TAI-SAW TECHNOLOGY CO., LTD. 3.2x1.5 32.768KHz Crystal Unit MODEL NO.: TZ2754A REV. NO.: 2.0 Revise: Rev. Rev. Page Rev. Account Date 1 2 N/A P4 Initial release Change Marking 05/22/13’ N/A Ginger Huang 06/06/13’ ECN-201300203 Ginger Huang TAI-SAW TECHNOLOGY CO., LTD. Ref. No. Reviser TST DCC Release document 2 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: [email protected] Web: www.taisaw.com SMD 3.2x1.5 32.768KHz Crystal Unit MODEL NO.: TZ2754A REV. NO.: 2.0 Features: RoHS Compliant Lead free Lead-free soldering z z z z Ceramic Seam Weld Package Excellent Reliability Performance Ultra Miniature Package Available to Surface Mount Technology and IR Reflow Process Description and Applications: Surface mount 3.2mmx1.5mm crystal unit for use in communications devices,. Electrical Specifications: TZ2754A Specification Nominal Frequency 32.768000 KHz Operating Temperature Range -40°C to +85°C Turnover Temperature 25 +/- 5 °C Parabolic Curvature Constant -0.04 ppm / ℃2 max. Frequency Make Tolerance (FL) +/-30 ppm @ 25°C +/- 2°C Equivalent Series Resistor (ESR) 70 kΩ max. Drive Level 1.0 uW max. Load Capacitance (CL) 12.5 pF Shunt Capacitance (Co) 2.0 pF max ; 0.9 pF typ. Aging +/-3.0 ppm/year @25°C Marking Laser marking Insulation Resistance 500M Ω min at DC 100V TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 Mechanical Dimensions (mm): Marking: TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 Tape / Reel and Packing: TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 Certificate of Conformance Vendor shall submit a Certificate of Conformance with each manufacturing lot in each shipment stating that the requirements of this specification have been met. TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 Required Information in Certificate of Conformance 1 Supplier Name 5 MSEI Part Number 2 Supplier Part Number 6 MSEI Part Revision Number 3 Supplier Lot Number or Date Code 7 Quantity 4 MSEI Purchase Order 8 Supplier Quality Representative Signature Labeling requirements Each reel, container, component carrier, waffle pack, JEDEC tray, or sealed conductive bag shall have a label affixed that contains, at a minimum, the data listed in the following table. Required Information in Labeling 1 Supplier Part Number, or MSEI Part Number if defined as a custom device 2 Supplier Lot Number, Date Code, or the Wafer Lot and Wafer Number if defined as customer lot 3 Quantity Reflow Profile: 300 Reflow Area Rising Area Temperature (deg C) 250 Preheat Area Forced Cooling Area 200 150 100 Max peak temperature: 260 deg C 50 0 0 60 120 180 240 300 360 Time (seconds) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7 Reliability Specifications Test name Test process / method Reference standard Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260°C /10sec ×3 times Total time : 4min.(IR-reflow) EIAJED-4701 Vibration 20g ,10-2000Hz Mechanical Shock Test Condition F , 5000g , 0.3 msec , 1/2 sinewave MIL-STD 202G method 213B Solderability Solder Temperature:265±5°C Duration time: 5±0.5 seconds. -300(301)M(II) MIL-STD 202G method 204D MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Heat cycle conditions -55 ℃ (30min) ←→ * cycle time : 50 times 125 ℃ (30min) Hermeticity test 8 bar He25°C for 168 hrs Humidity test Temperature : 70 ± 2 °C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 ± 2 °C Duration : 168 hours Dry heat ( Aging test ) PCT test 2 MIL-STD 202G method 107G MIL-STD 202F method 103B 5 Pressure: 2.06kg/cm (2.03*10 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration : 24 hours TAI-SAW TECHNOLOGY CO., LTD. MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A TST DCC Release document 8