = 10 / FIT = 33270 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
130 deg C
150 deg C
2.59
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